JPH0543311B2 - - Google Patents
Info
- Publication number
- JPH0543311B2 JPH0543311B2 JP62246892A JP24689287A JPH0543311B2 JP H0543311 B2 JPH0543311 B2 JP H0543311B2 JP 62246892 A JP62246892 A JP 62246892A JP 24689287 A JP24689287 A JP 24689287A JP H0543311 B2 JPH0543311 B2 JP H0543311B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- conductive
- conductive circuit
- hole
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000005470 impregnation Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 5
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 4
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、第一の導電回路を設けたシートと第
二の導電回路を設けた基板を積層したプリント基
板およびその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board in which a sheet provided with a first conductive circuit and a substrate provided with a second conductive circuit are laminated, and a method for manufacturing the same.
〔従来の技術〕
従来、鉄、アルミニウム等の金属にエポキシ樹
脂等の絶縁層を形成し、その上に銅箔等の導電回
路を形成してなる配線基板又はフエノール樹脂等
の硬質基板の上に銅箔等の導電回路を形成してな
る配線基板は、多目的に利用されているが、この
種の配線基板においては、基板上に形成される導
電回路の高密度化に伴つて、導電回路を交差させ
るために二層化する必要性が生じている。[Prior art] Conventionally, a wiring board is formed by forming an insulating layer such as epoxy resin on a metal such as iron or aluminum, and a conductive circuit such as copper foil is formed on the insulating layer, or a hard substrate such as phenolic resin is used. Wiring boards formed with conductive circuits such as copper foil are used for many purposes, but as the density of conductive circuits formed on the board increases, in this type of wiring board, the conductive circuits are There is a need to create two layers for crossing.
そこで、従来は、第３図〜第５図に示すような
二層化方式が採用されていた。 Therefore, conventionally, a two-layer system as shown in FIGS. 3 to 5 has been adopted.
第一の方式である第３図のプリント基板におい
て、金属板１の上にエポキシ樹脂等の絶縁層２が
設けられ、更にエツチング等の周知の方法によつ
て、銅箔等による第一の導電回路３が形成され
る。そして、該第一の導電回路３の上に、例えば
エポキシ樹脂等のソルダーレジストを印刷等によ
り形成して絶縁層４としている。該絶縁層には、
第一の導電回路３との電気的接続のため孔５が形
成されている。 In the printed circuit board of FIG. 3, which is the first method, an insulating layer 2 made of epoxy resin or the like is provided on a metal plate 1, and a first conductive layer made of copper foil or the like is further formed by a well-known method such as etching. Circuit 3 is formed. Then, a solder resist such as epoxy resin is formed on the first conductive circuit 3 by printing or the like to form an insulating layer 4. The insulating layer includes:
A hole 5 is formed for electrical connection with the first conductive circuit 3.
その後、カーボン、銅、銀等の粉末を混入した
樹脂系の導電ペーストを用いて、第二の導電回路
６が形成される。この時、上記孔５には、樹脂系
の導電ペーストが充填されるので、第一の導電回
路３と第二の導電回路６とは、電気的に接続され
ることになる。そして、更に、導体の保護のため
にソルダーレジスト７が被覆される。 Thereafter, the second conductive circuit 6 is formed using a resin-based conductive paste mixed with powder of carbon, copper, silver, or the like. At this time, the hole 5 is filled with a resin-based conductive paste, so the first conductive circuit 3 and the second conductive circuit 6 are electrically connected. Furthermore, a solder resist 7 is coated to protect the conductor.
次に、第二の方式を第４図に示す。 Next, the second method is shown in FIG.
このプリント基板は、メタルコア基板と呼ばれ
るものであり、金属板１に孔８を設けた後、エポ
キシ樹脂等の絶縁層２が被覆され、これに、孔９
が形成されている。そして、次に、周知のメツキ
方により、導電回路１０が基板の表裏に形成され
る。 This printed circuit board is called a metal core board, and after holes 8 are formed in a metal plate 1, an insulating layer 2 such as epoxy resin is coated, and holes 9 are formed on this.
is formed. Then, conductive circuits 10 are formed on the front and back sides of the substrate by a well-known plating method.
