JPH0539635Y2 - - Google Patents
Info
- Publication number
- JPH0539635Y2 JPH0539635Y2 JP1986041711U JP4171186U JPH0539635Y2 JP H0539635 Y2 JPH0539635 Y2 JP H0539635Y2 JP 1986041711 U JP1986041711 U JP 1986041711U JP 4171186 U JP4171186 U JP 4171186U JP H0539635 Y2 JPH0539635 Y2 JP H0539635Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- cooling
- heat
- cooling mechanism
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986041711U JPH0539635Y2 (enrdf_load_stackoverflow) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986041711U JPH0539635Y2 (enrdf_load_stackoverflow) | 1986-03-19 | 1986-03-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62152454U JPS62152454U (enrdf_load_stackoverflow) | 1987-09-28 |
JPH0539635Y2 true JPH0539635Y2 (enrdf_load_stackoverflow) | 1993-10-07 |
Family
ID=30856955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986041711U Expired - Lifetime JPH0539635Y2 (enrdf_load_stackoverflow) | 1986-03-19 | 1986-03-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0539635Y2 (enrdf_load_stackoverflow) |
-
1986
- 1986-03-19 JP JP1986041711U patent/JPH0539635Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62152454U (enrdf_load_stackoverflow) | 1987-09-28 |
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