JPH0548939B2 - - Google Patents
Info
- Publication number
- JPH0548939B2 JPH0548939B2 JP7878286A JP7878286A JPH0548939B2 JP H0548939 B2 JPH0548939 B2 JP H0548939B2 JP 7878286 A JP7878286 A JP 7878286A JP 7878286 A JP7878286 A JP 7878286A JP H0548939 B2 JPH0548939 B2 JP H0548939B2
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- lead frame
- sub
- buffer
- magazine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000008188 pellet Substances 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 20
- 239000011295 pitch Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 37
- 230000008569 process Effects 0.000 description 32
- 238000012545 processing Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 8
- 238000013507 mapping Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7878286A JPS62235742A (ja) | 1986-04-06 | 1986-04-06 | 半導体装置の組立装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7878286A JPS62235742A (ja) | 1986-04-06 | 1986-04-06 | 半導体装置の組立装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62235742A JPS62235742A (ja) | 1987-10-15 |
| JPH0548939B2 true JPH0548939B2 (ko) | 1993-07-22 |
Family
ID=13671456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7878286A Granted JPS62235742A (ja) | 1986-04-06 | 1986-04-06 | 半導体装置の組立装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62235742A (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3063046B2 (ja) * | 1992-05-19 | 2000-07-12 | 株式会社新川 | 板状部材の搬送装置 |
-
1986
- 1986-04-06 JP JP7878286A patent/JPS62235742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62235742A (ja) | 1987-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3542365B2 (ja) | 汎用リード加工機 | |
| KR100215937B1 (ko) | 반도체의 리드프레임을 가공하는 장치 | |
| JPH0548939B2 (ko) | ||
| KR100675466B1 (ko) | 수지봉지 성형장치 | |
| JPH05152352A (ja) | Ｔｏ−２２０半導体製造機のリード・フレーム自動供給装置 | |
| JPH042485B2 (ko) | ||
| JP3304569B2 (ja) | 排出シュータ付き搬送レール機構 | |
| JP4370041B2 (ja) | 樹脂タブレット供給装置及び樹脂封止装置 | |
| KR200286751Y1 (ko) | 반도체패키지 제조 장비의 트레이 공급장치 | |
| JP2520508Y2 (ja) | 部品整列装置 | |
| KR200233211Y1 (ko) | 반도체 포장용 열가소성수지 캐리어로의 열가소성수지자동 적재 장치 | |
| JP3332519B2 (ja) | リード加工機のピックアップ機構 | |
| US20010051086A1 (en) | Automated feed mechanism for electronic components of silicon wafer | |
| JPS61166439A (ja) | プレス成形装置における成形素材の供給装置 | |
| JPH09136718A (ja) | パレット出し入れ装置 | |
| JPH09249902A (ja) | 圧粉体搬送装置 | |
| KR100506518B1 (ko) | 간지 급지장치 | |
| JP3880170B2 (ja) | 半導体装置切断収納装置 | |
| JP3034545U (ja) | ねじ自動転造機 | |
| JPH09136713A (ja) | 物品移載装置 | |
| JP2590488B2 (ja) | リ−ドフレ−ム搬送装置 | |
| JP2640341B2 (ja) | 搬送装置 | |
| CN114899129A (zh) | 一种半导体集成电路封装件成型设备及其处理方法 | |
| JPH0614910Y2 (ja) | プレス製品の自動排出装置 | |
| JPS5994427A (ja) | 半導体製造装置 |