また、基板として、硬質の樹脂を用いる第三の
方式を製造工程とともに第５図に示す。 Further, a third method using a hard resin as a substrate is shown in FIG. 5 together with the manufacturing process.
この方式においては、耐熱性、絶縁性のあるポ
リイミド樹脂又はポリエステル樹脂等の絶縁シー
ト１１の一方の面に、銅箔からなる第一の導電回
路１２がエツチング等の手段により形成され、も
う一方の面には接着シート１３が形成される。そ
して、該積層構造に、導電回路を接続するための
貫通孔１４と、導電回路接続及び電気部品１５の
リード線１６の接続を兼ねる貫通孔１７が形成さ
れる。 In this method, a first conductive circuit 12 made of copper foil is formed on one side of an insulating sheet 11 made of heat-resistant and insulating polyimide resin or polyester resin by means such as etching; An adhesive sheet 13 is formed on the surface. A through hole 14 for connecting a conductive circuit and a through hole 17 serving both for connecting the conductive circuit and connecting the lead wire 16 of the electrical component 15 are formed in the laminated structure.
一方、フエノール樹脂又はエポキシ樹脂等の硬
質基板１８の上に、エツチング等の手段により、
銅箔よりなる第二の導電回路１９が形成され、も
う一つの積層構造が作られ、電気部品１５のリー
ド線１６が通る貫通孔２０が設けられる。 On the other hand, on the hard substrate 18 made of phenol resin or epoxy resin, by etching or other means,
A second conductive circuit 19 made of copper foil is formed, another laminated structure is created, and a through hole 20 is provided through which the lead wire 16 of the electrical component 15 passes.
こうして形成された二つの積層構造は、上記接
着シート１３を介して圧着される。 The two laminated structures thus formed are pressed together via the adhesive sheet 13.
半田付けをしない部分に、ソルダーレジスト２
１が被覆印刷され、貫通孔１４と電気部品１５の
リード線１６を挿入した後の貫通孔１７が半田付
け２２され、第一の導電回路１２と第二の導電回
路１９とが電気的に接続される。 Solder resist 2 on the parts that will not be soldered
1 is coated and printed, and the through hole 17 is soldered 22 after the lead wire 16 of the electrical component 15 is inserted into the through hole 14, and the first conductive circuit 12 and the second conductive circuit 19 are electrically connected. be done.
ところが、第３図に示す上記第一の方式におい
ては、第二の導電回路６に使用する樹脂系導電ペ
ーストが耐湿性、耐熱性に劣り、外部の温度、湿
度の変化により導電回路の抵抗値が大きく変化す
る欠点を有しており、また、フアイン化が難し
く、長い導電回路を形成すると、信頼性が低くな
つてしまうという欠点をも有していた。すなわ
ち、カーボンの粉末を混入した樹脂系導電ペース
トは、10-2Ωcmの比抵抗を有しており、長い導電
回路を形成しずらい。また、銅系の粉末を混入し
た樹脂系導電ペーストは、酸化しやすく、銀系の
粉末を混入した樹脂系導電ペーストは、マイグレ
ーシヨンによるシヨートが発生しやすく信頼性が
低くなつていた。
However, in the first method shown in FIG. 3, the resin-based conductive paste used for the second conductive circuit 6 has poor moisture resistance and heat resistance, and the resistance value of the conductive circuit changes due to changes in external temperature and humidity. It has the disadvantage that the conductive circuit changes greatly, and it is difficult to fine-tune it, and when a long conductive circuit is formed, the reliability decreases. That is, a resin-based conductive paste mixed with carbon powder has a specific resistance of 10 -2 Ωcm, making it difficult to form a long conductive circuit. Further, a resin-based conductive paste mixed with copper-based powder is easily oxidized, and a resin-based conductive paste mixed with silver-based powder is prone to shoots due to migration, resulting in low reliability.
