JPH0485789U - - Google Patents

Info

Publication number
JPH0485789U
JPH0485789U JP1990127253U JP12725390U JPH0485789U JP H0485789 U JPH0485789 U JP H0485789U JP 1990127253 U JP1990127253 U JP 1990127253U JP 12725390 U JP12725390 U JP 12725390U JP H0485789 U JPH0485789 U JP H0485789U
Authority
JP
Japan
Prior art keywords
gasket
core material
view
sectional
metal mesh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990127253U
Other languages
English (en)
Other versions
JP2510404Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990127253U priority Critical patent/JP2510404Y2/ja
Priority to US07/772,213 priority patent/US5142101A/en
Priority to DE4135484A priority patent/DE4135484C2/de
Priority to DE9113382U priority patent/DE9113382U1/de
Priority to GB9124293A priority patent/GB2250382B/en
Publication of JPH0485789U publication Critical patent/JPH0485789U/ja
Application granted granted Critical
Publication of JP2510404Y2 publication Critical patent/JP2510404Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第１図乃至第４図は本考案の第１実施例を示す
もので、第１図は電磁波シールド用ガスケツトの
断面図、第２図は金属メツシユの編み方を示す拡
大図、第３図は電磁波シールド用ガスケツトの斜
視図、第４図は装着状態を示す断面図、第５図は
本考案の第２実施例を示す断面図、第６図は第３
実施例を示す断面図、第７図は第４実施例を示す
断面図、第８図は第５実施例を示す断面図、第９
図及び第１０図は第６実施例を示すもので、第９
図はその断面図、第１０図は装着状態を示す断面
図、第１１図は第７実施例を示す断面図、第１２
図は第８実施例を示す断面図、第１３図は第９実
施例を示す断面図、第１４図及び第１５図は第１
０実施例を示すもので、第１４図はその断面図、
第１５図は装着状態を示す断面図、第１６図は第
１１実施例を示す断面図、第１７図は第１２実施
例を示す断面図である。１０……電磁波シールド
用ガスケツト、１２……芯材、１４……金属メツ
シユ、１８……装着部、２５……コーナー部、３
０……、分離部。

Claims (1)

  1. 【実用新案登録請求の範囲】 弾力性を有する芯材の表面に金属メツシユを接
    着して被覆し、電子部品を収納する導電性筺体の
    合せ部間の間隙に装着して、電磁波を遮蔽する電
    磁波シールド用ガスケツトにおいて、 前記芯材は前記導電性筺体の合せ部の一方固定
    される装着部を有すると共に、 前記固定された芯材が押圧された時に、弾性変
    形の大きなコーナー部の表面に金属メツシユと接
    着しない分離部を設けたことを特徴とする電磁波
    シールド用ガスケツト。
JP1990127253U 1990-11-29 1990-11-29 電磁波シ―ルド用ガスケット Expired - Lifetime JP2510404Y2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1990127253U JP2510404Y2 (ja) 1990-11-29 1990-11-29 電磁波シ―ルド用ガスケット
US07/772,213 US5142101A (en) 1990-11-29 1991-10-07 Electromagnetic-shielding gasket
DE4135484A DE4135484C2 (de) 1990-11-29 1991-10-28 Elektromagnetisch abschirmende Dichtung
DE9113382U DE9113382U1 (de) 1990-11-29 1991-10-28 Elektromagnetisch abschirmende Dichtung
GB9124293A GB2250382B (en) 1990-11-29 1991-11-15 Electromagnetic-shielding gasket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990127253U JP2510404Y2 (ja) 1990-11-29 1990-11-29 電磁波シ―ルド用ガスケット

Publications (2)

Publication Number Publication Date
JPH0485789U true JPH0485789U (ja) 1992-07-24
JP2510404Y2 JP2510404Y2 (ja) 1996-09-11

Family

ID=14955476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990127253U Expired - Lifetime JP2510404Y2 (ja) 1990-11-29 1990-11-29 電磁波シ―ルド用ガスケット

Country Status (4)

Country Link
US (1) US5142101A (ja)
JP (1) JP2510404Y2 (ja)
DE (2) DE9113382U1 (ja)
GB (1) GB2250382B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06350282A (ja) * 1993-06-08 1994-12-22 Kitagawa Ind Co Ltd 電磁波シールド用ガスケット
JPH09312492A (ja) * 1996-05-20 1997-12-02 Nippon Jitsupaa Chiyuubingu Kk 異形プロファイル導通体の製造法
JPH1070388A (ja) * 1997-06-23 1998-03-10 Kitagawa Ind Co Ltd 電磁波シールド用ガスケット
JP4733287B2 (ja) * 2001-04-20 2011-07-27 セーレン株式会社 電磁波シールド材

