JPH0537494Y2 - - Google Patents
Info
- Publication number
- JPH0537494Y2 JPH0537494Y2 JP1965987U JP1965987U JPH0537494Y2 JP H0537494 Y2 JPH0537494 Y2 JP H0537494Y2 JP 1965987 U JP1965987 U JP 1965987U JP 1965987 U JP1965987 U JP 1965987U JP H0537494 Y2 JPH0537494 Y2 JP H0537494Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- conductive foil
- soldering
- foil
- solder reservoir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 61
- 239000011888 foil Substances 0.000 claims description 54
- 238000005476 soldering Methods 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 30
- 229910052742 iron Inorganic materials 0.000 description 15
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1965987U JPH0537494Y2 (US07902200-20110308-C00004.png) | 1987-02-13 | 1987-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1965987U JPH0537494Y2 (US07902200-20110308-C00004.png) | 1987-02-13 | 1987-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128760U JPS63128760U (US07902200-20110308-C00004.png) | 1988-08-23 |
| JPH0537494Y2 true JPH0537494Y2 (US07902200-20110308-C00004.png) | 1993-09-22 |
Family
ID=30814456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1965987U Expired - Lifetime JPH0537494Y2 (US07902200-20110308-C00004.png) | 1987-02-13 | 1987-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537494Y2 (US07902200-20110308-C00004.png) |
-
1987
- 1987-02-13 JP JP1965987U patent/JPH0537494Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63128760U (US07902200-20110308-C00004.png) | 1988-08-23 |
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