JPS60170944A - 半導体装置と基板の取付方法 - Google Patents

半導体装置と基板の取付方法

Info

Publication number
JPS60170944A
JPS60170944A JP59027737A JP2773784A JPS60170944A JP S60170944 A JPS60170944 A JP S60170944A JP 59027737 A JP59027737 A JP 59027737A JP 2773784 A JP2773784 A JP 2773784A JP S60170944 A JPS60170944 A JP S60170944A
Authority
JP
Japan
Prior art keywords
substrate
pellet
semiconductor device
wiring board
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59027737A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0520901B2 (cg-RX-API-DMAC10.html
Inventor
Yukio Kashio
幸雄 樫尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP59027737A priority Critical patent/JPS60170944A/ja
Publication of JPS60170944A publication Critical patent/JPS60170944A/ja
Publication of JPH0520901B2 publication Critical patent/JPH0520901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59027737A 1984-02-16 1984-02-16 半導体装置と基板の取付方法 Granted JPS60170944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59027737A JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59027737A JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Publications (2)

Publication Number Publication Date
JPS60170944A true JPS60170944A (ja) 1985-09-04
JPH0520901B2 JPH0520901B2 (cg-RX-API-DMAC10.html) 1993-03-22

Family

ID=12229340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59027737A Granted JPS60170944A (ja) 1984-02-16 1984-02-16 半導体装置と基板の取付方法

Country Status (1)

Country Link
JP (1) JPS60170944A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH08241937A (ja) * 1996-03-21 1996-09-17 Hitachi Ltd 半導体装置
JP2022026927A (ja) * 2020-07-31 2022-02-10 日本電気株式会社 ホルダ、量子デバイス、及び、量子デバイスの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH08241937A (ja) * 1996-03-21 1996-09-17 Hitachi Ltd 半導体装置
JP2022026927A (ja) * 2020-07-31 2022-02-10 日本電気株式会社 ホルダ、量子デバイス、及び、量子デバイスの製造方法

Also Published As

Publication number Publication date
JPH0520901B2 (cg-RX-API-DMAC10.html) 1993-03-22

Similar Documents

Publication Publication Date Title
US6770971B2 (en) Semiconductor device and method of fabricating the same
US5048179A (en) IC chip mounting method
US6603191B2 (en) Semiconductor device and method of manufacturing the same
US6093970A (en) Semiconductor device and method for manufacturing the same
US4526859A (en) Metallization of a ceramic substrate
US4466181A (en) Method for mounting conjoined devices
JPH07211995A (ja) インピーダンス制御された可撓性回路の形成方法およびその装置
US5030318A (en) Method of making electrical probe diaphragms
CN209045531U (zh) 一种半导体芯片封装结构
US6372620B1 (en) Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
GB1186974A (en) Improvements in or relating to the Mounting of Integrated Circuit Members.
JPS60170944A (ja) 半導体装置と基板の取付方法
JP2597396B2 (ja) シリコーンゴム膜のパターン形成方法
US20030111721A1 (en) Semiconductor device, stacked type semiconductor device, and manufacturing method of semiconductor device
JP2869907B2 (ja) 半導体装置の接続構造
JP3410651B2 (ja) 半導体装置及びその製造方法
JPH11204519A (ja) 半導体装置及びその製造方法
JP2982703B2 (ja) 半導体パッケージ及びその製造方法
JP2714691B2 (ja) 電子部品搭載用基板の製造方法
JP3445441B2 (ja) 半導体装置
JPS6399995A (ja) Ｉｃカ−ド及びその製造方法
JP3192087B2 (ja) 半導体装置およびその製造方法
JP2535977B2 (ja) 電子部品における外部電極の形成方法
JP2684757B2 (ja) 半導体装置パッケージ
JPH0795556B2 (ja) テープキャリアの製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term