JPH0528786Y2 - - Google Patents
Info
- Publication number
- JPH0528786Y2 JPH0528786Y2 JP1987143469U JP14346987U JPH0528786Y2 JP H0528786 Y2 JPH0528786 Y2 JP H0528786Y2 JP 1987143469 U JP1987143469 U JP 1987143469U JP 14346987 U JP14346987 U JP 14346987U JP H0528786 Y2 JPH0528786 Y2 JP H0528786Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder land
- flexible
- resin
- circuit
- conductive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Description
【考案の詳細な説明】
［考案の利用分野］
本考案は、フレキシブル回路板に関し、特には
んだ付けが可能なフレキシブル回路板に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a flexible circuit board, and particularly to a solderable flexible circuit board.
［従来例］
従来、フレキシブル回路板において、はんだ付
けの可能なものとしては、銅箔を選択的にエツチ
ングして回路を形成したもののみがあつた。[Conventional Example] Conventionally, the only flexible circuit boards that could be soldered were those in which circuits were formed by selectively etching copper foil.
［考案が解決しようとする問題点］
しかしながら、上記従来技術においては、エツ
チングなどの繁雑な工程があつて加工コストが高
いこと、精製した銅箔の大部分が不要なものとし
て除去するので、材料コストが高くまた資源保護
の立場からも好ましいものではないなどの問題点
があつた。[Problems to be solved by the invention] However, the above-mentioned conventional technology involves complicated processes such as etching, resulting in high processing costs, and since most of the refined copper foil is removed as unnecessary, the material There were problems such as high cost and not being desirable from the standpoint of resource conservation.
従つて本考案は、安価なはんだ付け可能なフレ
キシブル回路板を提供することを目的とする。 SUMMARY OF THE PRESENT EMBODIMENT It is therefore an object of the present invention to provide an inexpensive solderable flexible circuit board.
［問題点を解決するための手段］
上記従来技術の問題点を解決するために、本考
案は、可撓性絶縁基板に回路を印刷形成するフレ
キシブル回路板において、回路部と、前記回路部
に一部が接続されたはんだランド基部と、前記は
んだランド部の上に設けられたはんだランドから
なり、前記はんだランド基部は導電粒子と熱硬化
性樹脂とからなり、前記はんだランドは前記はん
だランド基部の導電粒子含有率より多い導電粒子
含有率の合成樹脂からなり、前記回路部は前記は
んだランド基部より可撓性の合成樹脂と導電粒子
とからなる構成とした。[Means for Solving the Problems] In order to solve the problems of the prior art described above, the present invention provides a flexible circuit board in which a circuit is printed on a flexible insulating substrate. It consists of a partially connected solder land base and a solder land provided on the solder land, the solder land base is made of conductive particles and a thermosetting resin, and the solder land is connected to the solder land base. The circuit portion is made of a synthetic resin that is more flexible than the solder land base and the conductive particles.
［実施例］
本考案は、可撓性絶縁基板に回路を印刷形成す
るフレキシブル回路板において、回路をはんだ付
けに耐え得るはんだ付け部とフレキシビリテイが
要求される回路部とに分け、それぞれに要求され
る機能に応じた材料を選択して形成して、全体と
してはんだ付け可能なフレキシブル回路板とした
ものである。そのために、はんだ付け部を絶縁基
板との密着性に優れた導電性組成物からなるはん
だランド基部とその上に重ねられたはんだ付け性
に優れた導電性組成物からなるはんだランドとか
らなる２層構造とし、一方その他のフレキシビリ
テイが要求される回路部はフレキシブルな導電性
組成物から形成した。[Example] In a flexible circuit board in which a circuit is printed on a flexible insulating substrate, the present invention divides the circuit into a soldering part that can withstand soldering and a circuit part that requires flexibility. By selecting and forming materials according to the required functions, the entire flexible circuit board can be soldered. To this end, the soldering part is made up of a solder land base made of a conductive composition with excellent adhesion to the insulating substrate and a solder land made of a conductive composition with excellent solderability superimposed on the solder land base. It has a layered structure, while other circuit parts requiring flexibility are formed from a flexible conductive composition.
