JPH0525372B2 - - Google Patents
Info
- Publication number
- JPH0525372B2 JPH0525372B2 JP62219896A JP21989687A JPH0525372B2 JP H0525372 B2 JPH0525372 B2 JP H0525372B2 JP 62219896 A JP62219896 A JP 62219896A JP 21989687 A JP21989687 A JP 21989687A JP H0525372 B2 JPH0525372 B2 JP H0525372B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- plating
- coupling agent
- multilayer ceramic
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 22
- 239000003985 ceramic capacitor Substances 0.000 claims description 21
- 239000007822 coupling agent Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000011282 treatment Methods 0.000 description 10
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 241000080590 Niso Species 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62219896A JPS6461904A (en) | 1987-09-01 | 1987-09-01 | Manufacture of laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62219896A JPS6461904A (en) | 1987-09-01 | 1987-09-01 | Manufacture of laminated ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6461904A JPS6461904A (en) | 1989-03-08 |
| JPH0525372B2 true JPH0525372B2 (ko) | 1993-04-12 |
Family
ID=16742735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62219896A Granted JPS6461904A (en) | 1987-09-01 | 1987-09-01 | Manufacture of laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6461904A (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0656824B2 (ja) * | 1991-01-25 | 1994-07-27 | 太陽誘電株式会社 | チップ状電子部品とその製造方法 |
| JP4167360B2 (ja) * | 1999-09-30 | 2008-10-15 | 京セラ株式会社 | チップ型電子部品 |
| US6721166B2 (en) | 2001-04-05 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| US6876537B2 (en) | 1999-10-07 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| CN101346786B (zh) | 2006-03-15 | 2011-07-27 | 株式会社村田制作所 | 叠层型电子元件及其制造方法 |
| JP6852326B2 (ja) * | 2016-09-20 | 2021-03-31 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP6852327B2 (ja) * | 2016-09-20 | 2021-03-31 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP7243487B2 (ja) * | 2019-06-27 | 2023-03-22 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
-
1987
- 1987-09-01 JP JP62219896A patent/JPS6461904A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6461904A (en) | 1989-03-08 |
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