JPH0544185B2 - - Google Patents

Info

Publication number
JPH0544185B2
JPH0544185B2 JP58159876A JP15987683A JPH0544185B2 JP H0544185 B2 JPH0544185 B2 JP H0544185B2 JP 58159876 A JP58159876 A JP 58159876A JP 15987683 A JP15987683 A JP 15987683A JP H0544185 B2 JPH0544185 B2 JP H0544185B2
Authority
JP
Japan
Prior art keywords
wiring layer
insulating film
metal wiring
interlayer insulating
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58159876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6050949A (ja
Inventor
Masahiro Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP58159876A priority Critical patent/JPS6050949A/ja
Publication of JPS6050949A publication Critical patent/JPS6050949A/ja
Publication of JPH0544185B2 publication Critical patent/JPH0544185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05073—Single internal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP58159876A 1983-08-30 1983-08-30 半導体装置 Granted JPS6050949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159876A JPS6050949A (ja) 1983-08-30 1983-08-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159876A JPS6050949A (ja) 1983-08-30 1983-08-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS6050949A JPS6050949A (ja) 1985-03-22
JPH0544185B2 true JPH0544185B2 (enrdf_load_stackoverflow) 1993-07-05

Family

ID=15703130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159876A Granted JPS6050949A (ja) 1983-08-30 1983-08-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS6050949A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63252433A (ja) * 1987-04-08 1988-10-19 Fuji Electric Co Ltd 半導体装置の製造方法
JP2714000B2 (ja) * 1988-06-23 1998-02-16 株式会社東芝 固体撮像装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833705B2 (ja) * 1975-08-27 1983-07-21 株式会社日立製作所 タソウハイセンオ ユウスルハンドウタイソウチ

Also Published As

Publication number Publication date
JPS6050949A (ja) 1985-03-22

Similar Documents

Publication Publication Date Title
CN100433281C (zh) 在有源元件上具有连接焊盘的半导体集成电路
US7800227B2 (en) Semiconductor device with crack-resistant multilayer copper wiring
JP3898350B2 (ja) 半導体装置
JP3171172B2 (ja) 混成集積回路
TWI527173B (zh) 封裝載板
KR970077573A (ko) 도금된 구리 상부 표면 레벨 상호 접속을 갖는 집적 회로를 위한 플라스틱 캡슐화
JPH0338043A (ja) 半導体集積回路装置
US6465890B1 (en) Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages
JPH0544185B2 (enrdf_load_stackoverflow)
JPH06326150A (ja) パッド構造
CN1047026C (zh) 防止焊盘金属剥离的装置
CN100399564C (zh) 焊垫设于有源电路正上方焊接的集成电路结构
JPH01185943A (ja) 半導体集積回路装置
JP2738145B2 (ja) 半導体装置
JPS5854646A (ja) 混成集積回路装置
KR20000009043A (ko) 다층 패드를 구비한 반도체 소자 및 그 제조방법
JP2674169B2 (ja) 半導体集積回路装置
JP2570457B2 (ja) 半導体装置
JPH0786281A (ja) 半導体装置および半導体装置の製造方法
JPH04188753A (ja) 多層配線半導体装置
JPH05152382A (ja) 回路装置
JPH02161755A (ja) 半導体装置
JPS63304645A (ja) 半導体集積回路
JPS6362105B2 (enrdf_load_stackoverflow)
JPH06334065A (ja) 半導体搭載用多層基板