JPH0510366Y2 - - Google Patents

Info

Publication number
JPH0510366Y2
JPH0510366Y2 JP1985133823U JP13382385U JPH0510366Y2 JP H0510366 Y2 JPH0510366 Y2 JP H0510366Y2 JP 1985133823 U JP1985133823 U JP 1985133823U JP 13382385 U JP13382385 U JP 13382385U JP H0510366 Y2 JPH0510366 Y2 JP H0510366Y2
Authority
JP
Japan
Prior art keywords
external lead
lead
main body
external
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985133823U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242253U (US08158827-20120417-C00028.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985133823U priority Critical patent/JPH0510366Y2/ja
Publication of JPS6242253U publication Critical patent/JPS6242253U/ja
Application granted granted Critical
Publication of JPH0510366Y2 publication Critical patent/JPH0510366Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1985133823U 1985-08-31 1985-08-31 Expired - Lifetime JPH0510366Y2 (US08158827-20120417-C00028.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985133823U JPH0510366Y2 (US08158827-20120417-C00028.png) 1985-08-31 1985-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985133823U JPH0510366Y2 (US08158827-20120417-C00028.png) 1985-08-31 1985-08-31

Publications (2)

Publication Number Publication Date
JPS6242253U JPS6242253U (US08158827-20120417-C00028.png) 1987-03-13
JPH0510366Y2 true JPH0510366Y2 (US08158827-20120417-C00028.png) 1993-03-15

Family

ID=31034486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985133823U Expired - Lifetime JPH0510366Y2 (US08158827-20120417-C00028.png) 1985-08-31 1985-08-31

Country Status (1)

Country Link
JP (1) JPH0510366Y2 (US08158827-20120417-C00028.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072376A (ja) * 2014-09-29 2016-05-09 ルネサスエレクトロニクス株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698853A (en) * 1980-01-11 1981-08-08 Hitachi Ltd Structure of lead in semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128171U (US08158827-20120417-C00028.png) * 1981-02-02 1982-08-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698853A (en) * 1980-01-11 1981-08-08 Hitachi Ltd Structure of lead in semiconductor device

Also Published As

Publication number Publication date
JPS6242253U (US08158827-20120417-C00028.png) 1987-03-13

Similar Documents

Publication Publication Date Title
US6448107B1 (en) Pin indicator for leadless leadframe packages
US6441400B1 (en) Semiconductor device and method of fabricating the same
US20010045636A1 (en) Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit
JPH08139257A (ja) 面実装型半導体装置
JPH0510366Y2 (US08158827-20120417-C00028.png)
JPS63296252A (ja) 樹脂封止型半導体装置
JP3136029B2 (ja) 半導体装置
JPS6342416B2 (US08158827-20120417-C00028.png)
JP2565115B2 (ja) 集積回路パッケージ
JPH0423330Y2 (US08158827-20120417-C00028.png)
KR100227149B1 (ko) 반도체 패키지
KR0125197Y1 (ko) 반도체 장치
JPH037946Y2 (US08158827-20120417-C00028.png)
JPH07130937A (ja) 表面実装型半導体装置およびその製造に用いるリードフレーム
JPS6244531Y2 (US08158827-20120417-C00028.png)
JP2504194B2 (ja) 樹脂封止型半導体装置の製造方法
JPH0212861A (ja) 樹脂封止型半導体装置
JPH087645Y2 (ja) 面実装用icパッケージ
JP2000277677A (ja) リードフレーム、半導体パッケージ及びその製造方法
JPS622560A (ja) 樹脂封止型半導体装置
JPH0685142A (ja) Ic用パッケージ
JPH0617088Y2 (ja) 集積回路用ソケット
JP2707899B2 (ja) 混成集積回路装置
JPH0831556B2 (ja) 半導体装置用リードフレーム
KR200313831Y1 (ko) 바텀리드패키지