JPH052867Y2 - - Google Patents
Info
- Publication number
- JPH052867Y2 JPH052867Y2 JP1987109001U JP10900187U JPH052867Y2 JP H052867 Y2 JPH052867 Y2 JP H052867Y2 JP 1987109001 U JP1987109001 U JP 1987109001U JP 10900187 U JP10900187 U JP 10900187U JP H052867 Y2 JPH052867 Y2 JP H052867Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electrodes
- inspected
- intermediate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987109001U JPH052867Y2 (US06818201-20041116-C00086.png) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987109001U JPH052867Y2 (US06818201-20041116-C00086.png) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6415174U JPS6415174U (US06818201-20041116-C00086.png) | 1989-01-25 |
| JPH052867Y2 true JPH052867Y2 (US06818201-20041116-C00086.png) | 1993-01-25 |
Family
ID=31344858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987109001U Expired - Lifetime JPH052867Y2 (US06818201-20041116-C00086.png) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH052867Y2 (US06818201-20041116-C00086.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200716994A (en) * | 2005-09-02 | 2007-05-01 | Jsr Corp | Circuit board inspecting apparatus and circuit board inspecting method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62150175A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Electronics Eng Co Ltd | 格子変換器 |
-
1987
- 1987-07-17 JP JP1987109001U patent/JPH052867Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62150175A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Electronics Eng Co Ltd | 格子変換器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6415174U (US06818201-20041116-C00086.png) | 1989-01-25 |
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