JPH048444B2 - - Google Patents

Info

Publication number
JPH048444B2
JPH048444B2 JP60190956A JP19095685A JPH048444B2 JP H048444 B2 JPH048444 B2 JP H048444B2 JP 60190956 A JP60190956 A JP 60190956A JP 19095685 A JP19095685 A JP 19095685A JP H048444 B2 JPH048444 B2 JP H048444B2
Authority
JP
Japan
Prior art keywords
acid
epoxy resin
ester
esters
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60190956A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6253327A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19095685A priority Critical patent/JPS6253327A/ja
Publication of JPS6253327A publication Critical patent/JPS6253327A/ja
Publication of JPH048444B2 publication Critical patent/JPH048444B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP19095685A 1985-08-31 1985-08-31 硬化性組成物 Granted JPS6253327A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19095685A JPS6253327A (ja) 1985-08-31 1985-08-31 硬化性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19095685A JPS6253327A (ja) 1985-08-31 1985-08-31 硬化性組成物

Publications (2)

Publication Number Publication Date
JPS6253327A JPS6253327A (ja) 1987-03-09
JPH048444B2 true JPH048444B2 (fr) 1992-02-17

Family

ID=16266470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19095685A Granted JPS6253327A (ja) 1985-08-31 1985-08-31 硬化性組成物

Country Status (1)

Country Link
JP (1) JPS6253327A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018008415A1 (fr) * 2016-07-06 2018-01-11 Dic株式会社 Composition durcissable, et produit durci de celle-ci
WO2019188332A1 (fr) * 2018-03-29 2019-10-03 Dic株式会社 Composition durcissable et produit durci associé
JPWO2020145346A1 (ja) * 2019-01-10 2021-11-18 積水化学工業株式会社 エステル化合物、樹脂組成物、硬化物、及び、ビルドアップフィルム

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5360840A (en) * 1992-12-29 1994-11-01 Hercules Incorporated Epoxy resin compositions with improved storage stability
MY130504A (en) * 1994-01-28 2007-06-29 Shell Int Research Epoxy resin hardener, epoxy resin composition, and epoxy resin hardening process
JP3497560B2 (ja) * 1994-04-27 2004-02-16 ジャパンエポキシレジン株式会社 変性エポキシ樹脂の製造方法と製造された変性エポキシ樹脂及びこのエポキシ樹脂の組成物
US5726257A (en) * 1994-08-30 1998-03-10 Sumitomo Chemical Company, Ltd. Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
TW475926B (en) * 1996-06-06 2002-02-11 Sumitomo Chemical Co Novel ester compound and thermosetting resin composition using the same
US6310147B1 (en) 1998-05-21 2001-10-30 Mitsui Chemicals, Inc. Epoxy-resin composition and use thereof
JP4797224B2 (ja) * 2000-04-25 2011-10-19 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP5011599B2 (ja) * 2000-05-23 2012-08-29 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置
JP2002012650A (ja) * 2000-06-30 2002-01-15 Dainippon Ink & Chem Inc 低誘電性材料用エポキシ樹脂組成物
JP4643000B2 (ja) * 2000-12-28 2011-03-02 三井化学株式会社 エステル基を有する化合物及びエポキシ樹脂組成物
JP4815725B2 (ja) * 2001-09-12 2011-11-16 Dic株式会社 電子材料用エポキシ樹脂組成物および低誘電性電子材料
JP4732168B2 (ja) * 2003-02-28 2011-07-27 株式会社クラレ 炭酸ガス吸収体及びその製造方法
JP5228853B2 (ja) * 2008-12-01 2013-07-03 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料およびそれらの製造方法
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법
WO2018008416A1 (fr) * 2016-07-06 2018-01-11 Dic株式会社 Composition d'ester actif, et produit durci de celle-ci
JP7024174B2 (ja) * 2016-08-26 2022-02-24 味の素株式会社 樹脂組成物
JP2020050793A (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JPWO2023021900A1 (fr) * 2021-08-20 2023-02-23

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778416A (en) * 1980-11-05 1982-05-17 Sumitomo Bakelite Co Ltd Thermosetting resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778416A (en) * 1980-11-05 1982-05-17 Sumitomo Bakelite Co Ltd Thermosetting resin composition

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018008415A1 (fr) * 2016-07-06 2018-01-11 Dic株式会社 Composition durcissable, et produit durci de celle-ci
JP6270091B1 (ja) * 2016-07-06 2018-01-31 Dic株式会社 硬化性組成物とその硬化物
US11053384B2 (en) 2016-07-06 2021-07-06 Dic Corporation Curable composition and cured product thereof
WO2019188332A1 (fr) * 2018-03-29 2019-10-03 Dic株式会社 Composition durcissable et produit durci associé
JPWO2019188332A1 (ja) * 2018-03-29 2021-03-11 Dic株式会社 硬化性組成物及びその硬化物
US11873356B2 (en) 2018-03-29 2024-01-16 Dic Corporation Curable composition and cured product thereof
JPWO2020145346A1 (ja) * 2019-01-10 2021-11-18 積水化学工業株式会社 エステル化合物、樹脂組成物、硬化物、及び、ビルドアップフィルム

Also Published As

Publication number Publication date
JPS6253327A (ja) 1987-03-09

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