JPH051639B2 - - Google Patents
Info
- Publication number
- JPH051639B2 JPH051639B2 JP7513884A JP7513884A JPH051639B2 JP H051639 B2 JPH051639 B2 JP H051639B2 JP 7513884 A JP7513884 A JP 7513884A JP 7513884 A JP7513884 A JP 7513884A JP H051639 B2 JPH051639 B2 JP H051639B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- insulating substrate
- circuit pattern
- film
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000010419 fine particle Substances 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000005338 heat storage Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7513884A JPS60219790A (ja) | 1984-04-16 | 1984-04-16 | 電気回路パターン形成装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7513884A JPS60219790A (ja) | 1984-04-16 | 1984-04-16 | 電気回路パターン形成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60219790A JPS60219790A (ja) | 1985-11-02 |
| JPH051639B2 true JPH051639B2 (enrdf_load_stackoverflow) | 1993-01-08 |
Family
ID=13567530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7513884A Granted JPS60219790A (ja) | 1984-04-16 | 1984-04-16 | 電気回路パターン形成装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60219790A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129492A (ja) * | 1987-11-16 | 1989-05-22 | Fuji Kagakushi Kogyo Co Ltd | プリント基板製造方法 |
| JPH02291194A (ja) * | 1989-04-28 | 1990-11-30 | Nec Corp | 印刷配線パターンの製造方法 |
| DE69835934D1 (de) | 1997-12-03 | 2006-11-02 | Tdk Corp | Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren |
| KR101023815B1 (ko) | 2009-08-12 | 2011-03-21 | 주식회사 엔씰텍 | 대량생산 시스템의 줄 가열을 이용한 증착 장치 및 방법 |
-
1984
- 1984-04-16 JP JP7513884A patent/JPS60219790A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60219790A (ja) | 1985-11-02 |
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