JPS60196962A - リ−ドフレ−ム材料 - Google Patents

リ−ドフレ−ム材料

Info

Publication number
JPS60196962A
JPS60196962A JP59052387A JP5238784A JPS60196962A JP S60196962 A JPS60196962 A JP S60196962A JP 59052387 A JP59052387 A JP 59052387A JP 5238784 A JP5238784 A JP 5238784A JP S60196962 A JPS60196962 A JP S60196962A
Authority
JP
Japan
Prior art keywords
less
lead frame
cladding
base material
frame material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59052387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0544831B2 (enExample
Inventor
Tetsuo Kato
哲男 加藤
Shinichiro Yahagi
慎一郎 矢萩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP59052387A priority Critical patent/JPS60196962A/ja
Publication of JPS60196962A publication Critical patent/JPS60196962A/ja
Publication of JPH0544831B2 publication Critical patent/JPH0544831B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59052387A 1984-03-21 1984-03-21 リ−ドフレ−ム材料 Granted JPS60196962A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59052387A JPS60196962A (ja) 1984-03-21 1984-03-21 リ−ドフレ−ム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59052387A JPS60196962A (ja) 1984-03-21 1984-03-21 リ−ドフレ−ム材料

Publications (2)

Publication Number Publication Date
JPS60196962A true JPS60196962A (ja) 1985-10-05
JPH0544831B2 JPH0544831B2 (enExample) 1993-07-07

Family

ID=12913391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59052387A Granted JPS60196962A (ja) 1984-03-21 1984-03-21 リ−ドフレ−ム材料

Country Status (1)

Country Link
JP (1) JPS60196962A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278261A (ja) * 1988-09-13 1990-03-19 Mitsui High Tec Inc 半導体用リードフレームとその製造法
WO2020021790A1 (ja) * 2018-07-25 2020-01-30 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868958A (ja) * 1981-10-21 1983-04-25 Toshiba Corp リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868958A (ja) * 1981-10-21 1983-04-25 Toshiba Corp リ−ドフレ−ム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278261A (ja) * 1988-09-13 1990-03-19 Mitsui High Tec Inc 半導体用リードフレームとその製造法
WO2020021790A1 (ja) * 2018-07-25 2020-01-30 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置
JP2020015948A (ja) * 2018-07-25 2020-01-30 株式会社日立製作所 複合金属材料、その製造方法、および複合金属材料を用いた電子装置

Also Published As

Publication number Publication date
JPH0544831B2 (enExample) 1993-07-07

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