JPH0481345B2 - - Google Patents

Info

Publication number
JPH0481345B2
JPH0481345B2 JP57117302A JP11730282A JPH0481345B2 JP H0481345 B2 JPH0481345 B2 JP H0481345B2 JP 57117302 A JP57117302 A JP 57117302A JP 11730282 A JP11730282 A JP 11730282A JP H0481345 B2 JPH0481345 B2 JP H0481345B2
Authority
JP
Japan
Prior art keywords
layer
type
forming
recess
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57117302A
Other languages
English (en)
Japanese (ja)
Other versions
JPS598374A (ja
Inventor
Daisuke Ueda
Hiromitsu Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP11730282A priority Critical patent/JPS598374A/ja
Publication of JPS598374A publication Critical patent/JPS598374A/ja
Publication of JPH0481345B2 publication Critical patent/JPH0481345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11730282A 1982-07-05 1982-07-05 縦型構造電界効果トランジスタの製造方法 Granted JPS598374A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11730282A JPS598374A (ja) 1982-07-05 1982-07-05 縦型構造電界効果トランジスタの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11730282A JPS598374A (ja) 1982-07-05 1982-07-05 縦型構造電界効果トランジスタの製造方法

Publications (2)

Publication Number Publication Date
JPS598374A JPS598374A (ja) 1984-01-17
JPH0481345B2 true JPH0481345B2 (fr) 1992-12-22

Family

ID=14708384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11730282A Granted JPS598374A (ja) 1982-07-05 1982-07-05 縦型構造電界効果トランジスタの製造方法

Country Status (1)

Country Link
JP (1) JPS598374A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4992228A (en) * 1989-09-28 1991-02-12 The Dow Chemical Company Method for preparing preforms for molding processes
US6603173B1 (en) 1991-07-26 2003-08-05 Denso Corporation Vertical type MOSFET
US5460985A (en) * 1991-07-26 1995-10-24 Ipics Corporation Production method of a verticle type MOSFET
US6015737A (en) * 1991-07-26 2000-01-18 Denso Corporation Production method of a vertical type MOSFET
US5427725A (en) * 1993-05-07 1995-06-27 The Dow Chemical Company Process for resin transfer molding and preform used in the process
TW297046B (fr) * 1993-06-15 1997-02-01 Dow Chemical Co
EP0676814B1 (fr) * 1994-04-06 2006-03-22 Denso Corporation Procédé de fabrication d'un dispositif semi-conducteur avec un sillon
AU706556B2 (en) * 1994-10-28 1999-06-17 Dow Chemical Company, The Improved process for resin transfer molding
JP3307785B2 (ja) * 1994-12-13 2002-07-24 三菱電機株式会社 絶縁ゲート型半導体装置
US5698318A (en) * 1995-05-23 1997-12-16 The Dow Chemical Company Process for resin transfer molding and formulations useful to practice it
JP3201221B2 (ja) * 1995-07-05 2001-08-20 日本電気株式会社 半導体装置の製造方法
JP5500002B2 (ja) 2010-08-31 2014-05-21 株式会社デンソー 炭化珪素半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125987A (en) * 1978-02-17 1979-09-29 Siliconix Inc Vmos metha structure and method of fabricating same
JPS55133574A (en) * 1979-04-05 1980-10-17 Nec Corp Insulated gate field effect transistor
JPS55134981A (en) * 1979-04-09 1980-10-21 Ibm Method of manufacturing semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125987A (en) * 1978-02-17 1979-09-29 Siliconix Inc Vmos metha structure and method of fabricating same
JPS55133574A (en) * 1979-04-05 1980-10-17 Nec Corp Insulated gate field effect transistor
JPS55134981A (en) * 1979-04-09 1980-10-21 Ibm Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS598374A (ja) 1984-01-17

Similar Documents

Publication Publication Date Title
US6188104B1 (en) Trench DMOS device having an amorphous silicon and polysilicon gate
US5915180A (en) Process for producing a semiconductor device having a single thermal oxidizing step
US5164325A (en) Method of making a vertical current flow field effect transistor
JP3217690B2 (ja) 半導体装置の製造方法
US5723376A (en) Method of manufacturing SiC semiconductor device having double oxide film formation to reduce film defects
US5883411A (en) Vertical insulated gate FET
JPH01253966A (ja) 縦型電界効果トランジスタ
JPH01192174A (ja) 半導体装置の製造方法
JPH06350090A (ja) 半導体装置の製造方法
JPH08274335A (ja) シリコンカーバイドmosfet
JPH0481345B2 (fr)
JP3369388B2 (ja) 半導体装置
JP2003188379A (ja) 半導体装置およびその製造方法
US6858499B2 (en) Method for fabrication of MOSFET with buried gate
US20200312997A1 (en) Semiconductor device
JPS61281556A (ja) 電気短絡部を形成する方法
JPH10125904A (ja) 炭化珪素半導体装置
JP3113425B2 (ja) 絶縁ゲート半導体装置およびその製造方法
EP0481965A2 (fr) Transistors à induction statique à grille isolée formée sur la paroi d'un sillon et leur procédé de fabrication
JPH08255902A (ja) 絶縁ゲート型半導体装置とその製造方法
JP4826036B2 (ja) 半導体装置の製造方法
JPH0669093B2 (ja) 半導体素子の製造方法
Kim et al. A novel process technique for fabricating high reliable trench DMOSFETs using self-align technique and hydrogen annealing
JPH0513758A (ja) Mosfet及びその製造方法
JP3048261B2 (ja) 半導体装置の製造方法