JPH0519822B2 - - Google Patents

Info

Publication number
JPH0519822B2
JPH0519822B2 JP58053531A JP5353183A JPH0519822B2 JP H0519822 B2 JPH0519822 B2 JP H0519822B2 JP 58053531 A JP58053531 A JP 58053531A JP 5353183 A JP5353183 A JP 5353183A JP H0519822 B2 JPH0519822 B2 JP H0519822B2
Authority
JP
Japan
Prior art keywords
conductivity type
concentration impurity
impurity region
region
epitaxial layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58053531A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59181048A (ja
Inventor
Katsuhiro Kawabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58053531A priority Critical patent/JPS59181048A/ja
Publication of JPS59181048A publication Critical patent/JPS59181048A/ja
Publication of JPH0519822B2 publication Critical patent/JPH0519822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • H10D84/854Complementary IGFETs, e.g. CMOS comprising arrangements for preventing bipolar actions between the different IGFET regions, e.g. arrangements for latchup prevention

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP58053531A 1983-03-31 1983-03-31 相補型半導体装置の製造方法 Granted JPS59181048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58053531A JPS59181048A (ja) 1983-03-31 1983-03-31 相補型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58053531A JPS59181048A (ja) 1983-03-31 1983-03-31 相補型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59181048A JPS59181048A (ja) 1984-10-15
JPH0519822B2 true JPH0519822B2 (enrdf_load_stackoverflow) 1993-03-17

Family

ID=12945391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58053531A Granted JPS59181048A (ja) 1983-03-31 1983-03-31 相補型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59181048A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128555A (ja) * 1984-11-27 1986-06-16 Mitsubishi Electric Corp 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310984A (en) * 1976-07-17 1978-01-31 Mitsubishi Electric Corp Complementary type mos integrated circuit
JPS5493981A (en) * 1978-01-09 1979-07-25 Toshiba Corp Semiconductor device
JPS5575265A (en) * 1978-12-01 1980-06-06 Fujitsu Ltd Complementary type field-effect metal-insulator- semiconductor device
JPS5919347A (ja) * 1982-07-23 1984-01-31 Matsushita Electric Ind Co Ltd 半導体集積回路およびその製造方法

Also Published As

Publication number Publication date
JPS59181048A (ja) 1984-10-15

Similar Documents

Publication Publication Date Title
KR100275962B1 (ko) 반도체장치 및 그의 제조방법_
JP2965783B2 (ja) 半導体装置およびその製造方法
US4805008A (en) Semiconductor device having MOSFET and deep polycrystalline silicon region
JP2004515915A (ja) 基板ウェハの層
JPH06151723A (ja) モノリシック半導体素子のバイポーラトランジスタ構造、及び前記モノリシック半導体素子の製造方法
JP3958388B2 (ja) 半導体装置
US4724221A (en) High-speed, low-power-dissipation integrated circuits
EP0118102B1 (en) Method for manufacturing a semiconductor device
JPS5914897B2 (ja) 半導体装置
EP0138563A2 (en) Lateral transistors
JPH0582986B2 (enrdf_load_stackoverflow)
JPH04348065A (ja) 半導体装置およびその製造方法
JPH0519822B2 (enrdf_load_stackoverflow)
US6362037B1 (en) Semiconductor device and method of fabricating same
JPS60117654A (ja) 相補型半導体装置
JP2508218B2 (ja) 相補型mis集積回路
JP2611450B2 (ja) 半導体集積回路及びその製造方法
JP2594296B2 (ja) 絶縁ゲート電界効果トランジスタ
KR19990065744A (ko) 콜렉터와 에미터 사이에 다이오드를 내장한 바이폴라 트랜지스터 및 그 제조방법
JPS60105265A (ja) 相補型半導体装置の製造方法
JPS61501736A (ja) Vlsi用ラッチ・アップ抵抗性cmos構造
JPS6235666A (ja) Mosトランジスタ
KR940001257B1 (ko) 반도체 소자 제조방법
KR100218263B1 (ko) 반도체 장치 및 그 제조 방법
JPH04234161A (ja) ダブルド―プされたチャネルストップ層を有する半導体装置およびその製造方法