JPH0548141Y2 - - Google Patents
Info
- Publication number
- JPH0548141Y2 JPH0548141Y2 JP1985061128U JP6112885U JPH0548141Y2 JP H0548141 Y2 JPH0548141 Y2 JP H0548141Y2 JP 1985061128 U JP1985061128 U JP 1985061128U JP 6112885 U JP6112885 U JP 6112885U JP H0548141 Y2 JPH0548141 Y2 JP H0548141Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- insulating plate
- board
- replacement
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 claims description 50
- 229920001971 elastomer Polymers 0.000 claims description 23
- 239000000523 sample Substances 0.000 claims description 23
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985061128U JPH0548141Y2 (US20020167097A1-20021114-C00005.png) | 1985-04-25 | 1985-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985061128U JPH0548141Y2 (US20020167097A1-20021114-C00005.png) | 1985-04-25 | 1985-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61178482U JPS61178482U (US20020167097A1-20021114-C00005.png) | 1986-11-07 |
| JPH0548141Y2 true JPH0548141Y2 (US20020167097A1-20021114-C00005.png) | 1993-12-20 |
Family
ID=30589116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985061128U Expired - Lifetime JPH0548141Y2 (US20020167097A1-20021114-C00005.png) | 1985-04-25 | 1985-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0548141Y2 (US20020167097A1-20021114-C00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8011933B2 (en) | 2009-05-22 | 2011-09-06 | Yamaichi Electronics Co., Ltd. | Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737471B2 (US20020167097A1-20021114-C00005.png) * | 1977-12-09 | 1982-08-10 | ||
| JPS6064271A (ja) * | 1983-09-19 | 1985-04-12 | Usac Electronics Ind Co Ltd | カ−ドテスタ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737471U (US20020167097A1-20021114-C00005.png) * | 1980-08-14 | 1982-02-27 | ||
| JPS58114775U (ja) * | 1982-01-30 | 1983-08-05 | 日本電子材料株式会社 | プロ−ブカ−ド |
-
1985
- 1985-04-25 JP JP1985061128U patent/JPH0548141Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737471B2 (US20020167097A1-20021114-C00005.png) * | 1977-12-09 | 1982-08-10 | ||
| JPS6064271A (ja) * | 1983-09-19 | 1985-04-12 | Usac Electronics Ind Co Ltd | カ−ドテスタ |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8011933B2 (en) | 2009-05-22 | 2011-09-06 | Yamaichi Electronics Co., Ltd. | Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61178482U (US20020167097A1-20021114-C00005.png) | 1986-11-07 |
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