JPH0520901B2 - - Google Patents

Info

Publication number
JPH0520901B2
JPH0520901B2 JP59027737A JP2773784A JPH0520901B2 JP H0520901 B2 JPH0520901 B2 JP H0520901B2 JP 59027737 A JP59027737 A JP 59027737A JP 2773784 A JP2773784 A JP 2773784A JP H0520901 B2 JPH0520901 B2 JP H0520901B2
Authority
JP
Japan
Prior art keywords
wiring board
pellet
semiconductor device
substrate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59027737A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60170944A (ja
Inventor
Yukio Kashio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP59027737A priority Critical patent/JPS60170944A/ja
Publication of JPS60170944A publication Critical patent/JPS60170944A/ja
Publication of JPH0520901B2 publication Critical patent/JPH0520901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59027737A 1984-02-16 1984-02-16 半導体装置と基板の取付方法 Granted JPS60170944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59027737A JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59027737A JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Publications (2)

Publication Number Publication Date
JPS60170944A JPS60170944A (ja) 1985-09-04
JPH0520901B2 true JPH0520901B2 (cg-RX-API-DMAC10.html) 1993-03-22

Family

ID=12229340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59027737A Granted JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Country Status (1)

Country Link
JP (1) JPS60170944A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2982952B2 (ja) * 1996-03-21 1999-11-29 株式会社日立製作所 半導体装置
JP7567260B2 (ja) * 2020-07-31 2024-10-16 日本電気株式会社 量子デバイスの製造方法

Also Published As

Publication number Publication date
JPS60170944A (ja) 1985-09-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term