JPH0482059B2 - - Google Patents
Info
- Publication number
- JPH0482059B2 JPH0482059B2 JP60097596A JP9759685A JPH0482059B2 JP H0482059 B2 JPH0482059 B2 JP H0482059B2 JP 60097596 A JP60097596 A JP 60097596A JP 9759685 A JP9759685 A JP 9759685A JP H0482059 B2 JPH0482059 B2 JP H0482059B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- weight
- silicon carbide
- thermal conductivity
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60097596A JPS61256658A (ja) | 1985-05-08 | 1985-05-08 | 電気絶縁性基板材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60097596A JPS61256658A (ja) | 1985-05-08 | 1985-05-08 | 電気絶縁性基板材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61256658A JPS61256658A (ja) | 1986-11-14 |
| JPH0482059B2 true JPH0482059B2 (enrdf_load_stackoverflow) | 1992-12-25 |
Family
ID=14196615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60097596A Granted JPS61256658A (ja) | 1985-05-08 | 1985-05-08 | 電気絶縁性基板材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61256658A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3756345B2 (ja) * | 1999-05-12 | 2006-03-15 | 住友大阪セメント株式会社 | 窒化アルミニウム基焼結体とその製造方法及びそれを用いたサセプター |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59111978A (ja) * | 1982-12-16 | 1984-06-28 | 株式会社東芝 | 電気絶縁性放熱基板材料 |
| JPS605551A (ja) * | 1983-06-23 | 1985-01-12 | Shinko Electric Ind Co Ltd | リ−ドフレ−ムの製造方法 |
| JPS6027653A (ja) * | 1983-07-21 | 1985-02-12 | 株式会社日立製作所 | セラミツク抵抗材料 |
| JPS6036376A (ja) * | 1983-08-08 | 1985-02-25 | 株式会社日立製作所 | 炭化ケイ素系抵抗材料及びその製造方法 |
-
1985
- 1985-05-08 JP JP60097596A patent/JPS61256658A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61256658A (ja) | 1986-11-14 |
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