JPH0522380B2 - - Google Patents
Info
- Publication number
- JPH0522380B2 JPH0522380B2 JP58038486A JP3848683A JPH0522380B2 JP H0522380 B2 JPH0522380 B2 JP H0522380B2 JP 58038486 A JP58038486 A JP 58038486A JP 3848683 A JP3848683 A JP 3848683A JP H0522380 B2 JPH0522380 B2 JP H0522380B2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- film
- resist film
- forming
- fine pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3848683A JPS59163828A (ja) | 1983-03-09 | 1983-03-09 | 微細パタ−ンの形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3848683A JPS59163828A (ja) | 1983-03-09 | 1983-03-09 | 微細パタ−ンの形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59163828A JPS59163828A (ja) | 1984-09-14 |
JPH0522380B2 true JPH0522380B2 (enrdf_load_stackoverflow) | 1993-03-29 |
Family
ID=12526584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3848683A Granted JPS59163828A (ja) | 1983-03-09 | 1983-03-09 | 微細パタ−ンの形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59163828A (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS514446B2 (enrdf_load_stackoverflow) * | 1971-09-27 | 1976-02-12 | ||
JPS57143826A (en) * | 1981-02-28 | 1982-09-06 | Dainippon Printing Co Ltd | Formation of resist pattern on gapped semiconductor substrate |
JPS5812344A (ja) * | 1981-07-16 | 1983-01-24 | Nec Corp | 半導体装置 |
-
1983
- 1983-03-09 JP JP3848683A patent/JPS59163828A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59163828A (ja) | 1984-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6383952B1 (en) | RELACS process to double the frequency or pitch of small feature formation | |
KR0147976B1 (ko) | 박막 헤드의 패턴 평탄화 방법 | |
US5256248A (en) | Method for patterning semiconductor | |
JPH02266517A (ja) | 半導体装置の製造方法 | |
JPH0522380B2 (enrdf_load_stackoverflow) | ||
JPH0458167B2 (enrdf_load_stackoverflow) | ||
JPH04348030A (ja) | 傾斜エッチング法 | |
JPS6211491B2 (enrdf_load_stackoverflow) | ||
JPS63307739A (ja) | 半導体装置の製造方法 | |
JPH09127678A (ja) | 半導体集積回路デバイスにおける金属マスクの製造方法 | |
JP3282207B2 (ja) | 透過型位相シフトマスクおよびその製造方法 | |
JPH03104127A (ja) | 微細パターンの形成方法 | |
JPH03142466A (ja) | 半導体装置の製造方法及びそれに用いられるマスク | |
JPS58100434A (ja) | リフトオフ用スペ−サ−の形成方法 | |
JP2597424B2 (ja) | 半導体装置の製造方法 | |
JPS62286230A (ja) | 薄膜の選択食刻方法 | |
JP2690378B2 (ja) | 微細パターンの形成方法 | |
JPH03104113A (ja) | レジストパターンの形成方法 | |
KR930006133B1 (ko) | 모스소자의 콘택트홀 형성방법 | |
JPH0294439A (ja) | 半導体装置の製造方法 | |
JPH01273313A (ja) | パターニング方法 | |
JPH0675360A (ja) | レチクル及びそれを用いた半導体装置の製造方法 | |
JPS6211783B2 (enrdf_load_stackoverflow) | ||
JPH03250619A (ja) | パターン形成方法 | |
JPH01304457A (ja) | パターン形成方法 |