JPS59199496A - 給油所 - Google Patents

給油所

Info

Publication number
JPS59199496A
JPS59199496A JP58066955A JP6695583A JPS59199496A JP S59199496 A JPS59199496 A JP S59199496A JP 58066955 A JP58066955 A JP 58066955A JP 6695583 A JP6695583 A JP 6695583A JP S59199496 A JPS59199496 A JP S59199496A
Authority
JP
Japan
Prior art keywords
refueling
engine
detector
input
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58066955A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0512239B2 (enrdf_load_html_response
Inventor
松村　博
松平　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Tatsuno Co Ltd
Original Assignee
Tokyo Tatsuno Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Tatsuno Co Ltd filed Critical Tokyo Tatsuno Co Ltd
Priority to JP58066955A priority Critical patent/JPS59199496A/ja
Publication of JPS59199496A publication Critical patent/JPS59199496A/ja
Publication of JPH0512239B2 publication Critical patent/JPH0512239B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Loading And Unloading Of Fuel Tanks Or Ships (AREA)
JP58066955A 1983-04-18 1983-04-18 給油所 Granted JPS59199496A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58066955A JPS59199496A (ja) 1983-04-18 1983-04-18 給油所

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066955A JPS59199496A (ja) 1983-04-18 1983-04-18 給油所

Publications (2)

Publication Number Publication Date
JPS59199496A true JPS59199496A (ja) 1984-11-12
JPH0512239B2 JPH0512239B2 (enrdf_load_html_response) 1993-02-17

Family

ID=13330949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58066955A Granted JPS59199496A (ja) 1983-04-18 1983-04-18 給油所

Country Status (1)

Country Link
JP (1) JPS59199496A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61190496A (ja) * 1985-02-12 1986-08-25 株式会社　東京タツノ 給油装置
JP2007223622A (ja) * 2006-02-21 2007-09-06 Tokiko Techno Kk 燃料供給システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334568U (enrdf_load_html_response) * 1976-08-31 1978-03-27
JPS57186559A (en) * 1981-05-08 1982-11-17 Tokyo Tatsuno Co Ltd Filling station

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334568U (enrdf_load_html_response) * 1976-08-31 1978-03-27
JPS57186559A (en) * 1981-05-08 1982-11-17 Tokyo Tatsuno Co Ltd Filling station

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61190496A (ja) * 1985-02-12 1986-08-25 株式会社　東京タツノ 給油装置
JP2007223622A (ja) * 2006-02-21 2007-09-06 Tokiko Techno Kk 燃料供給システム

Also Published As

Publication number Publication date
JPH0512239B2 (enrdf_load_html_response) 1993-02-17

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