JPH0515296B2 - - Google Patents
Info
- Publication number
- JPH0515296B2 JPH0515296B2 JP62002142A JP214287A JPH0515296B2 JP H0515296 B2 JPH0515296 B2 JP H0515296B2 JP 62002142 A JP62002142 A JP 62002142A JP 214287 A JP214287 A JP 214287A JP H0515296 B2 JPH0515296 B2 JP H0515296B2
- Authority
- JP
- Japan
- Prior art keywords
- external electrode
- ceramic material
- ceramic
- hydrogen ions
- ceramic electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910010293 ceramic material Inorganic materials 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- -1 hydrogen ions Chemical class 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
(a) 産業上の利用分野
この発明は、積層セラミツク電子部品等のセラ
ミツク電子部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a method for manufacturing ceramic electronic components such as laminated ceramic electronic components.
(b) 発明の概要
セラミツクを用いた電子部品として、例えば積
層セラミツクコンデンサ、チツプインダクタ、積
層バリスタ、多層アルミナ基板等が用いられてい
る。これらはセラミツク材に外部電極が形成され
ているが、この外部電極の半田付けによる耐熱性
や半田付け性を向上させるために、外部電極の表
面に更にメツキ金属膜を形成している。この種の
セラミツク電子部品において、この発明は、前記
メツキ金属膜を形成することにより生じる特性の
劣化や信頼性の低下を防止するようにしたもので
ある。(b) Summary of the Invention Examples of electronic components using ceramics include multilayer ceramic capacitors, chip inductors, multilayer varistors, and multilayer alumina substrates. These have external electrodes formed on a ceramic material, but in order to improve the heat resistance and solderability of the external electrodes, a plating metal film is further formed on the surface of the external electrodes. In this type of ceramic electronic component, the present invention is designed to prevent deterioration of characteristics and decrease in reliability caused by forming the plated metal film.
(c) 従来の技術
前述のようなセラミツク電子部品を製造する
際、従来は、まずセラミツク材の表面に外部電極
を形成し、この外部電極にNi，Sn等を電解メツ
キしている。第２図は積層セラミツクコンデンサ
の外部電極に電解メツキを行つた場合の部品の部
分断面を表している。図において１１〜１８は
各々セラミツク材、２１〜２７はPd，Ag／Pd，
Pt等の金属材料からなる内部電極を表し、セラ
ミツク材の端部に外部電極３が形成されている。
この外部電極３は通常Agペーストの塗布、焼き
付けによつて形成される。ところが、このままで
はAgは半田付けの際、半田くわれの問題があり、
そのために、外部電極３の表面にさらにNiやCu
等の金属膜４が電解メツキされる。しかし、この
ままでは半田付け性が良くないため、更に半田や
Sn等の金属膜５が電解メツキされている。(c) Prior Art When manufacturing ceramic electronic components such as those described above, conventionally, an external electrode is first formed on the surface of the ceramic material, and this external electrode is electrolytically plated with Ni, Sn, etc. FIG. 2 shows a partial cross section of a multilayer ceramic capacitor whose external electrodes are electrolytically plated. In the figure, 11 to 18 are ceramic materials, 21 to 27 are Pd, Ag/Pd,
It represents an internal electrode made of a metal material such as Pt, and an external electrode 3 is formed at the end of the ceramic material.
This external electrode 3 is usually formed by applying and baking Ag paste. However, as it is, Ag has the problem of solder cracks when soldering.
For this purpose, Ni and Cu are added to the surface of the external electrode 3.
A metal film 4 such as the above is electrolytically plated. However, the solderability is not good as it is, so further soldering and
A metal film 5 made of Sn or the like is electrolytically plated.
(d) 発明が解決しようとする問題点
ところが、このような従来のセラミツク電子部
品においては例えばNiを電解メツキする際、次
のような化学反応が行われる。(d) Problems to be Solved by the Invention However, in such conventional ceramic electronic parts, when electrolytically plating Ni, for example, the following chemical reaction takes place.
（CH3）2NHBH3＋3Ni2+
＋3H2Ｏ→
3Ni＋（CH3）2NH2 +
＋H3BO3＋5H+
このようにして発生した水素イオン（H+）は
メツキ液とともに外部電極やセラミツクの微細な
空隙部（ポーラス）を通して、部品内部に侵入
し、内部電極に吸蔵され、周囲のセラミツク材を
徐々に還元し、誘電損失の劣化や絶縁抵抗の劣化
を招くという問題があつた。 (CH 3 ) 2 NHBH 3 +3Ni 2+ +3H 2 O→ 3Ni+ (CH 3 ) 2 NH 2 + +H 3 BO 3 +5H + Hydrogen ions (H + ) generated in this way are transferred to the external electrode and ceramic together with the plating solution. The problem was that it penetrated into the interior of the component through minute voids (porous), was occluded by the internal electrodes, and gradually reduced the surrounding ceramic material, causing deterioration of dielectric loss and insulation resistance.
