FR2279303A1 - Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating - Google Patents

Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating

Info

Publication number
FR2279303A1
FR2279303A1 FR7422723A FR7422723A FR2279303A1 FR 2279303 A1 FR2279303 A1 FR 2279303A1 FR 7422723 A FR7422723 A FR 7422723A FR 7422723 A FR7422723 A FR 7422723A FR 2279303 A1 FR2279303 A1 FR 2279303A1
Authority
FR
France
Prior art keywords
metal
connections
soln
layers
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7422723A
Other languages
French (fr)
Other versions
FR2279303B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uralsky Politekhnichesky Institut
Original Assignee
Uralsky Politekhnichesky Institut
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uralsky Politekhnichesky Institut filed Critical Uralsky Politekhnichesky Institut
Priority to FR7422723A priority Critical patent/FR2279303A1/en
Publication of FR2279303A1 publication Critical patent/FR2279303A1/en
Application granted granted Critical
Publication of FR2279303B1 publication Critical patent/FR2279303B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The assemblies consist of alternating layers of metal and dielectric, with connections joining the metal layers together. The connections consist of a solid soln. contg. Hg and a metal which is more electropositive than the metal in the layers. The solid soln. is pref. covered by an electroplated coating. To obtain the connections between the layers, the assembly is dipped into a soln. of metal ions and then into a soln. contg. Hg ions, or vice versa, pref. solns. consisting of (a) Pd, Cu and an inorganic acid; or (b) a silver salt plus ammonia. To assist the deposn. of the metals forming the connections, an alternating current or ultrasonics can be used.
FR7422723A 1974-06-28 1974-06-28 Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating Granted FR2279303A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7422723A FR2279303A1 (en) 1974-06-28 1974-06-28 Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7422723A FR2279303A1 (en) 1974-06-28 1974-06-28 Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating

Publications (2)

Publication Number Publication Date
FR2279303A1 true FR2279303A1 (en) 1976-02-13
FR2279303B1 FR2279303B1 (en) 1977-03-11

Family

ID=9140695

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7422723A Granted FR2279303A1 (en) 1974-06-28 1974-06-28 Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating

Country Status (1)

Country Link
FR (1) FR2279303A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0333564A1 (en) * 1988-03-18 1989-09-20 Regie Nationale Des Usines Renault Electronic rain-detecting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0333564A1 (en) * 1988-03-18 1989-09-20 Regie Nationale Des Usines Renault Electronic rain-detecting device
FR2628840A1 (en) * 1988-03-18 1989-09-22 Renault ELECTRONIC RAIN DETECTION DEVICE

Also Published As

Publication number Publication date
FR2279303B1 (en) 1977-03-11

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Legal Events

Date Code Title Description
ST Notification of lapse