以下に本考案の１実施例を説明する。第１図
は、本考案の１実施例を示す断面図であつて、１
は例えばポリエチレンテレフタレート樹脂などの
可撓性の合成樹脂からなるフレキシブルな絶縁基
板である。２は絶縁基板に対して接着強度の優れ
た第１の導電組成物からなるはんだランド基部で
あり、３は該はんだランド基部の上に形成された
はんだ付け性の優れた第２の導電組成物からなる
はんだランドである。４ははんだランド以外の回
路部であつて、フレキシブルな第３の導電性組成
物から形成されている。 An embodiment of the present invention will be described below. FIG. 1 is a cross-sectional view showing one embodiment of the present invention.
is a flexible insulating substrate made of flexible synthetic resin such as polyethylene terephthalate resin. 2 is a solder land base made of a first conductive composition with excellent adhesion strength to an insulating substrate, and 3 is a second conductive composition with excellent solderability formed on the solder land base. This is a solder land consisting of Reference numeral 4 denotes a circuit portion other than the solder land, which is made of a flexible third conductive composition.
第１の導電性組成物は、銅または銀等の導電粒
子をエポキシ樹脂、フエノール樹脂等の熱硬化性
合成樹脂に適宜の溶剤等を加えて分散させたもの
を印刷、硬化させたものであり、硬化後の組成物
中の導電粒子の比率は40vol％であり、特開昭62
−160603号、特開昭62−145602に詳細に記載され
ている。第１の導電性組成物からなるはんだラン
ド基部２は、導電粒子の比率が少ないのではんだ
付け性は良好ではないが、半面樹脂量が比較的多
いので絶縁基板１との接着強度が優れ、熱硬化性
樹脂なのではんだ付け時の熱によつても接着が損
なわれることが少ない。 The first conductive composition is obtained by printing and curing conductive particles such as copper or silver dispersed in thermosetting synthetic resin such as epoxy resin or phenolic resin by adding an appropriate solvent. , the proportion of conductive particles in the composition after curing is 40 vol%, and according to JP-A-62
-160603 and JP-A-62-145602. The solder land base 2 made of the first conductive composition does not have good solderability because the proportion of conductive particles is small, but on the other hand, because it has a relatively large amount of resin, it has excellent adhesive strength with the insulating substrate 1, and Since it is a curable resin, the adhesion is less likely to be damaged by heat during soldering.
第２の導電性組成物は、導電粒子の含有比率が
50vol％で第１の導電性組成物より多くなつてお
り、従つて第２の導電性組成物からなるはんだラ
ンド２の表面には導電粒子がはんだ付け可能な状
態で多数露出しており、均質なはんだ付けができ
る。これらは特開昭58−121504に詳細に記載され
ている。第２の導電性組成物に使用される樹脂
は、熱可塑性、熱硬化性に限定されない。 The second conductive composition has a content ratio of conductive particles.
50 vol%, which is higher than that of the first conductive composition, and therefore a large number of conductive particles are exposed in a solderable state on the surface of the solder land 2 made of the second conductive composition, and the conductive particles are homogeneous. Can do soldering. These are described in detail in JP-A-58-121504. The resin used for the second conductive composition is not limited to thermoplastic or thermosetting resin.
第３の導電性組成物は、特開昭62−156176に詳
細に記載されているように、銅、銀またはカーボ
ンなどからなる導電粒子をポリウレタン樹脂、ア
クリル樹脂またはポリエステル樹脂等の可撓性合
成樹脂に、適宜の溶剤などを加えて分散させたも
のを印刷、焼成したものであり、上記第１の導電
性組成物および第２の導電性組成物に比べてフレ
キシビリテイが大幅に優れており、従つて第３の
導電性組成物からなる回路部４は、折り曲げ使用
される際に絶縁基板と共に自在に屈曲し、かつ断
線などの事故に到ることがない。 The third conductive composition, as described in detail in JP-A No. 62-156176, is a method in which conductive particles made of copper, silver, carbon, etc. are bonded to a flexible compound such as polyurethane resin, acrylic resin, or polyester resin. It is made by printing and firing a resin that is dispersed with an appropriate solvent, etc., and has significantly superior flexibility compared to the first conductive composition and the second conductive composition. Therefore, the circuit section 4 made of the third conductive composition can be bent freely together with the insulating substrate when used by bending, and accidents such as disconnection will not occur.
上記回路部４は上記はんだランド基部１と十分
な接続の信頼性を得られる程度の面積において重
畳されている。 The circuit portion 4 is overlapped with the solder land base 1 in an area sufficient to provide sufficient connection reliability.
なお、上記実施例の説明においては、はんだラ
ンド基部とはんだランドを形成する導電性組成物
中の導電粒子の比率をそれぞれ特定したが、実際
にはこれらの比率は上記の価に特定されるもので
はなく、導電粒子の種類、合成樹脂の種類等によ
つて適宜変更可能なものであり、要ははんだラン
ド基部とはんだランドの夫々の機能を発揮できる
程度に夫々の中の導電粒子の含有率に差を付ける
ことができれば良い。 In addition, in the explanation of the above example, the ratio of the conductive particles in the solder land base and the conductive composition forming the solder land was specified, but in reality, these ratios are specified by the above values. Rather, it can be changed as appropriate depending on the type of conductive particles, the type of synthetic resin, etc., and the key is to adjust the content of conductive particles in each to the extent that the solder land base and solder land can perform their respective functions. It would be good if we could make a difference.
［考案の効果］
以上述べたように、本考案によれば、可撓性絶
縁基板に回路を印刷形成するフレキシブル回路板
において、回路部と、前記回路部に一部が接続さ
れたはんだランド基部と、前記はんだランド部の
上に設けられたはんだランドからなり、前記はん
だランド基部は導電粒子と熱硬化性樹脂とからな
り、前記はんだランドは前記はんだランド基部の
導電粒子含有率より多い導電粒子を含有する合成
樹脂からなり、前記回路部は前記はんだランド基
部より可撓性の合成樹脂と導電粒子からなる構成
とし、回路をはんだ付けに耐え得るはんだ付け部
とフレキシビリテイが要求される回路部とに分
け、それぞれに要求される機能に応じた材料を選
択して形成することにより、全体としてはんだ付
け可能なフレキシブル回路板を、しかも銅箔から
なるフレキシブル回路板よりはるかに安価に提供
することができる。[Effects of the invention] As described above, according to the invention, in a flexible circuit board in which a circuit is printed on a flexible insulating substrate, a circuit part and a solder land base partially connected to the circuit part are provided. and a solder land provided on the solder land portion, the solder land base is made of conductive particles and a thermosetting resin, and the solder land has a conductive particle content greater than the conductive particle content of the solder land base. The circuit portion is made of a synthetic resin that is more flexible than the solder land base and conductive particles, and the circuit portion has a soldering portion that can withstand soldering and a circuit that requires flexibility. By separating the parts into parts and selecting and forming materials according to the functions required for each part, we can provide a solderable flexible circuit board as a whole at a much lower cost than a flexible circuit board made of copper foil. be able to.
第１図は本考案のフレキシブル回路板にかかわ
る図である。
１……絶縁基板、２……はんだランド基部、３
……はんだランド、４……回路部。
FIG. 1 is a diagram related to the flexible circuit board of the present invention. 1...Insulating board, 2...Solder land base, 3
...Solder land, 4...Circuit section.
Claims (1)
ブル回路板において、可撓性の大きい回路部と、
前記回路部に一部が接続された前記可撓性絶縁基
板との接着性のよいはんだランド基部と、前記は
んだランド基部の上に設けられたはんだ付け性の
よいはんだランドからなることを特徴とするフレ
キシブル回路板。 In a flexible circuit board in which a circuit is printed on a flexible insulating substrate, a highly flexible circuit part,
It is characterized by comprising a solder land base with good adhesion to the flexible insulating substrate, a part of which is connected to the circuit part, and a solder land with good solderability provided on the solder land base. flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143469U JPH0528786Y2 (en) | 1987-09-19 | 1987-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143469U JPH0528786Y2 (en) | 1987-09-19 | 1987-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448066U JPS6448066U (en) | 1989-03-24 |
| JPH0528786Y2 true JPH0528786Y2 (en) | 1993-07-23 |
Family
ID=31410323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143469U Expired - Lifetime JPH0528786Y2 (en) | 1987-09-19 | 1987-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528786Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58132995A (en) * | 1982-02-03 | 1983-08-08 | 千住金属工業株式会社 | Method of soldering conductive paste |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316294Y2 (en) * | 1985-03-07 | 1991-04-08 |
-
1987
- 1987-09-19 JP JP1987143469U patent/JPH0528786Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58132995A (en) * | 1982-02-03 | 1983-08-08 | 千住金属工業株式会社 | Method of soldering conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448066U (en) | 1989-03-24 |
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