JPH0519982B2 - - Google Patents

Info

Publication number
JPH0519982B2
JPH0519982B2 JP61289341A JP28934186A JPH0519982B2 JP H0519982 B2 JPH0519982 B2 JP H0519982B2 JP 61289341 A JP61289341 A JP 61289341A JP 28934186 A JP28934186 A JP 28934186A JP H0519982 B2 JPH0519982 B2 JP H0519982B2
Authority
JP
Japan
Prior art keywords
aluminum
pad electrode
slit
lead
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61289341A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63141330A (ja
Inventor
Atsushi Kishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61289341A priority Critical patent/JPS63141330A/ja
Publication of JPS63141330A publication Critical patent/JPS63141330A/ja
Publication of JPH0519982B2 publication Critical patent/JPH0519982B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/075—
    • H10W72/07532—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/59—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP61289341A 1986-12-03 1986-12-03 半導体集積回路装置 Granted JPS63141330A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61289341A JPS63141330A (ja) 1986-12-03 1986-12-03 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61289341A JPS63141330A (ja) 1986-12-03 1986-12-03 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS63141330A JPS63141330A (ja) 1988-06-13
JPH0519982B2 true JPH0519982B2 (enExample) 1993-03-18

Family

ID=17741946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61289341A Granted JPS63141330A (ja) 1986-12-03 1986-12-03 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS63141330A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0170316B1 (ko) * 1995-07-13 1999-02-01 김광호 반도체 장치의 패드 설계 방법
CN100530577C (zh) * 2004-10-29 2009-08-19 斯班逊有限公司 半导体装置及制造方法
JP4533804B2 (ja) 2005-06-02 2010-09-01 セイコーエプソン株式会社 半導体装置及びその製造方法
JP5017872B2 (ja) * 2006-02-06 2012-09-05 富士通セミコンダクター株式会社 半導体装置及びその製造方法
KR100903696B1 (ko) * 2007-05-22 2009-06-18 스펜션 엘엘씨 반도체 장치 및 그 제조 방법
JP2009111073A (ja) * 2007-10-29 2009-05-21 Elpida Memory Inc 半導体装置
US8836150B2 (en) * 2010-11-29 2014-09-16 Toyota Jidosha Kabushiki Kaisha Semiconductor device
JP5922331B2 (ja) * 2011-02-02 2016-05-24 ラピスセミコンダクタ株式会社 半導体装置の配線構造及びその製造方法
JP5806137B2 (ja) * 2012-01-27 2015-11-10 京セラ株式会社 配線基板および電子装置

Also Published As

Publication number Publication date
JPS63141330A (ja) 1988-06-13

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