JP3250390B2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JP3250390B2 JP3250390B2 JP27425194A JP27425194A JP3250390B2 JP 3250390 B2 JP3250390 B2 JP 3250390B2 JP 27425194 A JP27425194 A JP 27425194A JP 27425194 A JP27425194 A JP 27425194A JP 3250390 B2 JP3250390 B2 JP 3250390B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- hole
- wiring pattern
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気機器等の接続に際
して使用されるリジットフレキシブルプリント配線板に
関し、特に多層構造のプリント配線板における層間の配
線パタ−ンを接続する構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rigid flexible printed wiring board used for connection of electric equipment and the like, and more particularly to a structure for connecting wiring patterns between layers in a multilayer printed wiring board.
【０００２】[0002]
【従来の技術】従来、フレキシブルプリント配線板に形
成された配線パターンと、リジットプリント配線に形成
された配線パターンとを電気的に接続されるためには、
例えば図４に示すように、配線パターン２１が形成され
たフレキシブルプリント配線板２に透孔部２２を設ける
ことにより、配線パターン２１の導体部分を端子のよう
に前記透孔部２２の周縁から露出させ、半田メッキ２３
の処理を行なった後、配線パターン１１が形成されたリ
ジットプリント配線板１の上面に接着剤３を介してフレ
キシブルプリント配線板２を積層し、配線パターン１１
と配線パターン２１とを半田４により電気的に接続する
ことが行われていた（特開昭５７−１６２４９３号公報
参照）。2. Description of the Related Art Conventionally, in order to electrically connect a wiring pattern formed on a flexible printed wiring board to a wiring pattern formed on a rigid printed wiring,
For example, as shown in FIG. 4, by providing a through-hole portion 22 on the flexible printed wiring board 2 on which the wiring pattern 21 is formed, the conductor portion of the wiring pattern 21 is exposed from the periphery of the through-hole portion 22 like a terminal. And solder plating 23
After the above-mentioned processing, the flexible printed wiring board 2 is laminated via an adhesive 3 on the upper surface of the rigid printed wiring board 1 on which the wiring pattern 11 is formed, and the wiring pattern 11
And the wiring pattern 21 are electrically connected by the solder 4 (see Japanese Patent Application Laid-Open No. 57-162493).
【０００３】[0003]
【発明が解決しようとする課題】各種の電気機器の接続
に使用されているリジットフレキシブルプリント配線板
は、機器の小型化にともなって部品の実装密度と配線密
度の高密度化が要求され、リジットプリント配線板上に
２層以上のフレキシブルプリント配線板を積層する多層
構造（配線パターンが３層以上）のリジットフレキシブ
ルプリント配線板の実現が望まれていた。しかしなが
ら、図４の示した構造を３層以上のリジットフレキシブ
ルプリント配線板に適用した場合、半田メッキにおける
Ｐｂの表面張力により層間の配線パタ−ンを接続するの
は困難であるという問題が生じる。The rigid flexible printed wiring board used for connection of various electric devices is required to have a high component mounting density and a high wiring density with the miniaturization of the devices. It has been desired to realize a rigid flexible printed wiring board having a multilayer structure (having three or more wiring patterns) in which two or more flexible printed wiring boards are laminated on the printed wiring board. However, when the structure shown in FIG. 4 is applied to a rigid flexible printed wiring board having three or more layers, there is a problem that it is difficult to connect wiring patterns between layers due to the surface tension of Pb in solder plating.
【０００４】本発明は上記実情を鑑みてなされたもの
で、配線の高密度化が図れる３層以上のリジットフレキ
シブルプリント配線板に適したプリント配線板の構造を
提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a structure of a printed wiring board suitable for a rigid flexible printed wiring board having three or more layers and capable of increasing the wiring density.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
請求項１記載の発明は、第１の配線パターンが形成され
た第１のプリント配線板、第２の配線パターンが形成さ
れたフレキシブルな第２のプリント配線板、第３の配線
パターンが形成されたフレキシブルな第３のプリント配
線板を順次積層した多層プリント配線板で構成される。
前記第１の配線パターンの層間接続部分に対応して第２
及び第３のプリント配線板に透孔部を設ける。前記第３
のプリント配線板の透孔部の径を第２のプリント配線板
の透孔部の径より大きく形成する。そして、該透孔部に
導電性材料を充填する際に、導電性材料の量を変えるこ
とにより、第１及び第２の配線パターンの電気的接続
と、第１，第２及び第３の配線パターンの電気的接続と
を選択的に行うことを特徴としている。請求項２記載の
発明は、請求項１に記載の多層プリント配線板におい
て、前記第２及び第３のプリント配線板が半硬化性を有
する材料で構成され、前記第１乃至第３のプリント配線
板が加熱加圧で張り合わせることを特徴としている。 [MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
According to the first aspect of the present invention, the first wiring pattern is formed.
