JPH0546274Y2 - - Google Patents
Info
- Publication number
- JPH0546274Y2 JPH0546274Y2 JP1985134743U JP13474385U JPH0546274Y2 JP H0546274 Y2 JPH0546274 Y2 JP H0546274Y2 JP 1985134743 U JP1985134743 U JP 1985134743U JP 13474385 U JP13474385 U JP 13474385U JP H0546274 Y2 JPH0546274 Y2 JP H0546274Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact hole
- insulating film
- interlayer insulating
- upper electrode
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011229 interlayer Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 5
- 239000010408 film Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985134743U JPH0546274Y2 (US06633600-20031014-M00021.png) | 1985-09-03 | 1985-09-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985134743U JPH0546274Y2 (US06633600-20031014-M00021.png) | 1985-09-03 | 1985-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6242244U JPS6242244U (US06633600-20031014-M00021.png) | 1987-03-13 |
JPH0546274Y2 true JPH0546274Y2 (US06633600-20031014-M00021.png) | 1993-12-03 |
Family
ID=31036269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985134743U Expired - Lifetime JPH0546274Y2 (US06633600-20031014-M00021.png) | 1985-09-03 | 1985-09-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0546274Y2 (US06633600-20031014-M00021.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6309907B2 (ja) | 2015-03-11 | 2018-04-11 | 株式会社東芝 | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079748A (ja) * | 1983-10-06 | 1985-05-07 | Sanyo Electric Co Ltd | 半導体集積回路の多層配線構造 |
-
1985
- 1985-09-03 JP JP1985134743U patent/JPH0546274Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079748A (ja) * | 1983-10-06 | 1985-05-07 | Sanyo Electric Co Ltd | 半導体集積回路の多層配線構造 |
Also Published As
Publication number | Publication date |
---|---|
JPS6242244U (US06633600-20031014-M00021.png) | 1987-03-13 |
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