JPH05136565A - 厚膜多層セラミツクス基板 - Google Patents

厚膜多層セラミツクス基板

Info

Publication number
JPH05136565A
JPH05136565A JP3300751A JP30075191A JPH05136565A JP H05136565 A JPH05136565 A JP H05136565A JP 3300751 A JP3300751 A JP 3300751A JP 30075191 A JP30075191 A JP 30075191A JP H05136565 A JPH05136565 A JP H05136565A
Authority
JP
Japan
Prior art keywords
layer
solder
conductor layer
multilayer ceramic
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3300751A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroshi Kanda
博司 神田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Japan Ltd
Original Assignee
DuPont Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DuPont Japan Ltd filed Critical DuPont Japan Ltd
Priority to JP3300751A priority Critical patent/JPH05136565A/ja
Priority to TW82100089A priority patent/TW233290B/zh
Publication of JPH05136565A publication Critical patent/JPH05136565A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP3300751A 1991-11-15 1991-11-15 厚膜多層セラミツクス基板 Pending JPH05136565A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP3300751A JPH05136565A (ja) 1991-11-15 1991-11-15 厚膜多層セラミツクス基板
TW82100089A TW233290B (https=) 1991-11-15 1993-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3300751A JPH05136565A (ja) 1991-11-15 1991-11-15 厚膜多層セラミツクス基板

Publications (1)

Publication Number Publication Date
JPH05136565A true JPH05136565A (ja) 1993-06-01

Family

ID=17888660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3300751A Pending JPH05136565A (ja) 1991-11-15 1991-11-15 厚膜多層セラミツクス基板

Country Status (2)

Country Link
JP (1) JPH05136565A (https=)
TW (1) TW233290B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001097579A1 (en) * 2000-06-15 2001-12-20 Murata Manufacturing Co.,Ltd. Method of mounting electronic part
JPWO2017199712A1 (ja) * 2016-05-16 2019-02-14 株式会社村田製作所 セラミック電子部品

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115943128A (zh) * 2020-10-13 2023-04-07 日本电气硝子株式会社 半导体元件被覆用玻璃以及使用其的半导体被覆用材料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001097579A1 (en) * 2000-06-15 2001-12-20 Murata Manufacturing Co.,Ltd. Method of mounting electronic part
US6598779B2 (en) 2000-06-15 2003-07-29 Murata Manufacturing Co., Ltd. Electronic component mounting method
JPWO2017199712A1 (ja) * 2016-05-16 2019-02-14 株式会社村田製作所 セラミック電子部品

Also Published As

Publication number Publication date
TW233290B (https=) 1994-11-01

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