JPH0547608B2 - - Google Patents

Info

Publication number
JPH0547608B2
JPH0547608B2 JP59172449A JP17244984A JPH0547608B2 JP H0547608 B2 JPH0547608 B2 JP H0547608B2 JP 59172449 A JP59172449 A JP 59172449A JP 17244984 A JP17244984 A JP 17244984A JP H0547608 B2 JPH0547608 B2 JP H0547608B2
Authority
JP
Japan
Prior art keywords
elements
wire
weight
kinds
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59172449A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6152332A (ja
Inventor
Shigemi Yamane
Koichiro Atsumi
Tetsuo Ando
Noriaki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59172449A priority Critical patent/JPS6152332A/ja
Publication of JPS6152332A publication Critical patent/JPS6152332A/ja
Publication of JPH0547608B2 publication Critical patent/JPH0547608B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
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Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP59172449A 1984-08-21 1984-08-21 ボンデイングワイヤ− Granted JPS6152332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59172449A JPS6152332A (ja) 1984-08-21 1984-08-21 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59172449A JPS6152332A (ja) 1984-08-21 1984-08-21 ボンデイングワイヤ−

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6179653A Division JP2501306B2 (ja) 1994-07-08 1994-07-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS6152332A JPS6152332A (ja) 1986-03-15
JPH0547608B2 true JPH0547608B2 (ko) 1993-07-19

Family

ID=15942188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59172449A Granted JPS6152332A (ja) 1984-08-21 1984-08-21 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6152332A (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS63171841A (ja) * 1988-01-11 1988-07-15 Furukawa Electric Co Ltd:The 電子機器用銅合金
JPH01188641A (ja) * 1988-01-21 1989-07-27 Yazaki Corp 高強度高導電性銅合金
JPH01272733A (ja) * 1988-04-25 1989-10-31 Mitsubishi Shindoh Co Ltd 半導体装置用Ｃｕ合金製リードフレーム材
JPH01312047A (ja) * 1988-06-13 1989-12-15 Yazaki Corp 高力高導電性銅合金の製造方法
JPH0297632A (ja) * 1988-09-30 1990-04-10 Sumitomo Electric Ind Ltd 電気・電子機器用銅合金細線
JPH04214829A (ja) * 1990-11-30 1992-08-05 Tatsuta Electric Wire & Cable Co Ltd 高力高導電性銅合金細線の製造方法　　　　
CN100425717C (zh) * 2006-08-16 2008-10-15 苏州有色金属加工研究院 引线框架用铜合金及其制造方法
CN106498227B (zh) * 2014-11-11 2018-01-30 葛洲坝展慈（宁波）金属工业有限公司 一种铜合金的制备方法
JP5937770B1 (ja) * 2015-05-26 2016-06-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
TWI628671B (zh) * 2015-05-26 2018-07-01 日鐵住金新材料股份有限公司 Bonding wire for semiconductor device
WO2016189752A1 (ja) 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN111961913B (zh) * 2020-08-28 2022-01-07 河北临泰电子科技有限公司 一种键合引线及其加工工艺
CN113549785B (zh) * 2021-07-27 2022-04-26 四川威纳尔特种电子材料有限公司 一种键合铜银合金线及其制备方法，应用

Also Published As

Publication number Publication date
JPS6152332A (ja) 1986-03-15

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