JPH0537443Y2 - - Google Patents
Info
- Publication number
- JPH0537443Y2 JPH0537443Y2 JP1987074360U JP7436087U JPH0537443Y2 JP H0537443 Y2 JPH0537443 Y2 JP H0537443Y2 JP 1987074360 U JP1987074360 U JP 1987074360U JP 7436087 U JP7436087 U JP 7436087U JP H0537443 Y2 JPH0537443 Y2 JP H0537443Y2
- Authority
- JP
- Japan
- Prior art keywords
- semi
- slider piece
- resistor
- hole
- engagement groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polyphenylene sulfite Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987074360U JPH0537443Y2 (US20100223739A1-20100909-C00005.png) | 1987-05-20 | 1987-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987074360U JPH0537443Y2 (US20100223739A1-20100909-C00005.png) | 1987-05-20 | 1987-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63185204U JPS63185204U (US20100223739A1-20100909-C00005.png) | 1988-11-29 |
| JPH0537443Y2 true JPH0537443Y2 (US20100223739A1-20100909-C00005.png) | 1993-09-22 |
Family
ID=30919505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987074360U Expired - Lifetime JPH0537443Y2 (US20100223739A1-20100909-C00005.png) | 1987-05-20 | 1987-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537443Y2 (US20100223739A1-20100909-C00005.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625617A (ja) * | 1985-07-01 | 1987-01-12 | 株式会社村田製作所 | チツプボリユ−ム |
| JPS6228405B2 (US20100223739A1-20100909-C00005.png) * | 1981-05-18 | 1987-06-19 | Teijin Ltd |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5220671Y2 (US20100223739A1-20100909-C00005.png) * | 1973-12-10 | 1977-05-12 | ||
| JPS6228405U (US20100223739A1-20100909-C00005.png) * | 1985-08-01 | 1987-02-20 |
-
1987
- 1987-05-20 JP JP1987074360U patent/JPH0537443Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6228405B2 (US20100223739A1-20100909-C00005.png) * | 1981-05-18 | 1987-06-19 | Teijin Ltd | |
| JPS625617A (ja) * | 1985-07-01 | 1987-01-12 | 株式会社村田製作所 | チツプボリユ−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63185204U (US20100223739A1-20100909-C00005.png) | 1988-11-29 |
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