JPS59119891A - Circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a circuit board.

Recently, circuit boards and boards printed with patterns of conductive paint have been proposed. This has the advantage that wiring patterns can be formed simply by printing, and manufacturing can be done in a short time without the need for equipment or waste liquid treatment required for 7-oto-etching. However, carbon-based conductive paints are cheap but have high resistance and cannot be used, while silver threads have low resistance but are too expensive to be put to practical use.

An embodiment of the present invention will be described below based on the drawings. 1st
In the figures and FIG. 2, on the entire surface of an insulating substrate 1, conductive layers 3 made of Al, Cu, etc., which are subdivided by narrow gaps 2 and insulated from each other, are formed to constitute a base substrate.

A conductive paint is printed on this base substrate to form a wiring pattern 4 as shown in FIG. This conductive paint may be an inexpensive one mixed with carbon powder, and even if its resistance is high, the resistance of the conductive layer 3 is low, so that the resistance of the wiring pattern 4 is low, which is sufficient for practical use.

Further, by printing a conductive paint and placing circuit elements and the like before it hardens, there is no need for soldering. Furthermore, since the entire surface of the wafer is electrically conductive, it has good heat dissipation characteristics and can reduce thermal damage to integrated circuits and the like.

When a conductive coating material in which carbon powder is mixed with a heat-sealing resin such as a thermoplastic resin or an unreacted thermosetting resin is used, circuit elements and the like can be fixed by heat-sealing.

In addition, when rubber-based resin is used, conduction can be established by pressure welding. As described above, according to the present invention, a circuit can be easily created by simply printing a finely divided conductive layer and a conductive paint. It is possible to manufacture circuit boards, and it is also possible to lower the resistance of the wiring pattern by using carbon-based conductive paint, which is inexpensive and highly reliable. Additionally, circuit elements and the like can be fixed simply by placing them before the conductive paint hardens. Furthermore, since almost the entire surface is conductive, it has good heat dissipation characteristics and reduces thermal damage to the circuit.

[Brief explanation of drawings]

FIG. 1 is a front view of the base substrate, FIG. 2 is an enlarged front view of a part of FIG. 1, and FIG. 3 is a front view of the base board with wiring patterns formed thereon. 1... Insulating substrate, 2... Gap, 6... Conductive layer, 4... Wiring pattern and above Patent applicant Seikosha Co., Ltd. Representative Patent Attorney Mogami Tsutomu Figure 2

Claims (1)

[Claims] 1. A circuit board characterized in that a wiring pattern is formed using conductive paint on a base substrate having a conductive layer formed on its surface that is divided into parts by narrow gaps and insulated from each other.