JPH049381B2 - - Google Patents

Info

Publication number
JPH049381B2
JPH049381B2 JP19454782A JP19454782A JPH049381B2 JP H049381 B2 JPH049381 B2 JP H049381B2 JP 19454782 A JP19454782 A JP 19454782A JP 19454782 A JP19454782 A JP 19454782A JP H049381 B2 JPH049381 B2 JP H049381B2
Authority
JP
Japan
Prior art keywords
eprom
resin
integrated circuit
ultraviolet
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19454782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5984448A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57194547A priority Critical patent/JPS5984448A/ja
Publication of JPS5984448A publication Critical patent/JPS5984448A/ja
Publication of JPH049381B2 publication Critical patent/JPH049381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/00—
    • H10W72/884—
    • H10W74/10—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Non-Volatile Memory (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Read Only Memory (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57194547A 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法 Granted JPS5984448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57194547A JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57194547A JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS5984448A JPS5984448A (ja) 1984-05-16
JPH049381B2 true JPH049381B2 (cg-RX-API-DMAC10.html) 1992-02-20

Family

ID=16326346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57194547A Granted JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS5984448A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
JP2744273B2 (ja) * 1988-02-09 1998-04-28 キヤノン株式会社 光電変換装置の製造方法
GB8911607D0 (en) * 1989-05-19 1989-07-05 Emi Plc Thorn A method of encapsulation for electronic devices and devices so encapsulated
JPH05203522A (ja) * 1992-01-23 1993-08-10 Mitsubishi Electric Corp モールドパッケージ半導体圧力センサおよびその製造方法
KR970005706B1 (ko) * 1994-01-24 1997-04-19 금성일렉트론 주식회사 고체촬상소자 및 그 제조방법

Also Published As

Publication number Publication date
JPS5984448A (ja) 1984-05-16

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