また、第４図に示す第二の方式においては、絶
縁層の形成及び導電回路の形成の工程が複雑であ
り、コスト高になつてしまう。 Furthermore, in the second method shown in FIG. 4, the steps of forming the insulating layer and forming the conductive circuit are complicated, resulting in high costs.
そして、第５図に示す第三の方式においては、
絶縁シート１１に接着シート１３を張り合わせる
必要があるため、加工が複雑になりコストが高く
なつてしまう。使用する接着シート１３には、ア
クリル樹脂系等の感圧性接着タイプとエポキシ樹
脂系等の熱硬化タイプがあるが、前者のアクリル
樹脂系等の感圧性接着タイプのものは、安価では
あるが、耐溶剤性がないうえ、50℃以上の温度で
は、著しく接着強度が低下するため、プリント基
板として、自動半田付けができず手作業で行う必
要があつた。そのため工数が多くなり、接着部の
はがれにより、半田接続部に亀裂を生じたり、電
気的な断線が生ずることが多く、信頼性が低下し
ていた。また、後者のエポキシ樹脂系等の熱硬化
タイプにおいては、絶縁シート１１にポリイミド
樹脂等の高価な耐熱樹脂を使用しなければならな
いだけでなく、取り扱いが難しく加工が困難であ
つた。 In the third method shown in Fig. 5,
Since it is necessary to attach the adhesive sheet 13 to the insulating sheet 11, the processing becomes complicated and the cost increases. The adhesive sheet 13 used includes pressure-sensitive adhesive types such as acrylic resin type and thermosetting type such as epoxy resin type.The former pressure-sensitive adhesive type such as acrylic resin type is inexpensive, but Not only is it not resistant to solvents, but its adhesive strength significantly decreases at temperatures above 50°C, so it cannot be soldered automatically to printed circuit boards and must be done manually. This increases the number of man-hours and often causes cracks in solder joints or electrical disconnections due to peeling of the adhesive, reducing reliability. Furthermore, in the latter thermosetting type such as an epoxy resin type, not only is it necessary to use an expensive heat-resistant resin such as polyimide resin for the insulating sheet 11, but it is also difficult to handle and process.
そこで、本発明は、上記欠点を改善し、接着剤
を必要とせず、製造が容易で、信頼性の高いプリ
ント基板およびその製造方法を提供することを目
的とする。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to improve the above-mentioned drawbacks, to provide a printed circuit board that does not require adhesive, is easy to manufacture, and has high reliability, and a method for manufacturing the same.
そのために本発明のプリント基板は、含浸時に
おいて半硬化性を示す樹脂を含浸したシートと、
該シートの１面にエツチングにより形成される第
一の導電回路と、前記シートに形成される貫通孔
と、前記シートの他面に熱圧着される基板と、該
基板上に形成される第二の導電回路と、前記貫通
孔に充填され前記第一および第二の導電回路を電
気的に接続する導電性物質とを備え、前記第一の
導電回路が前記シートにめり込んだ状態で固着さ
れたことを特徴とする。
To this end, the printed circuit board of the present invention includes a sheet impregnated with a resin that exhibits semi-curing properties when impregnated;
A first conductive circuit formed by etching on one side of the sheet, a through hole formed in the sheet, a substrate thermocompression bonded to the other side of the sheet, and a second conductive circuit formed on the substrate. a conductive circuit, and a conductive substance filled in the through hole and electrically connecting the first and second conductive circuits, the first conductive circuit being recessed into the sheet and fixed thereto. It is characterized by
また、本発明のプリント基板の製造方法は、含
浸時において半硬化性を示す樹脂を含浸したシー
トに貫通孔を形成するとともに、該シートの１面
にエツチングにより第一の導電回路を形成し、一
方、基板上に第二の導電回路を形成し、前記シー
トの他面に第二の導電回路を熱圧着し、前記第一
の導電回路を前記シートにめり込んだ状態で固着
し、前記貫通孔に導電性物質を充填することによ
り、前記第一および第二の導電回路を電気的に接
続することを特徴とし、さらには、含浸時におい
て半硬化性を示す樹脂を含浸したシートに第一の
貫通孔を形成するとともに、該シートの１面にエ
ツチングにより第一の導電回路を形成し、一方、
樹脂基板上に前記第一の貫通孔に対応する位置に
第二の貫通孔を形成するとともに、前記樹脂基板
上に第二の導電回路を形成し、前記シートの他面
に第二の導電回路を熱圧着し、前記第一の導電回
路を前記シートにめり込んだ状態で固着し、前記
第一および第二の貫通孔に導電性物質を充填する
ことにより、前記第一および第二の導電回路を電
