JPH0481877B2 - - Google Patents

Info

Publication number
JPH0481877B2
JPH0481877B2 JP59129336A JP12933684A JPH0481877B2 JP H0481877 B2 JPH0481877 B2 JP H0481877B2 JP 59129336 A JP59129336 A JP 59129336A JP 12933684 A JP12933684 A JP 12933684A JP H0481877 B2 JPH0481877 B2 JP H0481877B2
Authority
JP
Japan
Prior art keywords
forming
conductor
metal film
metal
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59129336A
Other languages
English (en)
Japanese (ja)
Other versions
JPS618996A (ja
Inventor
Akira Tomizawa
Ataru Yokono
Osamu Myazawa
Minoru Tanaka
Takeshi Fujita
Akira Murata
Kazuo Hirota
Fusaji Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12933684A priority Critical patent/JPS618996A/ja
Publication of JPS618996A publication Critical patent/JPS618996A/ja
Publication of JPH0481877B2 publication Critical patent/JPH0481877B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12933684A 1984-06-25 1984-06-25 多層配線板の製造方法 Granted JPS618996A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12933684A JPS618996A (ja) 1984-06-25 1984-06-25 多層配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12933684A JPS618996A (ja) 1984-06-25 1984-06-25 多層配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS618996A JPS618996A (ja) 1986-01-16
JPH0481877B2 true JPH0481877B2 (OSRAM) 1992-12-25

Family

ID=15007085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12933684A Granted JPS618996A (ja) 1984-06-25 1984-06-25 多層配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS618996A (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736471B2 (ja) * 1989-03-29 1995-04-19 日本無線株式会社 多層基板の接合方法
JPH071830B2 (ja) * 1989-09-13 1995-01-11 日本無線株式会社 多層プリント配線基板の接続方法
US5171351A (en) * 1989-04-10 1992-12-15 Kyowa Hakko Kogyo Co. Preservative for plants comprising epoxy compounds
NZ233184A (en) * 1989-04-10 1991-10-25 Kyowa Hakko Kogyo Kk Preservative compositions for plants, fruits and vegetables comprising an olefin, pyridyl urea, epoxy compound, dipicolinic acid or an sh-reagent

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347927B2 (OSRAM) * 1973-06-08 1978-12-25
JPS544375A (en) * 1977-06-13 1979-01-13 Suwa Seikosha Kk Circuit substrate
JPS5446376A (en) * 1977-09-20 1979-04-12 Fujitsu Ltd Method of manufacturing multilayer printed board
JPS56150897A (en) * 1980-04-23 1981-11-21 Fujitsu Ltd Method of manufacturing multilayer printed board
JPS57109392A (en) * 1980-12-26 1982-07-07 Suwa Seikosha Kk Circuit mounting substrate
JPS58143559A (ja) * 1982-02-19 1983-08-26 Matsushita Electric Ind Co Ltd 多層構造半導体集積回路装置およびその製造方法

Also Published As

Publication number Publication date
JPS618996A (ja) 1986-01-16

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