JPH0519303B2 - - Google Patents
Info
- Publication number
- JPH0519303B2 JPH0519303B2 JP59033458A JP3345884A JPH0519303B2 JP H0519303 B2 JPH0519303 B2 JP H0519303B2 JP 59033458 A JP59033458 A JP 59033458A JP 3345884 A JP3345884 A JP 3345884A JP H0519303 B2 JPH0519303 B2 JP H0519303B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wirings
- layer
- layer wiring
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3345884A JPS60178641A (ja) | 1984-02-24 | 1984-02-24 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3345884A JPS60178641A (ja) | 1984-02-24 | 1984-02-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60178641A JPS60178641A (ja) | 1985-09-12 |
JPH0519303B2 true JPH0519303B2 (enrdf_load_stackoverflow) | 1993-03-16 |
Family
ID=12387094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3345884A Granted JPS60178641A (ja) | 1984-02-24 | 1984-02-24 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60178641A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04267586A (ja) * | 1991-02-22 | 1992-09-24 | Nec Corp | 同軸配線パターンおよびその形成方法 |
JP2797929B2 (ja) * | 1993-10-22 | 1998-09-17 | 日本電気株式会社 | 半導体装置 |
US5665644A (en) * | 1995-11-03 | 1997-09-09 | Micron Technology, Inc. | Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry |
US6091150A (en) * | 1996-09-03 | 2000-07-18 | Micron Technology, Inc. | Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5138987A (ja) * | 1974-09-30 | 1976-03-31 | Hitachi Ltd | Haisensonokeiseihoho |
-
1984
- 1984-02-24 JP JP3345884A patent/JPS60178641A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60178641A (ja) | 1985-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20070182001A1 (en) | Semiconductor device | |
JPH0546984B2 (enrdf_load_stackoverflow) | ||
KR930005493B1 (ko) | 반도체집적회로장치 | |
JPH0519303B2 (enrdf_load_stackoverflow) | ||
JP2752863B2 (ja) | 半導体装置 | |
EP0056908B1 (en) | Semiconductor device | |
CN210272337U (zh) | 半导体结构 | |
JPS60161637A (ja) | 電子装置 | |
JPS60176251A (ja) | 半導体装置 | |
JP2797929B2 (ja) | 半導体装置 | |
US11764152B1 (en) | Semiconductor device having L-shaped conductive pattern | |
JPH0669070B2 (ja) | 半導体装置 | |
JPS6340347A (ja) | 半導体集積回路装置 | |
JPH02183536A (ja) | 半導体装置 | |
JPH06125012A (ja) | 半導体装置の配線構造 | |
JPH0786281A (ja) | 半導体装置および半導体装置の製造方法 | |
JPH0669072B2 (ja) | 半導体装置の製造方法 | |
JPH02192145A (ja) | 半導体装置 | |
JPH04318957A (ja) | 半導体集積回路 | |
JP2710253B2 (ja) | 半導体集積回路の多層配線構造 | |
JPH02114657A (ja) | 半導体装置の多層配線構造 | |
JPS63312661A (ja) | 半導体装置用パッケ−ジ | |
JPS6043845A (ja) | 多層配線部材の製造方法 | |
JPH05160277A (ja) | 半導体装置 | |
JPS62156834A (ja) | 半導体集積回路装置 |