そこで、この発明は、このような問題を解消し
て、外部電極にメツキ金属膜を形成することによ
り生じる特性の劣化や信頼性の低下を防止するよ
うにしたセラミツク電子部品の製造方法を提供す
るものである。 SUMMARY OF THE INVENTION Therefore, the present invention provides a method for manufacturing ceramic electronic components that eliminates such problems and prevents deterioration of characteristics and decrease in reliability caused by forming a plating metal film on the external electrode. It is something.
(e) 問題点を解決するための手段
この発明のセラミツク電子部品の製造方法は、
セラミツク材の表面に外部電極を形成し、この外
部電極にメツキ金属膜を形成するセラミツク電子
部品の製造方法において、
外部電極が形成されたセラミツク材を減圧し、
水素イオンと反応してこれを中和させる溶液に浸
漬した後、加圧する工程を含むことを特徴として
いる。(e) Means for solving the problems The method for manufacturing ceramic electronic components of the present invention is as follows:
In a method for manufacturing ceramic electronic components in which an external electrode is formed on the surface of a ceramic material and a plating metal film is formed on the external electrode, the ceramic material on which the external electrode is formed is depressurized,
It is characterized by including a step of applying pressure after being immersed in a solution that reacts with and neutralizes hydrogen ions.
(f) 作用
以上のようにしてセラミツク電子部品を製造す
ることにより、セラミツク材が減圧されたとき、
セラミツク材に残留していた空気が除去される。
次に、前記溶液に浸漬され、加圧されることによ
り、セラミツク材の内部に前記溶液が注入され
る。したがつてその後、セラミツク材の外部電極
にメツキ金属膜を形成するとき、前述の化学反応
によつて発生した水素イオンが部品内部に侵入し
たとしても、内部に注入されている溶液と反応し
て、H2Ｏとなり、水素イオンは消滅し、セラミ
ツク材の還元が防止される。また、逆に、外部電
極にメツキを施した後、前記工程によつて、セラ
ミツク材中に溶液を注入した場合も、部品内部に
侵入した水素イオンが溶液と反応して、H2Ｏと
なつて水素イオンは消滅する。いずれも水素イオ
ンと反応して生成されたH2Ｏはその後乾燥除去
されることになる。(f) Effect When the ceramic material is depressurized by manufacturing ceramic electronic components as described above,
Air remaining in the ceramic material is removed.
Next, the solution is injected into the interior of the ceramic material by being immersed in the solution and pressurized. Therefore, when a plating metal film is subsequently formed on the external electrode of the ceramic material, even if the hydrogen ions generated by the aforementioned chemical reaction enter the inside of the component, they will not react with the solution injected inside. , H 2 O, hydrogen ions disappear, and reduction of the ceramic material is prevented. Conversely, if a solution is injected into the ceramic material in the above process after plating the external electrode, the hydrogen ions that have entered the inside of the part will react with the solution and become H 2 O. The hydrogen ions disappear. In either case, H 2 O produced by reaction with hydrogen ions is then removed by drying.
(g) 実施例
第１図はこの発明のセラミツク電子部品の製造
方法の手順を表すフローチヤートである。次に各
処理毎に説明を行う。(g) Example FIG. 1 is a flowchart showing the steps of the method for manufacturing ceramic electronic components of the present invention. Next, each process will be explained.
(1) セラミツク材の表面に外部電極が形成された
素子本体を洗浄し、素子本体表面の汚れを除去
し、後の工程に悪影響を及ぼさないようにす
る。(1) Clean the element body, on which external electrodes are formed on the surface of the ceramic material, to remove dirt on the surface of the element body, and to prevent it from adversely affecting subsequent processes.
(2) 素子本体を減圧室に入れて減圧処理を行う。
これにより素子本体内部の残留空気を除去す
る。(2) Place the device body in a decompression chamber and perform depressurization treatment.
This removes residual air inside the element body.
(3) 減圧状態のままH2O2液に浸漬する。(3) Immerse in H 2 O 2 solution under reduced pressure.
(4) H2O2液に浸漬した状態で加圧（１〜2500
Kg／cm2）処理を行う。これにより、素子本体内
の微細な空隙部（ポーラス）にH2O2を注入す
る。(4) Pressurize (1 to 2500
Kg/cm 2 ) treatment. As a result, H 2 O 2 is injected into minute cavities (porous) within the element body.
