JPH0517481B2 - - Google Patents

Info

Publication number
JPH0517481B2
JPH0517481B2 JP58165075A JP16507583A JPH0517481B2 JP H0517481 B2 JPH0517481 B2 JP H0517481B2 JP 58165075 A JP58165075 A JP 58165075A JP 16507583 A JP16507583 A JP 16507583A JP H0517481 B2 JPH0517481 B2 JP H0517481B2
Authority
JP
Japan
Prior art keywords
inspected
dimensional
pattern
signal
image signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58165075A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6057929A (ja
Inventor
Yoshimasa Ooshima
Yasuhiko Hara
Hiroshi Makihira
Satoshi Fushimi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58165075A priority Critical patent/JPS6057929A/ja
Priority to DE8484104785T priority patent/DE3476916D1/de
Priority to US06/604,998 priority patent/US4614430A/en
Priority to EP84104785A priority patent/EP0124113B1/en
Publication of JPS6057929A publication Critical patent/JPS6057929A/ja
Publication of JPH0517481B2 publication Critical patent/JPH0517481B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58165075A 1983-04-28 1983-09-09 パターン欠陥検出装置 Granted JPS6057929A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58165075A JPS6057929A (ja) 1983-09-09 1983-09-09 パターン欠陥検出装置
DE8484104785T DE3476916D1 (en) 1983-04-28 1984-04-27 Method of detecting pattern defect and its apparatus
US06/604,998 US4614430A (en) 1983-04-28 1984-04-27 Method of detecting pattern defect and its apparatus
EP84104785A EP0124113B1 (en) 1983-04-28 1984-04-27 Method of detecting pattern defect and its apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58165075A JPS6057929A (ja) 1983-09-09 1983-09-09 パターン欠陥検出装置

Publications (2)

Publication Number Publication Date
JPS6057929A JPS6057929A (ja) 1985-04-03
JPH0517481B2 true JPH0517481B2 (enrdf_load_html_response) 1993-03-09

Family

ID=15805389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58165075A Granted JPS6057929A (ja) 1983-04-28 1983-09-09 パターン欠陥検出装置

Country Status (1)

Country Link
JP (1) JPS6057929A (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877326A (en) 1988-02-19 1989-10-31 Kla Instruments Corporation Method and apparatus for optical inspection of substrates
US6516085B1 (en) * 1999-05-03 2003-02-04 Kla-Tencor Apparatus and methods for collecting global data during a reticle inspection
JP2005308464A (ja) 2004-04-20 2005-11-04 Dainippon Screen Mfg Co Ltd 欠陥検出装置および欠陥検出方法
US11644426B2 (en) * 2020-08-11 2023-05-09 Applied Materials Israel Ltd. Methods and systems for generating calibration data for wafer analysis

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194304A (en) * 1981-05-27 1982-11-29 Hitachi Ltd Inspecting method for circuit pattern

Also Published As

Publication number Publication date
JPS6057929A (ja) 1985-04-03

Similar Documents

Publication Publication Date Title
EP0124113B1 (en) Method of detecting pattern defect and its apparatus
KR900007434B1 (ko) 패턴 검사 장치
KR20060031649A (ko) 패턴 비교 검사 방법 및 패턴 비교 검사 장치
JPH0621769B2 (ja) パタ−ン欠陥検出方法およびその装置
US6456318B1 (en) Defect inspection apparatus and method by comparing two pairs of areas adjacent to one another
US7415362B2 (en) Image defect inspection apparatus
JP4230880B2 (ja) 欠陥検査方法
JP2002081914A (ja) 寸法検査方法及びその装置並びにマスクの製造方法
JPS61212708A (ja) 多層パターン欠陥検出方法及びその装置
JPH0517481B2 (enrdf_load_html_response)
JP3732794B2 (ja) 寸法検査方法及びその装置並びにマスクの製造方法
JPS5924361B2 (ja) ２次元画像比較検査装置
JPH0160766B2 (enrdf_load_html_response)
JP2954381B2 (ja) パターン検査方法及び装置
JP2009188175A (ja) 外観検査装置及び外観検査方法
JP2561193B2 (ja) 印刷パターン検査装置
JPH0656293B2 (ja) 欠陥検出方法
JP3189796B2 (ja) 欠陥検査方法及び装置
JPH063541B2 (ja) パターン検査装置
JPH0325357A (ja) 画像欠陥検出方法
JPH05149888A (ja) 傷検査装置
JPH038505B2 (enrdf_load_html_response)
JP2765339B2 (ja) スルーホール検査装置
JP3684707B2 (ja) レチクルパターン検査方法
JP4164636B2 (ja) パターン検査方法