JPH0517269Y2 - - Google Patents
Info
- Publication number
- JPH0517269Y2 JPH0517269Y2 JP1986072962U JP7296286U JPH0517269Y2 JP H0517269 Y2 JPH0517269 Y2 JP H0517269Y2 JP 1986072962 U JP1986072962 U JP 1986072962U JP 7296286 U JP7296286 U JP 7296286U JP H0517269 Y2 JPH0517269 Y2 JP H0517269Y2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- chip
- conductive layer
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005192 partition Methods 0.000 description 9
- 238000010008 shearing Methods 0.000 description 4
- 238000004382 potting Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986072962U JPH0517269Y2 (US08124630-20120228-C00152.png) | 1986-05-15 | 1986-05-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986072962U JPH0517269Y2 (US08124630-20120228-C00152.png) | 1986-05-15 | 1986-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62185072U JPS62185072U (US08124630-20120228-C00152.png) | 1987-11-25 |
JPH0517269Y2 true JPH0517269Y2 (US08124630-20120228-C00152.png) | 1993-05-10 |
Family
ID=30916873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986072962U Expired - Lifetime JPH0517269Y2 (US08124630-20120228-C00152.png) | 1986-05-15 | 1986-05-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0517269Y2 (US08124630-20120228-C00152.png) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081108Y2 (ja) * | 1987-03-20 | 1996-01-17 | 大日本印刷株式会社 | Icモジュール |
JPH07121633B2 (ja) * | 1988-04-28 | 1995-12-25 | 松下電器産業株式会社 | Icカード用モジュールとそれを用いたicカード |
JPH0727187Y2 (ja) * | 1988-08-26 | 1995-06-21 | 共同印刷株式会社 | Icカード用icモジュール |
JP2526592Y2 (ja) * | 1993-09-20 | 1997-02-19 | 大日本印刷株式会社 | Icモジュール |
JP2005293460A (ja) * | 2004-04-05 | 2005-10-20 | Matsushita Electric Ind Co Ltd | 非接触icカード用インレットおよび非接触icカード |
US8547705B2 (en) * | 2009-08-20 | 2013-10-01 | Nec Corporation | Semiconductor device having power supply-side and ground-side metal reinforcing members insulated from each other |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58118297A (ja) * | 1981-12-31 | 1983-07-14 | 共同印刷株式会社 | 識別カ−ドの製造方法 |
JPS58155747A (ja) * | 1982-03-12 | 1983-09-16 | Kyodo Printing Co Ltd | Ic基板の製法 |
JPS5974639A (ja) * | 1982-10-22 | 1984-04-27 | Hitachi Ltd | 薄板状集積回路基板の製法 |
JPS5988857A (ja) * | 1982-11-12 | 1984-05-22 | Toshiba Corp | 半導体装置 |
JPS6015957A (ja) * | 1983-07-08 | 1985-01-26 | Oki Electric Ind Co Ltd | 半導体装置 |
JPS6193646A (ja) * | 1984-10-13 | 1986-05-12 | Fujitsu Ltd | 半導体集積回路 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58131656U (ja) * | 1982-02-27 | 1983-09-05 | 大日本印刷株式会社 | Icカ−ド用電極回路基板 |
JPS58155058U (ja) * | 1982-04-09 | 1983-10-17 | 共同印刷株式会社 | メモリ−カ−ド |
-
1986
- 1986-05-15 JP JP1986072962U patent/JPH0517269Y2/ja not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58118297A (ja) * | 1981-12-31 | 1983-07-14 | 共同印刷株式会社 | 識別カ−ドの製造方法 |
JPS58155747A (ja) * | 1982-03-12 | 1983-09-16 | Kyodo Printing Co Ltd | Ic基板の製法 |
JPS5974639A (ja) * | 1982-10-22 | 1984-04-27 | Hitachi Ltd | 薄板状集積回路基板の製法 |
JPS5988857A (ja) * | 1982-11-12 | 1984-05-22 | Toshiba Corp | 半導体装置 |
JPS6015957A (ja) * | 1983-07-08 | 1985-01-26 | Oki Electric Ind Co Ltd | 半導体装置 |
JPS6193646A (ja) * | 1984-10-13 | 1986-05-12 | Fujitsu Ltd | 半導体集積回路 |
Also Published As
Publication number | Publication date |
---|---|
JPS62185072U (US08124630-20120228-C00152.png) | 1987-11-25 |
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