The first printed wiring board and the second wiring pattern are formed.
Flexible second printed wiring board, third wiring
A flexible third print arrangement in which a pattern is formed
It is composed of a multilayer printed wiring board in which wire boards are sequentially laminated.
The second wiring pattern corresponds to the interlayer connection portion of the first wiring pattern.
And providing a through hole in the third printed wiring board. The third
The diameter of the through hole of the printed wiring board of the second printed wiring board
Is formed larger than the diameter of the through hole. And in the through hole
When filling conductive material, change the amount of conductive material.
The electrical connection between the first and second wiring patterns
And electrical connection of the first, second and third wiring patterns
Is selectively performed. Claim 2
The invention relates to a multilayer printed wiring board according to claim 1.
And the second and third printed wiring boards have semi-curing properties.
The first to third printed wiring
It is characterized in that the plates are bonded by heating and pressing.
【０００６】[0006]
【作用】本発明によれば、配線パタ−ンが形成されたプ
リント配線板を積層し、プリント配線板に形成した透孔
部に導電性材料を充填することにより各配線パターン同
士を電気的に接続することができ、３層以上の多層構造
のプリント配線板とすることができる。According to the present invention, printed wiring boards on which wiring patterns are formed are laminated, and a through-hole formed in the printed wiring board is filled with a conductive material to electrically connect the wiring patterns to each other. The printed wiring board can be connected and can have a multilayer structure of three or more layers.
【０００７】本発明によれば、第１の配線パターンの層
間接続部分に対応して第２及び第３のプリント配線板に
透孔部を設け、第３のプリント配線板の透孔部の径を第
２のプリント配線板の透孔部の径より大きく形成し透孔
部の断面形状をすり鉢状とているので、透孔部に導電性
材料を充填する際に、導電性材料が配線パターンに面接
触して確実な導通状態を得るとともに、導電性材料の量
を変えることにより、第１及び第２の配線パターンの電
気的接続と、第１，第２及び第３の配線パターンの電気
的接続とを選択的に容易に行うことができる。 According to the present invention, the layer of the first wiring pattern
For the second and third printed wiring boards corresponding to the connection parts
A through hole is provided, and the diameter of the through hole of the third printed wiring board is
The hole is formed larger than the diameter of the hole of the printed wiring board of No. 2.
Since the cross section of the part is mortar-shaped, conductive
When filling material, conductive material is interviewed with wiring pattern
To ensure a reliable conduction state by touching
Of the first and second wiring patterns by changing
Pneumatic connection and electricity of the first, second and third wiring patterns
Connection can be easily and selectively performed.
【０００８】[0008]
【実施例】本発明にかかる多層プリント配線板の一実施
例について、図１ないし図３を参照しながら説明する。
図２は透孔部が形成されない状態での多層プリント配線
板の平面説明図であり、図１は図２のＡ−Ａ′線断面説
明図である。多層プリント配線板は、図１及び図２に示
すように、配線パタ−ン１１が形成されたリジットプリ
ント配線板（第１のプリント配線板）１，配線パタ−ン
２１が形成されたフレキシブルプリント配線板（第２の
プリント配線板）２，配線パタ−ン３１が形成されたフ
レキシブルプリント配線板（第３のプリント配線板）３
を順次積層して構成されている。この積層構造は、各配
線板を重ね合わせてから熱と圧力をかけることにより、
３層を密着させて得ることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a multilayer printed wiring board according to the present invention will be described with reference to FIGS.
FIG. 2 is an explanatory plan view of the multilayer printed wiring board in a state where no through-hole portion is formed, and FIG. 1 is an explanatory sectional view taken along line AA ′ of FIG. As shown in FIGS. 1 and 2, the multilayer printed wiring board is a rigid printed wiring board (first printed wiring board) on which a wiring pattern 11 is formed, and a flexible print on which a wiring pattern 21 is formed. Wiring board (second printed wiring board) 2, Flexible printed wiring board (third printed wiring board) 3 on which wiring pattern 31 is formed
Are sequentially laminated. By applying heat and pressure after stacking each wiring board,
It can be obtained by adhering three layers.
【０００９】すなわち、リジットプリント配線板１は、
エポキシを主成分とした材料で構成され、フレキシブル
プリント配線板２，３の材料は、例えば特開昭６４−８
９５８６号公報で示されるエポキシを含浸した半硬化材
の不織布（芳香族ポリアミド繊維製）又はガラス織布を
使用し、板厚を７０μｍ，銅箔で構成される配線パター
ンの膜厚を３５μｍとし、前記リジットプリント配線板
１に、例えば１４０℃の熱と４０Ｋｇ／cm2の圧力によ
る加熱加圧で張り合わせ可能な材料で構成されている。That is, the rigid printed wiring board 1
The flexible printed wiring boards 2 and 3 are made of a material containing epoxy as a main component.
No. 9586, a semi-cured nonwoven fabric (made of aromatic polyamide fiber) impregnated with epoxy or a glass woven fabric is used, the thickness is 70 μm, and the thickness of the wiring pattern made of copper foil is 35 μm. The rigid printed wiring board 1 is made of a material that can be bonded to the rigid printed wiring board 1 by, for example, heating at 140 ° C. and heating and pressing with a pressure of 40 kg / cm 2 .
【００１０】フレキシブルプリント配線板２上に形成さ
れた配線パターン２１には、配線が形成されない（銅箔
が着膜されない）円形状の島部２４が設けられている。
各配線パターン同士の電気的接続は、図３に示すよう
に、フレキシブルプリント配線板２に形成した透孔部２
２及びフレキシブルプリント配線板３に形成した透孔部
３２に、導電性材料５を充填することにより行なわれ
る。これら透孔部２２，３２は互いに重なるように各配
線板の平面的に同じ位置に形成されている。この際、各
配線パターン同士の接続は、前記島部２４と透孔部２
２，３２との大小関係により定めることができる。ま
た、導電性材料５の充填は、銅ペ−スト等の導電性材料
を用いた印刷等の方法により容易に行なうことができ
る。The wiring pattern 21 formed on the flexible printed wiring board 2 is provided with a circular island portion 24 on which no wiring is formed (no copper foil is deposited).
As shown in FIG. 3, the electrical connection between the respective wiring patterns is made by a through hole 2 formed in the flexible printed wiring board 2.
2 and the flexible printed wiring board 3 are filled with the conductive material 5 in the through holes 32. These through holes 22 and 32 are formed at the same position in plan on each wiring board so as to overlap each other. At this time, the connection between the wiring patterns is made by the island portion 24 and the through-hole portion 2.
2, 32 can be determined. The filling of the conductive material 5 can be easily performed by a method such as printing using a conductive material such as copper paste.
【００１１】例えば、リジットプリント配線板１上に形
成された配線パターン１１と、フレキシブルプリント配
線板３上に形成された配線パターン３１とを接続する場
合は、図３（ａ）に示すように、フレキシブルプリント
配線板２の透孔部２２及びフレキシブルプリント配線板
３の透孔部３２の大きさを島部２４より小さくし、各透
孔部２２，３２に導電性材料５を充填すれば、配線パタ
−ン１１と配線パタ−ン３１とを接続することができ
る。この場合、リジットプリント配線板１上にフレキシ
ブルプリント配線板２，３を重ね合わせて加熱加圧する
と、フレキシブルプリント配線板３上の配線パターン３
１の一部がフレキシブルプリント配線板２の透孔部２２
内に位置するようになり、フレキシブルプリント配線板
２の裏面がリジットブルプリント配線板１上の配線パタ
ーン１１側に押し出されるので、透孔部２２及び透孔部
３２に充填された導電性材料５と配線パターン２１との
非接触を確実に行なうことができる。For example, when connecting the wiring pattern 11 formed on the rigid printed wiring board 1 and the wiring pattern 31 formed on the flexible printed wiring board 3, as shown in FIG. If the size of the through-hole portion 22 of the flexible printed wiring board 2 and the through-hole portion 32 of the flexible printed wiring board 3 is made smaller than that of the island portion 24 and each of the through-hole portions 22 and 32 is filled with the conductive material 5, wiring can be performed. The pattern 11 and the wiring pattern 31 can be connected. In this case, when the flexible printed wiring boards 2 and 3 are overlaid on the rigid printed wiring board 1 and heated and pressed, the wiring pattern 3 on the flexible printed wiring board 3 is changed.
1 is a through hole 22 of the flexible printed wiring board 2
And the back surface of the flexible printed wiring board 2 is extruded toward the wiring pattern 11 on the rigid printed wiring board 1, so that the conductive material 5 filled in the through holes 22 and 32 is formed. Non-contact with the wiring pattern 21 can be reliably performed.
【００１２】また、リジットプリント配線板１上に形成
された配線パターン１１と、フレキシブルプリント配線
板２上に形成された配線パターン２１とを接続する場合
は、図３（ｂ）に示すように、フレキシブルプリント配
線板２の透孔部２２を島部２４と同じ大きさとし、フレ
キシブルプリント配線板３の透孔部３２の大きさを島部
２４より大きくし、透孔部２２及び透孔部３２の底面の
みに導電性材料５を充填すれば、配線パタ−ン１１と配
線パタ−ン２１とを接続することができる。When connecting the wiring pattern 11 formed on the rigid printed wiring board 1 and the wiring pattern 21 formed on the flexible printed wiring board 2, as shown in FIG. The through hole 22 of the flexible printed wiring board 2 is the same size as the island portion 24, and the size of the through hole 32 of the flexible printed wiring board 3 is larger than that of the island portion 24. If only the bottom surface is filled with the conductive material 5, the wiring pattern 11 and the wiring pattern 21 can be connected.
【００１３】また、リジットプリント配線板１上に形成
された配線パターン１１及びフレキシブルプリント配線
板２上に形成された配線パターン２１と、フレキシブル
プリント配線板３上に形成された配線パターン３１とを
接続する場合は、図３（ｃ）に示すように、フレキシブ
ルプリント配線板２の透孔部２２を島部２４と同じ大き
さとし、フレキシブルプリント配線板３の透孔部３２の
大きさを島部２４より大きくし、透孔部２２及び透孔部
３２に導電性材料５を充填すれば、配線パタ−ン１１，
配線パタ−ン２１及び配線パターン３１とをそれぞれ接
続することができる。The wiring pattern 11 formed on the rigid printed wiring board 1 and the wiring pattern 21 formed on the flexible printed wiring board 2 are connected to the wiring pattern 31 formed on the flexible printed wiring board 3. In this case, as shown in FIG. 3 (c), the through hole 22 of the flexible printed wiring board 2 is made the same size as the island portion 24, and the size of the through hole 32 of the flexible printed wiring board 3 is changed to the island portion 24. When the conductive material 5 is filled in the through holes 22 and 32, the wiring patterns 11 and
The wiring pattern 21 and the wiring pattern 31 can be connected to each other.
【００１４】[0014]
【発明の効果】本発明によれば、配線パターンが形成さ
れたプリント配線板を積層し、プリント配線板に形成し
た透孔部に導電性材料を充填することにより各配線パタ
ーン同士を電気的に接続することができる。その際、第
１の配線パターンの層間接続部分に対応して第２及び第
３のプリント配線板に透孔部を設け、第３のプリント配
線板の透孔部の径を第２のプリント配線板の透孔部の径
より大きく形成し透孔部の断面形状をすり鉢状とている
ので、透孔部に導電性材料を充填する場合に、導電性材
料が配線パターンに面接触して確実な導通状態が得られ
るとともに、導電性材料の量を変えることにより、第１
及び第２の配線パターンの電気的接続と、第１，第２及
び第３の配線パターンの電気的接続とを選択的に容易に
行うことができ汎用性の高い構造とすることができる。 According to the present invention, the printed wiring boards on which the wiring patterns are formed are laminated, and the through holes formed in the printed wiring board are filled with a conductive material to electrically connect the wiring patterns to each other. Can be connected. At that time,
The second and third wiring patterns correspond to the interlayer connection portions of the first wiring pattern.
A third printed wiring board is provided with a through hole, and a third printed wiring board is provided.
The diameter of the through hole of the wire board is determined by the diameter of the through hole of the second printed wiring board.
Formed larger and the cross-sectional shape of the through-hole is mortar-shaped
Therefore, when filling the through hole with a conductive material,
The material is in surface contact with the wiring pattern and a reliable conduction state is obtained.
And by changing the amount of conductive material,
Electrical connection between the first and second wiring patterns;
And electrical connection of the third wiring pattern easily and selectively
The structure can be made highly versatile.