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JP2526820Y2 (ja) * 1991-05-24 1997-02-26 北川工業株式会社 電磁波シールド用編物
JP2647589B2 (ja) * 1992-01-27 1997-08-27 矢崎総業株式会社 電磁波遮蔽用複合シート
DE9209075U1 (de) * 1992-07-07 1992-09-10 REHAU AG + Co., 95111 Rehau Abgeschirmte Dichtung
AT400654B (de) * 1993-09-28 1996-02-26 Urleb Alfred Einrichtung für normgehäuse mit elektrisch leitenden frontplatten
US5603514A (en) * 1994-02-28 1997-02-18 Jencks; Andrew D. Circular warp-knit electromagnetic emission-shielding gasket
JP2690684B2 (ja) * 1994-04-14 1997-12-10 北川工業株式会社 縫製電磁波シールド材
GB2291938B (en) * 1994-08-04 1998-02-11 Vero Electronics Ltd Gaskets for housings
US5534663A (en) * 1994-11-14 1996-07-09 The United States Of America As Represented By The United States Department Of Energy Electrically shielded enclosure with magnetically retained removable cover
WO1997008928A1 (en) * 1995-08-25 1997-03-06 Parker-Hannifin Corporation Emi shielding gasket having a consolidated conductive sheathing
US5578790A (en) * 1995-09-06 1996-11-26 The Whitaker Corporation Shielding gasket
GB2306790B (en) * 1995-10-28 2000-01-12 Motorola Ltd Gasket and mounting therefor
US5825634A (en) * 1995-12-22 1998-10-20 Bfgoodrich Avionics Systems, Inc. Circuit board having an EMI shielded area
US5804762A (en) * 1996-03-22 1998-09-08 Parker-Hannifin Corporation EMI shielding gasket having shear surface attachments
US5977480A (en) * 1996-09-30 1999-11-02 Elsag International N.V. Grounding and RFI isolation for control station
US5889229A (en) * 1997-03-18 1999-03-30 Instrument Specialties Co., Inc. Self-terminating, knitted, metalized yarn EMI/RFI shielding gasket
US6075205A (en) * 1997-10-27 2000-06-13 Parker-Hannifin Corporation Tubular extrusion gasket profile exhibiting a controlled deflection response for improved environmental sealing and EMI shielding
US6294729B1 (en) 1997-10-31 2001-09-25 Laird Technologies Clad polymer EMI shield
US7071409B2 (en) * 1998-03-06 2006-07-04 Hoffman Enclosures, Inc. Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
US6188014B1 (en) * 1998-03-06 2001-02-13 Hoffman Enclosures, Inc. Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
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US6111192A (en) * 1998-10-09 2000-08-29 Marion Composites Height reducible EMI shielded electronic enclosure
KR100743531B1 (ko) 2000-02-18 2007-07-27 파커-한니핀 코포레이션 낮은 밀폐력의 가스켓을 현장 성형하는 방법
JP2002094689A (ja) * 2000-06-07 2002-03-29 Sony Computer Entertainment Inc プログラム実行システム、プログラム実行装置、中継装置、および記録媒体
US6348654B1 (en) * 2000-10-12 2002-02-19 Parker-Hannifin Corporation Compound waveform gasket for low closure force EMI shielding applications
US6697248B1 (en) 2001-02-06 2004-02-24 Daniel Luch Electromagnetic interference shields and methods of manufacture
BR0208927A (pt) 2001-05-10 2004-04-27 Parker Hannifin Corp Fabricação de invólucro de componentes eletrônicos que possuem uma camada de blindagem metalizada
WO2002093997A1 (en) 2001-05-11 2002-11-21 Parker Hannifin Corporation Notched gasket for low closure force emi shielding applications
US6809254B2 (en) 2001-07-20 2004-10-26 Parker-Hannifin Corporation Electronics enclosure having an interior EMI shielding and cosmetic coating
US20030091777A1 (en) * 2001-08-14 2003-05-15 Peter Jones Clean release tape for EMI shielding
WO2003030610A1 (en) 2001-10-02 2003-04-10 Parker Hannifin Corporation Emi shielding gasket construction
US6723916B2 (en) * 2002-03-15 2004-04-20 Parker-Hannifin Corporation Combination EMI shielding and environmental seal gasket construction
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US20030227759A1 (en) * 2002-06-10 2003-12-11 Haworth Stephen Paul Electromagnetic interference gasket
US6744641B2 (en) * 2002-06-10 2004-06-01 Sun Microsystems, Inc. Electromagnetic interference gasket
