JPH0515065B2 - - Google Patents

Info

Publication number
JPH0515065B2
JPH0515065B2 JP59106604A JP10660484A JPH0515065B2 JP H0515065 B2 JPH0515065 B2 JP H0515065B2 JP 59106604 A JP59106604 A JP 59106604A JP 10660484 A JP10660484 A JP 10660484A JP H0515065 B2 JPH0515065 B2 JP H0515065B2
Authority
JP
Japan
Prior art keywords
thin film
resin
tool
resin body
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59106604A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60251634A (ja
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP59106604A priority Critical patent/JPS60251634A/ja
Publication of JPS60251634A publication Critical patent/JPS60251634A/ja
Publication of JPH0515065B2 publication Critical patent/JPH0515065B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59106604A 1984-05-28 1984-05-28 半導体装置の製造方法 Granted JPS60251634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59106604A JPS60251634A (ja) 1984-05-28 1984-05-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59106604A JPS60251634A (ja) 1984-05-28 1984-05-28 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60251634A JPS60251634A (ja) 1985-12-12
JPH0515065B2 true JPH0515065B2 (cg-RX-API-DMAC10.html) 1993-02-26

Family

ID=14437725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59106604A Granted JPS60251634A (ja) 1984-05-28 1984-05-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60251634A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274734A (ja) * 1986-05-23 1987-11-28 Nec Corp 樹脂封止型電子部品の樹脂カス除去法
JPH01304758A (ja) * 1988-06-01 1989-12-08 Yamada Seisakusho:Kk リードフレームのスクラップ除去方法
JPH0812894B2 (ja) * 1992-05-27 1996-02-07 アピックヤマダ株式会社 リードフレームのディゲート方法およびこれに用いるリードフレーム

Also Published As

Publication number Publication date
JPS60251634A (ja) 1985-12-12

Similar Documents

Publication Publication Date Title
JPS6396947A (ja) 半導体装置用リ−ドフレ−ム
US7247931B2 (en) Semiconductor package and leadframe therefor having angled corners
JPH0515065B2 (cg-RX-API-DMAC10.html)
JPH0371785B2 (cg-RX-API-DMAC10.html)
JPH0145228B2 (cg-RX-API-DMAC10.html)
JPH08318328A (ja) リード切断用金型
JP2580740B2 (ja) リードフレーム
JPH0545063B2 (cg-RX-API-DMAC10.html)
JPH07335815A (ja) リードフレーム及びこれを用いた半導体装置
JP3077505B2 (ja) リードフレームの製造方法
JPS6331128A (ja) 樹脂かす除去方法
JPS6150379B2 (cg-RX-API-DMAC10.html)
JP2848923B2 (ja) 半導体装置のリードフレームの加工方法及びその装置
JP3062709B2 (ja) 半導体装置の製造方法
JPH0622266B2 (ja) 半導体装置及びその製造方法
JP2938038B1 (ja) タイバー切断金型
JP2603814B2 (ja) 半導体装置及びその製造方法
JPH06151681A (ja) 半導体装置の製造方法およびその製造において用いるリードフレーム
JP2003127184A (ja) 樹脂封止金型およびタイバ−切断装置
JPS6285453A (ja) Ｉｃ用リ−ドフレ−ム材
JPH09153579A (ja) タイバ切断装置
JPH0992763A (ja) リードフレームの打抜き加工方法
JPH0564858B2 (cg-RX-API-DMAC10.html)
JPS635912B2 (cg-RX-API-DMAC10.html)
JPH0455539B2 (cg-RX-API-DMAC10.html)