JPH0528786Y2 - - Google Patents
Info
- Publication number
- JPH0528786Y2 JPH0528786Y2 JP1987143469U JP14346987U JPH0528786Y2 JP H0528786 Y2 JPH0528786 Y2 JP H0528786Y2 JP 1987143469 U JP1987143469 U JP 1987143469U JP 14346987 U JP14346987 U JP 14346987U JP H0528786 Y2 JPH0528786 Y2 JP H0528786Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder land
- flexible
- resin
- circuit
- conductive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143469U JPH0528786Y2 (ko) | 1987-09-19 | 1987-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143469U JPH0528786Y2 (ko) | 1987-09-19 | 1987-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448066U JPS6448066U (ko) | 1989-03-24 |
| JPH0528786Y2 true JPH0528786Y2 (ko) | 1993-07-23 |
Family
ID=31410323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143469U Expired - Lifetime JPH0528786Y2 (ko) | 1987-09-19 | 1987-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528786Y2 (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58132995A (ja) * | 1982-02-03 | 1983-08-08 | 千住金属工業株式会社 | 導電ペ−ストのはんだ付け方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316294Y2 (ko) * | 1985-03-07 | 1991-04-08 |
-
1987
- 1987-09-19 JP JP1987143469U patent/JPH0528786Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58132995A (ja) * | 1982-02-03 | 1983-08-08 | 千住金属工業株式会社 | 導電ペ−ストのはんだ付け方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448066U (ko) | 1989-03-24 |
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