JPH0334221B2 - - Google Patents

Info

Publication number
JPH0334221B2
JPH0334221B2 JP60273068A JP27306885A JPH0334221B2 JP H0334221 B2 JPH0334221 B2 JP H0334221B2 JP 60273068 A JP60273068 A JP 60273068A JP 27306885 A JP27306885 A JP 27306885A JP H0334221 B2 JPH0334221 B2 JP H0334221B2
Authority
JP
Japan
Prior art keywords
integrated circuit
heat exchanger
solder
exchanger plate
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60273068A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62131546A (ja
Inventor
Haruhiko Yamamoto
Yoshiaki Udagawa
Mitsuhiko Nakada
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60273068A priority Critical patent/JPS62131546A/ja
Priority to US06/914,942 priority patent/US4879632A/en
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to EP86307669A priority patent/EP0217676B1/en
Publication of JPS62131546A publication Critical patent/JPS62131546A/ja
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH0334221B2 publication Critical patent/JPH0334221B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60273068A 1985-10-04 1985-12-03 集積回路冷却装置 Granted JPS62131546A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP60273068A JPS62131546A (ja) 1985-12-03 1985-12-03 集積回路冷却装置
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273068A JPS62131546A (ja) 1985-12-03 1985-12-03 集積回路冷却装置

Publications (2)

Publication Number Publication Date
JPS62131546A JPS62131546A (ja) 1987-06-13
JPH0334221B2 true JPH0334221B2 (enrdf_load_stackoverflow) 1991-05-21

Family

ID=17522697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273068A Granted JPS62131546A (ja) 1985-10-04 1985-12-03 集積回路冷却装置

Country Status (1)

Country Link
JP (1) JPS62131546A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS62131546A (ja) 1987-06-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees