JPH0526747Y2 - - Google Patents

Info

Publication number
JPH0526747Y2
JPH0526747Y2 JP1987102559U JP10255987U JPH0526747Y2 JP H0526747 Y2 JPH0526747 Y2 JP H0526747Y2 JP 1987102559 U JP1987102559 U JP 1987102559U JP 10255987 U JP10255987 U JP 10255987U JP H0526747 Y2 JPH0526747 Y2 JP H0526747Y2
Authority
JP
Japan
Prior art keywords
conductive particles
wiring
resin
thermoplastic resin
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987102559U
Other languages
English (en)
Japanese (ja)
Other versions
JPS648734U (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102559U priority Critical patent/JPH0526747Y2/ja
Publication of JPS648734U publication Critical patent/JPS648734U/ja
Application granted granted Critical
Publication of JPH0526747Y2 publication Critical patent/JPH0526747Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/074—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
JP1987102559U 1987-07-03 1987-07-03 Expired - Lifetime JPH0526747Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (cg-RX-API-DMAC10.html) 1987-07-03 1987-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (cg-RX-API-DMAC10.html) 1987-07-03 1987-07-03

Publications (2)

Publication Number Publication Date
JPS648734U JPS648734U (cg-RX-API-DMAC10.html) 1989-01-18
JPH0526747Y2 true JPH0526747Y2 (cg-RX-API-DMAC10.html) 1993-07-07

Family

ID=31332576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102559U Expired - Lifetime JPH0526747Y2 (cg-RX-API-DMAC10.html) 1987-07-03 1987-07-03

Country Status (1)

Country Link
JP (1) JPH0526747Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4669635B2 (ja) * 2001-07-12 2011-04-13 積水化学工業株式会社 微粒子配置導電接続フィルムの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (ja) * 1985-06-04 1986-12-09 Nec Corp 混成集積回路装置

Also Published As

Publication number Publication date
JPS648734U (cg-RX-API-DMAC10.html) 1989-01-18

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