JPS60133789A - Circuit board and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit board and a method of manufacturing the same.

Conventional circuit boards are made by attaching steel foil to the rigid I-board, printing wiring patterns using T-pattern etching, etc., and removing the etching resist, on which electronic components are connected by soldering. .

However, with this conventional circuit board, soldering is required to attach and connect electronic components, and with a board like TJSI which has a large number of terminals, the spacing between the terminals is narrow and soldering is difficult.

There are also some items that cannot be soldered, such as LCD panels.

Furthermore, when manufacturing circuit boards, it is necessary to remove the resist after etching, which requires a process.
There were some drawbacks.

The present invention is intended to solve these drawbacks of the conventional example.

According to one of the features of the present invention, a wiring pattern is provided on an insulating substrate, and the wiring pattern is coated with a heat-sealing resin that becomes conductive only in the thickness direction when heat-sealed under pressure. A circuit board is provided.

Next, embodiments of the invention will be described.

In Figure 1.2, an insulating substrate 1 made of synthetic resin, etc.
A conductive layer 2 made of copper, aluminum, etc. is provided thereon.

This may be done by pasting copper foil or aluminum foil, or by vapor deposition. Next, conductive particles (0+ Ou
, Al, N1, etc.) in an amount of less than 50 Vo1% (preferably 5 to 10 fi) is pattern-printed. As this heat fusion resin 6, a thermoplastic resin (
Ethylene polymer system.

Polyester, polyamide, etc.) or unreacted thermosetting resin (thermally modified nylon, epoxy, etc.), which is then added with a tackifier and plasticizer.

An adhesive containing an antioxidant or the like is used.

Next, the conductive layer 2 is etched using the heat-sealing resin 5 as a resist to form a wiring pattern 4. Then, the circuit board 5 shown in Figure 5.4 is completed by cleaning and drying. The chemicals used for etching differ depending on the material of the conductors 1-2, but the heat-sealing resin 3 is one that does not react with these chemicals. In addition, if the same material as the conductive layer 2 is used for the conductive particles mixed in the heat-sealing resin 5, there is a concern that the etching agent may cause an effect, but in reality, the conductive particles that are dissolved by the chemical are exposed to the surface. It's just a thing, so there's no problem.

The heat-sealing resin 5 is insulating in all directions when the circuit board 5 is completed, but becomes conductive only in the thickness direction when the terminals of the electronic component 6 are heated and fused under pressure and cured. At this time, even if the molten resin 3 flows laterally and comes into contact with an adjacent wiring pattern, insulation is maintained in the lateral direction, so there is no risk of short-circuiting. Furthermore, in the completed state, it maintains omnidirectional insulation properties, so there is no need for further insulation coating.

According to the circuit board of the present invention having the above-described structure, electronic components can be easily connected using solder, and even difficult-to-solder components such as T and SI can be easily connected. Even things that cannot be connected can be connected. In addition, there is no possibility of short circuits in the lateral direction, and there is no risk of short circuits even if dust or other wiring touches the resin pattern.

Furthermore, according to the method of manufacturing a circuit board according to the present invention, the heat-sealing resin is used as it is as a resist, so that the step of removing it after etching can be omitted.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, and FIG. 1 is a plan view of a state in which a conductor 1@2 and a heat-sealing resin 5 are provided on an insulating substrate 1, and FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1. , FIG. 6 is a plan view of the completed circuit board, and FIG. 4 is a sectional view taken along line 1-1V in FIG. 5. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Conductive layer, 5... Heat sealing resin, 4... Wiring pattern, 5... Circuit board. Applicant Seikokai Co., Ltd. Agent Patent Attorney Mogami 5- Figure 1 ■7 L Figure 2

Claims (2)

[Claims] (1) A circuit board formed by providing a wiring pattern on an insulating substrate and covering the wiring pattern with a heat-sealing resin that becomes conductive only in the thickness direction when heat-sealed under pressure. (2) A conductive layer is formed on an insulating substrate, and a pattern is printed on the conductive layer with a heat-sealing resin that becomes conductive only in the thickness direction when heat-sealed under pressure. A method for manufacturing a circuit board, characterized in that a wiring pattern is formed by etching the groove t1@ using a resin as a resist.