US6525267B1 (en) * 2002-06-14 2003-02-25 Dell Products L.P. Wrapped multiple density gasket
US20040094904A1 (en) * 2002-11-14 2004-05-20 Tracy Grant Low compressive force EMI gasket with perforated substrate and method
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7294919B2 (en) * 2003-11-26 2007-11-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Device having a complaint element pressed between substrates
US6919505B2 (en) * 2003-12-04 2005-07-19 Eaton Corporation Electronic apparatus and enclosure employing substantially co-planar portions with mating crenellations
US7470866B2 (en) * 2004-11-18 2008-12-30 Jemic Shielding Technology Electrically conductive gasket
US7732714B2 (en) * 2004-12-15 2010-06-08 Jemic Shielding Technology Electrically conductive gasket with paint masking
US20070035939A1 (en) * 2005-08-15 2007-02-15 Wallace Patrick J Reduced cost conductive interface
US7870701B2 (en) * 2005-12-07 2011-01-18 Raytheon Company Radiation limiting opening for a structure
GB2436353B (en) * 2006-03-22 2008-04-23 Rolls Royce Plc Panel assembly including deformable seal
KR101001354B1 (ko) 2008-07-01 2010-12-14 조인셋 주식회사 리플로우 솔더링이 가능한 탄성 전기접촉단자
US20100052263A1 (en) * 2008-09-03 2010-03-04 Baker Hughes Incorporated Electroplated resilient seal
JP5360900B2 (ja) * 2009-11-04 2013-12-04 北川工業株式会社 導電部品
US8481867B2 (en) 2010-07-20 2013-07-09 Brady Converting Ab Conductive grounding pad
JP2012182227A (ja) * 2011-02-28 2012-09-20 Panasonic Corp パッキン部材
CN102711350A (zh) * 2011-03-28 2012-10-03 鸿富锦精密工业（深圳）有限公司 具有导电泡棉的便携式电子装置
US9617783B2 (en) * 2011-09-20 2017-04-11 Mitsubishi Aircraft Corporation Gasket seal, door of aircraft, seal structure for opening portion of aircraft, and aircraft
DE102011054759A1 (de) * 2011-10-24 2013-04-25 Boris Lutterbach Radiofrequenz-Abschirmungsanordnung für eine elektrodenlose Plasma-Beleuchtungsvorrichtung sowie elektrodenlose Plasma-Beleuchtungsvorrichtung und Herstellungsverfahren dafür
US8952258B2 (en) * 2012-09-21 2015-02-10 International Business Machines Corporation Implementing graphene interconnect for high conductivity applications
US9831589B2 (en) * 2012-10-03 2017-11-28 Corad Technology Inc. Compressible pin assembly having frictionlessly connected contact elements
US9078351B2 (en) * 2012-11-15 2015-07-07 Kabushiki Kaisha Toshiba Grounding gasket and electronic apparatus
US9345182B2 (en) 2013-08-27 2016-05-17 Parker-Hannifin Corporation EMI shielding vent panel frame
US9370132B2 (en) 2013-08-27 2016-06-14 Parker-Hannifin Corporation Homogeneous EMI vent panel and method for preparation thereof
US9060417B2 (en) * 2013-10-03 2015-06-16 International Business Machines Corporation Device for attenuating propagation of electromagnetic emissions from an enclosure
US20150097471A1 (en) * 2013-10-04 2015-04-09 Stevan M. Bailey Water resistant outdoor electronics cabinet
US9089044B1 (en) * 2014-04-04 2015-07-21 Laird Technologies, Inc. EMI shielding connector gasket
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
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KR102350393B1 (ko) * 2015-07-31 2022-01-14 엘지디스플레이 주식회사 전자파 차폐 구조물과 그를 갖는 표시 장치
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Citations (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06350282A (ja) * 1993-06-08 1994-12-22 Kitagawa Ind Co Ltd 電磁波シールド用ガスケット
JPH09312492A (ja) * 1996-05-20 1997-12-02 Nippon Jitsupaa Chiyuubingu Kk 異形プロファイル導通体の製造法
JPH1070388A (ja) * 1997-06-23 1998-03-10 Kitagawa Ind Co Ltd 電磁波シールド用ガスケット
JP4733287B2 (ja) * 2001-04-20 2011-07-27 セーレン株式会社 電磁波シールド材

Also Published As

Publication number Publication date
DE4135484C2 (de) 2003-04-17
GB2250382A (en) 1992-06-03
GB2250382B (en) 1994-10-05
US5142101A (en) 1992-08-25
GB9124293D0 (en) 1992-01-08
DE4135484A1 (de) 1992-06-04
JP2510404Y2 (ja) 1996-09-11
DE9113382U1 (de) 1991-12-19

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