(5) この状態で、または大気圧の下でセラミツク
材の表面に形成されている外部電極に電解メツ
キを行う。(5) Electroplating is performed on the external electrode formed on the surface of the ceramic material in this state or under atmospheric pressure.
(6) 素子本体を加熱（100〜200℃）することによ
り、素子本体の表面を清浄し、更に前述の化学
反応により生じたH2Ｏを除去する。(6) By heating the element body (100 to 200°C), the surface of the element body is cleaned and H 2 O produced by the above-mentioned chemical reaction is removed.
以上のようにして外部電極に金属膜が電解メツ
キされたセラミツク電子部品が得られる。 In the manner described above, a ceramic electronic component whose external electrodes are electrolytically plated with a metal film is obtained.
尚、実施例では水素イオンを中和する溶液とし
てH2O2を用いたが、これ以外に、O2-または
OH-を容易に放出する物質を用いることができ
る。また、加圧処理において１〜2500Kg／cm2が実
用範囲であるが、これ以上の圧力で加圧を行つて
も有効である。更に、実施例ではセラミツク材中
にH2O2を注入した後、メツキ処理を行う例であ
つたが、先にメツキ処理を行つてから、減圧処理
→H2O2液浸漬→加圧処理を行つても、セラミツ
ク材中の水素イオンを中和させることができる。 In the examples, H 2 O 2 was used as a solution to neutralize hydrogen ions, but in addition to this, O 2- or
Substances that readily release OH - can be used. Further, although the practical range of pressure treatment is 1 to 2500 kg/cm 2 , it is also effective to pressurize at a pressure higher than this. Furthermore, in the example, the plating treatment was performed after H 2 O 2 was injected into the ceramic material, but after the plating treatment was performed first, the process was performed by reducing pressure treatment → immersion in H 2 O 2 liquid → pressurization treatment. Even if this is done, the hydrogen ions in the ceramic material can be neutralized.
(h) 発明の効果
以上のようにこの発明によれば、セラミツク材
の表面に形成された外部電極に金属膜を電解メツ
キする場合、電解メツキの際生じる水素イオンに
よる悪影響を防止することができる。すなわち、
セラミツク電子部品の誘電損失や静電容量等の初
期特性と高温負荷や湿中負荷における絶縁抵抗の
劣化等に対して信頼性を向上させることができ
る。(h) Effects of the Invention As described above, according to the present invention, when a metal film is electrolytically plated on an external electrode formed on the surface of a ceramic material, it is possible to prevent the adverse effects of hydrogen ions generated during electrolytic plating. . That is,
It is possible to improve the reliability of ceramic electronic components against initial characteristics such as dielectric loss and capacitance, as well as deterioration of insulation resistance under high-temperature loads and humid loads.
第１図はこの発明の実施例であるセラミツク電
子部品の製造方法の手順を表すフローチヤート、
第２図はこの発明が適応される一例である積層セ
ラミツクコンデンサの部分断面図である。
FIG. 1 is a flowchart showing the steps of a method for manufacturing ceramic electronic components according to an embodiment of the present invention.
FIG. 2 is a partial sectional view of a multilayer ceramic capacitor to which the present invention is applied.
Claims (1)
の外部電極上にさらにメツキ金属膜を形成するセ
ラミツク電子部品の製造方法において、 外部電極が形成されたセラミツク材を減圧し、
水素イオンと反応してこれを中和させる溶液に浸
漬した後、加圧する工程を含むことを特徴とする
セラミツク電子部品の製造方法。[Claims] 1. A method for manufacturing a ceramic electronic component in which an external electrode is formed on the surface of a ceramic material, and a plating metal film is further formed on the external electrode, comprising: reducing the pressure of the ceramic material on which the external electrode is formed;
A method for manufacturing ceramic electronic parts, comprising the steps of immersing them in a solution that reacts with hydrogen ions to neutralize them, and then applying pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62002142A JPS63169712A (en) | 1987-01-08 | 1987-01-08 | Manufacture of ceramic electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62002142A JPS63169712A (en) | 1987-01-08 | 1987-01-08 | Manufacture of ceramic electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63169712A JPS63169712A (en) | 1988-07-13 |
| JPH0515296B2 true JPH0515296B2 (en) | 1993-03-01 |
Family
ID=11521092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62002142A Granted JPS63169712A (en) | 1987-01-08 | 1987-01-08 | Manufacture of ceramic electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169712A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021100020A (en) * | 2019-12-20 | 2021-07-01 | 太陽誘電株式会社 | Multilayer ceramic electronic component and manufacturing method thereof |
-
1987
- 1987-01-08 JP JP62002142A patent/JPS63169712A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63169712A (en) | 1988-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |