JPH0524667B2 - - Google Patents

Info

Publication number
JPH0524667B2
JPH0524667B2 JP57228408A JP22840882A JPH0524667B2 JP H0524667 B2 JPH0524667 B2 JP H0524667B2 JP 57228408 A JP57228408 A JP 57228408A JP 22840882 A JP22840882 A JP 22840882A JP H0524667 B2 JPH0524667 B2 JP H0524667B2
Authority
JP
Japan
Prior art keywords
wire
circuit
inspected
inspection
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57228408A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59119843A (ja
Inventor
Hiroyuki Tsukahara
Masahito Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57228408A priority Critical patent/JPS59119843A/ja
Publication of JPS59119843A publication Critical patent/JPS59119843A/ja
Publication of JPH0524667B2 publication Critical patent/JPH0524667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H10W72/07531—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP57228408A 1982-12-27 1982-12-27 自動ワイヤ検査装置 Granted JPS59119843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57228408A JPS59119843A (ja) 1982-12-27 1982-12-27 自動ワイヤ検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57228408A JPS59119843A (ja) 1982-12-27 1982-12-27 自動ワイヤ検査装置

Publications (2)

Publication Number Publication Date
JPS59119843A JPS59119843A (ja) 1984-07-11
JPH0524667B2 true JPH0524667B2 (cg-RX-API-DMAC10.html) 1993-04-08

Family

ID=16875996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57228408A Granted JPS59119843A (ja) 1982-12-27 1982-12-27 自動ワイヤ検査装置

Country Status (1)

Country Link
JP (1) JPS59119843A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2648974B2 (ja) * 1990-02-05 1997-09-03 株式会社カイジョー ワイヤリング検査可能なワイヤボンディング装置及びその方法並びにワイヤリング自動検査装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire

Also Published As

Publication number Publication date
JPS59119843A (ja) 1984-07-11

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