【図１】透孔部を設けていない多層プリント配線板の断
面説明図である。FIG. 1 is an explanatory cross-sectional view of a multilayer printed wiring board without a through-hole.
【図２】透孔部を設けていない多層プリント配線板の平
面説明図である。FIG. 2 is an explanatory plan view of a multilayer printed wiring board having no through hole.
【図３】（ａ）（ｂ）（ｃ）は本発明の実施例にかかる
多層プリント配線板を示すもので、各配線パターンの接
続状態を示す断面説明図である。FIGS. 3A, 3B, and 3C are cross-sectional views showing a multilayer printed wiring board according to an embodiment of the present invention, showing connection states of respective wiring patterns.
【図４】従来のプリント配線板の断面説明図である。FIG. 4 is an explanatory sectional view of a conventional printed wiring board.
１…リジットプリント配線板（第１のプリント配線
板）、 ２…フレキシブルプリント配線板（第２のプリ
ント配線板）、 ３…フレキシブルプリント配線板（第
３のプリント配線板）、 ５…導電性材料、 １１…配
線パターン、 ２１…配線パターン、 ２２…透孔部、
２４…島部、 ３１…配線パターン、 ３２…透孔部DESCRIPTION OF SYMBOLS 1 ... Rigid printed wiring board (1st printed wiring board), 2 ... Flexible printed wiring board (2nd printed wiring board), 3 ... Flexible printed wiring board (3rd printed wiring board), 5 ... Conductive material , 11: wiring pattern, 21: wiring pattern, 22: through-hole part,
24 ... island part, 31 ... wiring pattern, 32 ... through-hole part
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/46 H05K 3/40 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/46 H05K 3/40
Claims (2)
リント配線板、第２の配線パターンが形成されたフレキ
シブルな第２のプリント配線板、第３の配線パターンが
形成されたフレキシブルな第３のプリント配線板を順次
積層した多層プリント配線板であって、前記第１の配線パターンの層間接続部分に対応して第２
及び第３のプリント配線板に透孔部を設け、 前記第３のプリント配線板の透孔部の径を第２のプリン
ト配線板の透孔部の径より大きく形成し、 該透孔部に導電性材料を充填する際に、導電性材料の量
を変えることにより、第１及び第２の配線パターンの電
気的接続と、第１，第２及び第３の配線パターンの電気
的接続とを選択的に行う ことを特徴とする多層プリント
配線板。1. A first printed wiring board having a first wiring pattern formed thereon, a flexible second printed wiring board having a second wiring pattern formed thereon, and a flexible printed wiring board having a third wiring pattern formed thereon. A multilayer printed wiring board in which third printed wiring boards are sequentially laminated, and a second printed wiring board corresponding to an interlayer connection portion of the first wiring pattern.
And a third printed wiring board provided with a through-hole, and the diameter of the through-hole of the third printed wiring board is adjusted by a second printer.
G) is formed to be larger than the diameter of the through hole of the wiring board, and when filling the through hole with a conductive material, the amount of the conductive material
Of the first and second wiring patterns by changing
Pneumatic connection and electricity of the first, second and third wiring patterns
A multilayer printed wiring board characterized in that selective connection is selectively performed .
化性を有する材料で構成され、前記第１乃至第３のプリThe first to third pre-forms, which are made of a material having
ント配線板が加熱加圧で張り合わせることを特徴とするIt is characterized in that the printed circuit board is bonded by heating and pressing
請求項１に記載の多層プリント配線板。The multilayer printed wiring board according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27425194A JP3250390B2 (en) | 1994-10-14 | 1994-10-14 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27425194A JP3250390B2 (en) | 1994-10-14 | 1994-10-14 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08116175A JPH08116175A (en) | 1996-05-07 |
| JP3250390B2 true JP3250390B2 (en) | 2002-01-28 |
Family
ID=17539102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27425194A Expired - Fee Related JP3250390B2 (en) | 1994-10-14 | 1994-10-14 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3250390B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4737389B2 (en) * | 2005-05-30 | 2011-07-27 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| CN103402310B (en) * | 2013-08-06 | 2016-05-11 | 上海美维电子有限公司 | Soft or hard is in conjunction with printed substrate and manufacture method thereof |
-
1994
- 1994-10-14 JP JP27425194A patent/JP3250390B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08116175A (en) | 1996-05-07 |
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