JPH0542821B2 - - Google Patents

Info

Publication number
JPH0542821B2
JPH0542821B2 JP56168697A JP16869781A JPH0542821B2 JP H0542821 B2 JPH0542821 B2 JP H0542821B2 JP 56168697 A JP56168697 A JP 56168697A JP 16869781 A JP16869781 A JP 16869781A JP H0542821 B2 JPH0542821 B2 JP H0542821B2
Authority
JP
Japan
Prior art keywords
wiring
layer
layers
bend
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56168697A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5870554A (ja
Inventor
Shinji Katono
Minoru Fujita
Koji Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16869781A priority Critical patent/JPS5870554A/ja
Publication of JPS5870554A publication Critical patent/JPS5870554A/ja
Publication of JPH0542821B2 publication Critical patent/JPH0542821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP16869781A 1981-10-23 1981-10-23 半導体集積回路 Granted JPS5870554A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16869781A JPS5870554A (ja) 1981-10-23 1981-10-23 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16869781A JPS5870554A (ja) 1981-10-23 1981-10-23 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS5870554A JPS5870554A (ja) 1983-04-27
JPH0542821B2 true JPH0542821B2 (enrdf_load_stackoverflow) 1993-06-29

Family

ID=15872782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16869781A Granted JPS5870554A (ja) 1981-10-23 1981-10-23 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS5870554A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60134440A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
JPS61211552A (ja) * 1985-03-13 1986-09-19 Toyota Motor Corp 車輌のクランクダンパプ−リ構造
US4794816A (en) 1985-10-15 1989-01-03 Tokai Rubber Industries, Ltd. Dual-type damper device
JPH02106968A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体集積回路装置及びその形成方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138253A (en) * 1979-04-12 1980-10-28 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5870554A (ja) 1983-04-27

Similar Documents

Publication Publication Date Title
US7800227B2 (en) Semiconductor device with crack-resistant multilayer copper wiring
EP0096455B2 (en) Multilayer interconnection structure for semiconductor device
KR930005493B1 (ko) 반도체집적회로장치
JPH0542821B2 (enrdf_load_stackoverflow)
JP4757660B2 (ja) 半導体装置
JP2752863B2 (ja) 半導体装置
US20050023568A1 (en) Semiconductor integrated circuit device
US20100187698A1 (en) Semiconductor device and method for manufacturing the same
JPS6049649A (ja) 半導体集積回路装置
US4746965A (en) Integrated semiconductor circuit device
JPS6161700B2 (enrdf_load_stackoverflow)
GB2073951A (en) Multilayer interconnections for an integrated circuit
JPS63143845A (ja) 半導体集積回路装置
JP2738145B2 (ja) 半導体装置
KR900000167B1 (ko) 다층배선을 가진 반도체 집적회로
JP2800525B2 (ja) 半導体装置
JP3124085B2 (ja) 半導体装置
JPS59188153A (ja) 多層配線を有する電子回路装置の製造方法
JP2000164696A (ja) 多層配線構造
JPH0519303B2 (enrdf_load_stackoverflow)
KR100316715B1 (ko) 다층 금속 배선을 구비하는 반도체 장치
JPS6355781B2 (enrdf_load_stackoverflow)
JPH1117003A (ja) 半導体集積回路における配線層間接続用コンポーネント
JPH079937B2 (ja) 半導体装置の配線構造
JPH05243216A (ja) 半導体集積回路装置