気的に接続することを特徴とする。 Further, the method for manufacturing a printed circuit board of the present invention includes forming through holes in a sheet impregnated with a semi-curable resin during impregnation, and forming a first conductive circuit on one surface of the sheet by etching. On the other hand, a second conductive circuit is formed on the substrate, the second conductive circuit is thermocompression bonded to the other surface of the sheet, the first conductive circuit is recessed into the sheet and fixed, and the through hole is fixed. The first and second conductive circuits are electrically connected by filling the sheet with a conductive substance, and further, the first conductive circuit is filled with a sheet impregnated with a semi-hardening resin at the time of impregnation. A through hole is formed and a first conductive circuit is formed on one side of the sheet by etching, while,
A second through hole is formed on the resin substrate at a position corresponding to the first through hole, a second conductive circuit is formed on the resin substrate, and a second conductive circuit is formed on the other surface of the sheet. The first and second conductive circuits are bonded by thermocompression, the first conductive circuit is embedded and fixed in the sheet, and the first and second through holes are filled with a conductive substance. It is characterized by electrically connecting.
本発明においては、含浸時において半硬化性を
示す樹脂を含浸したシートを用いているので、該
シート自体が接着シートの機能を果たすため、単
に第一の層を第二の層に熱圧着するだけで、両層
が一体となり、前記シートの１面にエツチングに
より第一の導電回路を形成した後、このシートを
他の基板に熱圧着して接着硬化させるため、熱圧
着時に第一の導電回路の底部がシートにめり込ん
だ状態となり、第一の導電回路とシートの接着強
度がより高くなる。
In the present invention, since a sheet impregnated with a resin that exhibits semi-curing properties during impregnation is used, the sheet itself functions as an adhesive sheet, so the first layer is simply thermocompression bonded to the second layer. After the first conductive circuit is formed on one side of the sheet by etching, the sheet is thermocompression bonded to another substrate and the adhesive is cured. The bottom of the circuit sinks into the sheet, and the adhesive strength between the first conductive circuit and the sheet becomes higher.
以下、本発明の実施例について図面を参照しつ
つ説明する。
Embodiments of the present invention will be described below with reference to the drawings.
第１図は、本発明のプリント基板およびその製
造方法の１実施例を示す。 FIG. 1 shows an embodiment of the printed circuit board and method of manufacturing the same according to the present invention.
２３は、含浸時において半硬化性を示す樹脂を
含浸した絶縁性のシートであり、好適な実施例と
しては芳香族ポリアミド繊維製の不織布あるいは
ガラス織布にジアリルフタレート樹脂系組成物、
例えばジアリルオルソフタレート、ジアリルイソ
フタレート又はジアリルテレフタレート等を含浸
したシートの半硬化状態（Ｂステージ）のもので
あり、絶縁シート２３の一方の面に銅箔等の導電
体２４を張り合わせ、周知のエツチング法にて、
第一の導電回路２５が形成されており、ドリル又
はパンチにより、導電回路の接続のため貫通孔２
６が設けられる。 23 is an insulating sheet impregnated with a resin that exhibits semi-curing properties during impregnation, and a preferred example is a nonwoven fabric made of aromatic polyamide fiber or a glass woven fabric, and a diallyl phthalate resin composition,
For example, it is a semi-cured (B stage) sheet impregnated with diallyl orthophthalate, diallyl isophthalate, diallyl terephthalate, etc., and a conductive material 24 such as copper foil is laminated on one surface of an insulating sheet 23, and then etching is performed using well-known etching. By law,
A first conductive circuit 25 is formed, and the through hole 2 is drilled or punched for connection of the conductive circuit.
6 is provided.
一方、鉄、アルミニウム等の金属板２７にエポ
キシ樹脂等の絶縁層２８が形成され、その上に銅
箔等の導電体２９が張り合わせられ、同様に周知
のエツチング法にて、第二の導電回路３０が形成
される。 On the other hand, an insulating layer 28 made of epoxy resin or the like is formed on a metal plate 27 made of iron, aluminum, etc., a conductor 29 such as copper foil is laminated thereon, and a second conductive circuit is formed using a well-known etching method. 30 is formed.
そして、上記の絶縁性のシート２３上に第一の
導電回路２５を形成したものと、金属板２７上に
第二の導電回路３０を形成したものとを、温度
140〜180℃、プレス圧30〜60Kg／cm2、時間30分に
て熱圧着する。このとき、第一の導電回路２５は
シート２３にプレスされるため、第一の導電回路
２５の底部がシート２３にめり込んだ状態とな
る。熱圧着に際しては、貫通孔２６にエポキシ系
又はシリコン系等の充てん剤を充てんし、熱圧着
時の樹脂ダレを防止するようにすると良い。熱圧
着後、充てん物を取り除いたのち、半田付けを必
要としない部分にソルダーレジスト３１が印刷等
の周知の方法を用いて形成され、電子素子等３２
が搭載され、半田付け３３される。 Then, the insulating sheet 23 on which the first conductive circuit 25 is formed and the metal plate 27 on which the second conductive circuit 30 is formed are heated.
Thermocompression bonding is carried out at 140 to 180°C, press pressure of 30 to 60 kg/cm 2 , and time of 30 minutes. At this time, since the first conductive circuit 25 is pressed onto the sheet 23, the bottom of the first conductive circuit 25 is sunk into the sheet 23. During thermocompression bonding, it is preferable to fill the through hole 26 with a filler such as epoxy or silicone to prevent resin from dripping during thermocompression bonding. After thermocompression bonding, after removing the filler, a solder resist 31 is formed on the parts that do not require soldering using a well-known method such as printing, and the electronic elements 32 are formed using a well-known method such as printing.
is mounted and soldered 33.
その際、貫通孔２６には、導電物３４が充填さ
れる。該導電物３４は、自動半田付け時に形成さ
れる半田でもよいし、半田ペーストを充填し加熱
したものでもよい。ソルダーレジスト３１を形成
する前に、銅又は銀等の導電ペーストをスクリー
ン印刷するか、充填機を用いて充填することもで
きる。ただし、導電ペーストを使用するときは、
ソルダーレジスト３１で導電ペーストを覆うよう
にすることが好ましい。 At that time, the through hole 26 is filled with a conductive material 34. The conductor 34 may be solder formed during automatic soldering, or may be filled with solder paste and heated. Before forming the solder resist 31, a conductive paste such as copper or silver can be screen printed or filled using a filling machine. However, when using conductive paste,
It is preferable to cover the conductive paste with the solder resist 31.
このようにして形成した配線基板は、熱硬化後
の引き剥がし強さが、1.3Kg／cm2以上と強く、耐
熱性、耐溶剤性とも優れたものになる。次に、基
板として硬質樹脂を用いた本発明の他の実施例
を、第２図により説明する。 The wiring board thus formed has a strong peel strength of 1.3 kg/cm 2 or more after thermosetting, and has excellent heat resistance and solvent resistance. Next, another embodiment of the present invention using a hard resin as the substrate will be described with reference to FIG.
絶縁シート２３は、前記実施例と同様に、含浸
時において半硬化性を示す樹脂を含浸した絶縁性
のシートであり、芳香族ポリアミド繊維製の不織
布あるいはガラス織布にジアリルフタレート樹脂
系組成物、例えばジアリルオルソフタレート、ジ
アリルイソフタレート又はジアリルテレフタレー
ト等を含浸したシートの半硬化状態（Ｂステー
ジ）のものであり、前記実施例と同様に絶縁シー
ト２３の一方の面に銅箔等の導電体２４を張り合
わせ、周知のエツチング法にて、第一の導電回路
２５が形成されており、ドリル又はパンチによ
り、導電回路の接続のため貫通孔２６が設けられ
る。そして、導電回路接続及び電気部品１５のリ
ード線１６の接続を兼ねる貫通孔１７が形成され
る。 The insulating sheet 23 is an insulating sheet impregnated with a resin that exhibits semi-curing property when impregnated, as in the above embodiment, and is made of a nonwoven fabric made of aromatic polyamide fiber or a glass woven fabric, and a diallyl phthalate resin composition, For example, it is a semi-cured (B stage) sheet impregnated with diallyl orthophthalate, diallyl isophthalate, diallyl terephthalate, etc., and a conductor 24 such as copper foil is attached to one side of the insulating sheet 23 as in the previous embodiment. A first conductive circuit 25 is formed by pasting them together using a well-known etching method, and a through hole 26 is provided by a drill or punch for connection of the conductive circuit. Then, a through hole 17 is formed which serves both as a conductive circuit connection and a connection for a lead wire 16 of the electrical component 15.
一方、フエノール樹脂又はエポキシ樹脂等の硬
質基板３５の上に銅箔等の導電体２９が張り合わ
せられ、同様に周知のエツチング法にて、第二の
導電回路３０が形成され、電気部品１５のリード
線１６が貫通するための孔３６がドリル又はパン
チにより形成される。 On the other hand, a conductor 29 such as copper foil is laminated onto a hard substrate 35 made of phenol resin or epoxy resin, and a second conductive circuit 30 is formed by a well-known etching method. A hole 36 is drilled or punched for the wire 16 to pass through.
そして、上記の絶縁性のシート２３上に第一の
導電回路２５を形成したものと、金属板２７上に
第二の導電回路３０を形成したものとを、温度
140〜180℃、プレス圧30〜60Kg／cm2、時間30分に
て熱圧着する。熱圧着に際しては、貫通孔２６に
エポキシ系又はシリコン系等の充てん剤を充てん
し、熱圧着時の樹脂ダレを防止するようにすると
良い。熱圧着後、充てん物を取り除いたのち、半
田付けを必要としない部分にソルダーレジスト３
１が印刷等の周知の方法を用いて形成され、電気
部品１５のリード線１６が貫通され、半田付け３
３される。 Then, the insulating sheet 23 on which the first conductive circuit 25 is formed and the metal plate 27 on which the second conductive circuit 30 is formed are heated.
Thermocompression bonding is carried out at 140 to 180°C, press pressure of 30 to 60 kg/cm 2 , and time of 30 minutes. During thermocompression bonding, it is preferable to fill the through hole 26 with a filler such as epoxy or silicone to prevent resin from dripping during thermocompression bonding. After thermocompression bonding, after removing the filler, apply solder resist 3 to the areas that do not require soldering.
1 is formed using a well-known method such as printing, the lead wire 16 of the electrical component 15 is passed through, and the soldering 3
3 will be given.
その際、貫通孔２６には、導電物３４が充填さ
れる。該導電物３４は、自動半田付け時に形成さ
れる半田でもよいし、半田ペーストを充填し加熱
したものでもよい。ソルダーレジスト３１を形成
する前に、銅又は銀等の導電ペーストをスクリー
ン印刷するか、充填機を用いて充填することもで
きる。ただし、導電ペーストを使用するときは、
ソルダーレジスト３１で導電ペーストを覆うよう
にすることが好ましい。 At that time, the through hole 26 is filled with a conductive material 34. The conductor 34 may be solder formed during automatic soldering, or may be filled with solder paste and heated. Before forming the solder resist 31, a conductive paste such as copper or silver can be screen printed or filled using a filling machine. However, when using conductive paste,
It is preferable to cover the conductive paste with the solder resist 31.
以上説明したように本発明によれば、プリント
基板の構造及び製造工程が極めて簡単になり、シ
ートとしてジアリルフタレート樹脂系組成物を用
いた場合には、耐熱性及び耐溶剤性に優れている
ので、電気部品等を搭載する際に自動半田付けを
用いることができる。また、熱硬化後の引き剥が
し強さが、1.3Kg／cm2以上と強く、耐熱性、耐溶
剤性とも優れたものになるので、接着不良による
電気的接続不良が少なくなり、信頼性が高いもの
となる。
As explained above, according to the present invention, the structure and manufacturing process of the printed circuit board are extremely simple, and when a diallyl phthalate resin composition is used as the sheet, it has excellent heat resistance and solvent resistance. , automatic soldering can be used when mounting electrical components, etc. In addition, the peel strength after heat curing is strong at 1.3 kg/cm 2 or more, and it has excellent heat resistance and solvent resistance, so electrical connection failures due to poor adhesion are reduced and reliability is high. Become something.
さらに、含浸時において半硬化性を示す樹脂を
含浸したシートの１面にエツチングにより第一の
導電回路を形成した後、このシートを他の基板に
熱圧着して接着硬化させるため、熱圧着時に第一
の導電回路の底部がシートにめり込んだ状態とな
る。この場合、第一の導電回路がエツチングによ
り形成されるため、第一の導電回路の側面はアン
ダーカツトされて傾斜面が形成されており、この
傾斜面がシートの接着に寄与するため、第一の導
電回路とシートの接着強度がより高くなるという
効果を有する。 Furthermore, after forming a first conductive circuit by etching on one side of the sheet impregnated with a resin that exhibits semi-curing properties during impregnation, this sheet is thermocompression bonded to another substrate to cure the adhesive. The bottom of the first conductive circuit is sunk into the sheet. In this case, since the first conductive circuit is formed by etching, the side surface of the first conductive circuit is undercut to form an inclined surface, and this inclined surface contributes to adhesion of the sheet. This has the effect of increasing the adhesive strength between the conductive circuit and the sheet.
第１図は本発明のプリント基板およびその製造
方法の１実施例を示す工程図、第２図は基板とし
て硬質樹脂を用いた本発明の他の実施例を示す工
程図、第３図、第４図および第５図はプリント基
板の二層化方式の従来例を示す断面図である。
２３……絶縁性のシート、２４……導電体、２
５……第一の導電回路、２６……貫通孔、２７…
…金属板、２８……絶縁層、２９……導電体、３
０……第二の導電回路、３１……ソルダーレジス
ト、３２……電子素子等、３３……半田、３４…
…導電物、３５……硬質基板、３６……貫通孔。
FIG. 1 is a process diagram showing one embodiment of the printed circuit board and method for manufacturing the same according to the present invention, FIG. 2 is a process diagram showing another embodiment of the present invention using a hard resin as the substrate, and FIGS. 4 and 5 are cross-sectional views showing a conventional example of a two-layer printed circuit board system. 23... Insulating sheet, 24... Conductor, 2
5...First conductive circuit, 26...Through hole, 27...
... Metal plate, 28 ... Insulating layer, 29 ... Conductor, 3
0... Second conductive circuit, 31... Solder resist, 32... Electronic element, etc., 33... Solder, 34...
...Conductor, 35...Hard substrate, 36...Through hole.
