JPH0530512B2 - - Google Patents

Info

Publication number
JPH0530512B2
JPH0530512B2 JP60177129A JP17712985A JPH0530512B2 JP H0530512 B2 JPH0530512 B2 JP H0530512B2 JP 60177129 A JP60177129 A JP 60177129A JP 17712985 A JP17712985 A JP 17712985A JP H0530512 B2 JPH0530512 B2 JP H0530512B2
Authority
JP
Japan
Prior art keywords
adhesive
head
coating
coating head
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60177129A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6238265A (ja
Inventor
Shinko Maruyama
Kanji Hata
Eiji Ichitenmanya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60177129A priority Critical patent/JPS6238265A/ja
Publication of JPS6238265A publication Critical patent/JPS6238265A/ja
Publication of JPH0530512B2 publication Critical patent/JPH0530512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60177129A 1985-08-12 1985-08-12 接着剤塗布装置 Granted JPS6238265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60177129A JPS6238265A (ja) 1985-08-12 1985-08-12 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60177129A JPS6238265A (ja) 1985-08-12 1985-08-12 接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPS6238265A JPS6238265A (ja) 1987-02-19
JPH0530512B2 true JPH0530512B2 (enrdf_load_stackoverflow) 1993-05-10

Family

ID=16025677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60177129A Granted JPS6238265A (ja) 1985-08-12 1985-08-12 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPS6238265A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63236008A (ja) * 1987-03-25 1988-09-30 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法
JPH07100147B2 (ja) * 1987-04-28 1995-11-01 松下電器産業株式会社 接着剤塗布装置
JPH0666543B2 (ja) * 1988-05-26 1994-08-24 太陽誘電株式会社 回路基板への接着剤塗布方法
JP2542893Y2 (ja) * 1991-06-20 1997-07-30 富士通テン株式会社 粘性液体の供給装置
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
DE102020117012A1 (de) * 2020-06-29 2021-12-30 Lts Lohmann Therapie-Systeme Ag Dosiervorrichtung sowie Verfahren zur Dosierung von therapeutischen Flüssigkeiten

Also Published As

Publication number Publication date
JPS6238265A (ja) 1987-02-19

Similar Documents

Publication Publication Date Title
JPH0530512B2 (enrdf_load_stackoverflow)
JP3492491B2 (ja) スクリーン印刷マスク補正方法及び装置
JPH01253295A (ja) 配線基板上への接着剤塗布方法
JPH03157984A (ja) 部品実装用金属基板
JPH0927661A (ja) 配線基板
JPH02140992A (ja) プリント基板への接着剤付着装置
JPH11177226A (ja) 噴霧式フラックス塗布装置
JPH03288567A (ja) 塗布装置
JPS61171564A (ja) 接着剤塗布装置
JP2800682B2 (ja) 折り曲げｔａｂテープのスリット部樹脂塗布装置、及び塗布方法
JPS61268372A (ja) 塗布剤移載供給装置
JPH0113979B2 (enrdf_load_stackoverflow)
JP2808862B2 (ja) 電子部品の実装方法
JPH01143393A (ja) 配線基板にフラットパッケージ型素子を半田付けする方法
JPS59136990A (ja) リフロ−半田付け方法
JP2676750B2 (ja) 電子部品装着方法
JPS62154765A (ja) リ−ドフレ−ムへのクリ−ム半田の供給方法
JP2025074786A (ja) 部品圧着装置、および部品圧着方法
JPH02309628A (ja) スピンチヤツク
JPH0785513B2 (ja) 接着剤塗布方法
JP3240853B2 (ja) クリーム半田の塗布装置および塗布方法
JPH03187291A (ja) 半田付け方法
JP2508800B2 (ja) 電子部品装着装置
JP3407742B2 (ja) バンプ付電子部品の実装方法
JPH0738518B2 (ja) 部品装着装置