JPH0512239B2 - - Google Patents

Info

Publication number
JPH0512239B2
JPH0512239B2 JP58066955A JP6695583A JPH0512239B2 JP H0512239 B2 JPH0512239 B2 JP H0512239B2 JP 58066955 A JP58066955 A JP 58066955A JP 6695583 A JP6695583 A JP 6695583A JP H0512239 B2 JPH0512239 B2 JP H0512239B2
Authority
JP
Japan
Prior art keywords
refueling
engine
nozzle
signal
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58066955A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59199496A (ja
Inventor
Hiroshi Matsumura
Kyoshi Matsudaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TATSUNO MEKATORONIKUSU KK
Original Assignee
TATSUNO MEKATORONIKUSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TATSUNO MEKATORONIKUSU KK filed Critical TATSUNO MEKATORONIKUSU KK
Priority to JP58066955A priority Critical patent/JPS59199496A/ja
Publication of JPS59199496A publication Critical patent/JPS59199496A/ja
Publication of JPH0512239B2 publication Critical patent/JPH0512239B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Loading And Unloading Of Fuel Tanks Or Ships (AREA)
JP58066955A 1983-04-18 1983-04-18 給油所 Granted JPS59199496A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58066955A JPS59199496A (ja) 1983-04-18 1983-04-18 給油所

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066955A JPS59199496A (ja) 1983-04-18 1983-04-18 給油所

Publications (2)

Publication Number Publication Date
JPS59199496A JPS59199496A (ja) 1984-11-12
JPH0512239B2 true JPH0512239B2 (enrdf_load_html_response) 1993-02-17

Family

ID=13330949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58066955A Granted JPS59199496A (ja) 1983-04-18 1983-04-18 給油所

Country Status (1)

Country Link
JP (1) JPS59199496A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61190496A (ja) * 1985-02-12 1986-08-25 株式会社　東京タツノ 給油装置
JP4644138B2 (ja) * 2006-02-21 2011-03-02 トキコテクノ株式会社 燃料供給システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334568U (enrdf_load_html_response) * 1976-08-31 1978-03-27
JPS57186559A (en) * 1981-05-08 1982-11-17 Tokyo Tatsuno Co Ltd Filling station

Also Published As

Publication number Publication date
JPS59199496A (ja) 1984-11-12

Similar Documents

Publication Publication Date Title
JPH0441117Y2 (enrdf_load_html_response)
US4292620A (en) Fuel level monitoring engine control and vehicle theft inhibiting device
JPH0512239B2 (enrdf_load_html_response)
JPH0882579A (ja) 故障診断装置
JPH0440279B2 (enrdf_load_html_response)
JPH0610036B2 (ja) 給油装置
JPS5830993A (ja) 給油装置
JPH0684198B2 (ja) タンクローリからの給油装置
JPH0533712Y2 (enrdf_load_html_response)
JPH04352697A (ja) 給油装置
JPH0861136A (ja) 内燃機関の駆動制御装置
JP2544275B2 (ja) 給油装置
JP2544308B2 (ja) 給油装置
JPH0427840Y2 (enrdf_load_html_response)
JP3163740B2 (ja) 誤注油検知装置
JPS59163194A (ja) 給油装置
JPH03133798A (ja) 給油装置
JPS5869440A (ja) 非常用自家発電設備における潜在的異常診断装置
JPS62287897A (ja) 給油装置
JPH05321801A (ja) エンジンのスタートスイッチの故障検知装置
KR0153791B1 (ko) 자동차의 주행가능거리 산출방법 및 그 장치
JPS61190496A (ja) 給油装置
JPH0811995A (ja) 給油装置
JPH0487995A (ja) 油種判別機能付き給油装置
JPH0764389B2 (ja) 給油装置