JPH0544831B2 - - Google Patents

Info

Publication number
JPH0544831B2
JPH0544831B2 JP59052387A JP5238784A JPH0544831B2 JP H0544831 B2 JPH0544831 B2 JP H0544831B2 JP 59052387 A JP59052387 A JP 59052387A JP 5238784 A JP5238784 A JP 5238784A JP H0544831 B2 JPH0544831 B2 JP H0544831B2
Authority
JP
Japan
Prior art keywords
less
cladding
lead frame
base material
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59052387A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60196962A (ja
Inventor
Tetsuo Kato
Shinichiro Yahagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP59052387A priority Critical patent/JPS60196962A/ja
Publication of JPS60196962A publication Critical patent/JPS60196962A/ja
Publication of JPH0544831B2 publication Critical patent/JPH0544831B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59052387A 1984-03-21 1984-03-21 リ−ドフレ−ム材料 Granted JPS60196962A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59052387A JPS60196962A (ja) 1984-03-21 1984-03-21 リ−ドフレ−ム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59052387A JPS60196962A (ja) 1984-03-21 1984-03-21 リ−ドフレ−ム材料

Publications (2)

Publication Number Publication Date
JPS60196962A JPS60196962A (ja) 1985-10-05
JPH0544831B2 true JPH0544831B2 (enExample) 1993-07-07

Family

ID=12913391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59052387A Granted JPS60196962A (ja) 1984-03-21 1984-03-21 リ−ドフレ−ム材料

Country Status (1)

Country Link
JP (1) JPS60196962A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120740B2 (ja) * 1988-09-13 1995-12-20 株式会社三井ハイテック 半導体用リードフレームとその製造法
JP7175659B2 (ja) * 2018-07-25 2022-11-21 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868958A (ja) * 1981-10-21 1983-04-25 Toshiba Corp リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS60196962A (ja) 1985-10-05

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