Claims (1)
たシートと、該シートの１面にエツチングにより
形成される第一の導電回路と、前記シートに形成
される貫通孔と、前記シートの他面に熱圧着され
る基板と、該基板上に形成される第二の導電回路
と、前記貫通孔に充填され前記第一および第二の
導電回路を電気的に接続する導電性物質とを備
え、前記第一の導電回路が前記シートにめり込ん
だ状態で固着されたことを特徴とするプリント基
板。 ２ 前記半硬化性を示す樹脂がジアリルフタレー
ト樹脂系組成物であることを特徴とする特許請求
の範囲第１項に記載のプリント基板。 ３ 含浸時において半硬化性を示す樹脂を含浸し
たシートに貫通孔を形成するとともに、該シート
の１面にエツチングにより第一の導電回路を形成
し、一方、基板上に第二の導電回路を形成し、前
記シートの他面に第二の導電回路を熱圧着し、前
記第一の導電回路を前記シートにめり込んだ状態
で固着し、前記貫通孔に導電性物質を充填するこ
とにより、前記第一および第二の導電回路を電気
的に接続することを特徴とするプリント基板の製
造方法。 ４ 含浸時において半硬化性を示す樹脂を含浸し
たシートに第一の貫通孔を形成するとともに、該
シートの１面にエツチングにより第一の導電回路
を形成し、一方、樹脂基板上に前記第一の貫通孔
に対応する位置に第二の貫通孔を形成するととも
に、前記樹脂基板上に第二の導電回路を形成し、
前記シートの他面に第二の導電回路を熱圧着し、
前記第一の導電回路を前記シートにめり込んだ状
態で固着し、前記第一および第二の貫通孔に導電
性物質を充填することにより、前記第一および第
二の導電回路を電気的に接続することを特徴とす
るプリント基板の製造方法。[Scope of Claims] 1. A sheet impregnated with a resin that exhibits semi-curing properties upon impregnation, a first conductive circuit formed by etching on one surface of the sheet, and a through hole formed in the sheet; a substrate thermocompression-bonded to the other surface of the sheet; a second conductive circuit formed on the substrate; and a conductive material filled in the through hole and electrically connecting the first and second conductive circuits. 1. A printed circuit board, characterized in that the first conductive circuit is fixed to the sheet in a recessed state. 2. The printed circuit board according to claim 1, wherein the semi-curable resin is a diallyl phthalate resin composition. 3. A through hole is formed in a sheet impregnated with a resin that exhibits semi-curing properties during impregnation, and a first conductive circuit is formed on one side of the sheet by etching, while a second conductive circuit is formed on the substrate. forming a second conductive circuit on the other surface of the sheet, thermocompression bonding a second conductive circuit to the other surface of the sheet, fixing the first conductive circuit in a recessed state in the sheet, and filling the through hole with a conductive substance. A method for manufacturing a printed circuit board, comprising electrically connecting first and second conductive circuits. 4 A first through hole is formed in a sheet impregnated with a resin that exhibits semi-curing properties during impregnation, and a first conductive circuit is formed on one surface of the sheet by etching, while the first through hole is formed on one surface of the sheet by etching. forming a second through hole at a position corresponding to the first through hole, and forming a second conductive circuit on the resin substrate;
a second conductive circuit is thermocompression bonded to the other side of the sheet;
The first and second conductive circuits are electrically connected by fixing the first conductive circuit into the sheet and filling the first and second through holes with a conductive substance. A method for manufacturing a printed circuit board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24689287A JPS6489586A (en) | 1987-09-30 | 1987-09-30 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24689287A JPS6489586A (en) | 1987-09-30 | 1987-09-30 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6489586A JPS6489586A (en) | 1989-04-04 |
| JPH0543311B2 true JPH0543311B2 (en) | 1993-07-01 |
Family
ID=17155293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24689287A Granted JPS6489586A (en) | 1987-09-30 | 1987-09-30 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6489586A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6252176B1 (en) | 1996-04-19 | 2001-06-26 | Fuji Xerox Co., Ltd. | Printed wiring board, and manufacture thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357285U (en) * | 1989-08-03 | 1991-05-31 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593287A (en) * | 1979-01-08 | 1980-07-15 | Hitachi Ltd | Method of fabricating printed circuit board |
| JPS59232495A (en) * | 1983-06-15 | 1984-12-27 | 松下電工株式会社 | Method of producing multilayer circuit board |
-
1987
- 1987-09-30 JP JP24689287A patent/JPS6489586A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593287A (en) * | 1979-01-08 | 1980-07-15 | Hitachi Ltd | Method of fabricating printed circuit board |
| JPS59232495A (en) * | 1983-06-15 | 1984-12-27 | 松下電工株式会社 | Method of producing multilayer circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6252176B1 (en) | 1996-04-19 | 2001-06-26 | Fuji Xerox Co., Ltd. | Printed wiring board, and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6489586A (en) | 1989-04-04 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |