JPS6461904A - Manufacture of laminated ceramic capacitor - Google Patents
Manufacture of laminated ceramic capacitorInfo
- Publication number
- JPS6461904A JPS6461904A JP62219896A JP21989687A JPS6461904A JP S6461904 A JPS6461904 A JP S6461904A JP 62219896 A JP62219896 A JP 62219896A JP 21989687 A JP21989687 A JP 21989687A JP S6461904 A JPS6461904 A JP S6461904A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- external electrode
- electrode
- paste
- conducted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To prevent the deterioration of quality in a plating process while improving reliability by providing a process, in which treatment is conducted by a coupling agent, between a process, in which an external electrode is applied to a tabular capacitor aggregate, and a process in which the external electrode is plated with a metal. CONSTITUTION:An internal-electrode leading-out section for a tabular capacitor aggregate in which a ceramic green sheet and an internal electrode (Ag-Pd, Pb, Ni, Cu, etc.) are laminated is dipped in the paste of Ag or an Ag alloy for an external electrode or the paste is applied to the internal-electrode leading- out section, and the paste is baked. A laminated ceramic capacitor acquired is treated with a coupling agent. Coupling treatment is conducted in such a manner that the baked laminated ceramic capacitor, on which the external electrode is applied, is dipped into the coupling agent (or a solution thereof), and is coupling-treated under decompression in a desiccator. The ceramic capacitor is taken out, and dried. It is preferable that such dipping and drying are performed twice or thrice. Electrolytic metallic plating (approximately pH4.5) by Ni or Cu or the like and electrolytic solder (or Sn, Pb) plating (<pH1-4.5) are conducted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62219896A JPS6461904A (en) | 1987-09-01 | 1987-09-01 | Manufacture of laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62219896A JPS6461904A (en) | 1987-09-01 | 1987-09-01 | Manufacture of laminated ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6461904A true JPS6461904A (en) | 1989-03-08 |
| JPH0525372B2 JPH0525372B2 (en) | 1993-04-12 |
Family
ID=16742735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62219896A Granted JPS6461904A (en) | 1987-09-01 | 1987-09-01 | Manufacture of laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6461904A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250607A (en) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | Chip-shaped electronic parts and their manufacture |
| JP2001102247A (en) * | 1999-09-30 | 2001-04-13 | Kyocera Corp | Chip electronic component |
| WO2002082480A1 (en) * | 2001-04-05 | 2002-10-17 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic device and method of manufacture thereof |
| US6876537B2 (en) | 1999-10-07 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| WO2007119281A1 (en) * | 2006-03-15 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing same |
| JP2018049884A (en) * | 2016-09-20 | 2018-03-29 | 株式会社村田製作所 | Multilayer ceramic electronic component |
| JP2018049885A (en) * | 2016-09-20 | 2018-03-29 | 株式会社村田製作所 | Multilayer ceramic electronic component |
| JP2021007124A (en) * | 2019-06-27 | 2021-01-21 | 株式会社村田製作所 | Method of manufacturing multilayer ceramic capacitor, and multilayer ceramic capacitor |
-
1987
- 1987-09-01 JP JP62219896A patent/JPS6461904A/en active Granted
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250607A (en) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | Chip-shaped electronic parts and their manufacture |
| JP2001102247A (en) * | 1999-09-30 | 2001-04-13 | Kyocera Corp | Chip electronic component |
| US6876537B2 (en) | 1999-10-07 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| WO2002082480A1 (en) * | 2001-04-05 | 2002-10-17 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic device and method of manufacture thereof |
| US6721166B2 (en) | 2001-04-05 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| WO2007119281A1 (en) * | 2006-03-15 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing same |
| JPWO2007119281A1 (en) * | 2006-03-15 | 2009-08-27 | 株式会社村田製作所 | Multilayer electronic component and manufacturing method thereof |
| US7719819B2 (en) | 2006-03-15 | 2010-05-18 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
| JP5188390B2 (en) * | 2006-03-15 | 2013-04-24 | 株式会社村田製作所 | Multilayer electronic component and manufacturing method thereof |
| JP2018049884A (en) * | 2016-09-20 | 2018-03-29 | 株式会社村田製作所 | Multilayer ceramic electronic component |
| JP2018049885A (en) * | 2016-09-20 | 2018-03-29 | 株式会社村田製作所 | Multilayer ceramic electronic component |
| JP2021007124A (en) * | 2019-06-27 | 2021-01-21 | 株式会社村田製作所 | Method of manufacturing multilayer ceramic capacitor, and multilayer ceramic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525372B2 (en) | 1993-04-12 |
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