JPH0479137B2 - - Google Patents

Info

Publication number
JPH0479137B2
JPH0479137B2 JP57178858A JP17885882A JPH0479137B2 JP H0479137 B2 JPH0479137 B2 JP H0479137B2 JP 57178858 A JP57178858 A JP 57178858A JP 17885882 A JP17885882 A JP 17885882A JP H0479137 B2 JPH0479137 B2 JP H0479137B2
Authority
JP
Japan
Prior art keywords
insulating film
fuse
region
wiring
fuse wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57178858A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5968946A (ja
Inventor
Ryoichi Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57178858A priority Critical patent/JPS5968946A/ja
Publication of JPS5968946A publication Critical patent/JPS5968946A/ja
Publication of JPH0479137B2 publication Critical patent/JPH0479137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP57178858A 1982-10-12 1982-10-12 半導体装置 Granted JPS5968946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57178858A JPS5968946A (ja) 1982-10-12 1982-10-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57178858A JPS5968946A (ja) 1982-10-12 1982-10-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS5968946A JPS5968946A (ja) 1984-04-19
JPH0479137B2 true JPH0479137B2 (cs) 1992-12-15

Family

ID=16055911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57178858A Granted JPS5968946A (ja) 1982-10-12 1982-10-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS5968946A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146969U (ja) * 1983-03-23 1984-10-01 日本電気株式会社 半導体装置
JPS6334952A (ja) * 1986-07-29 1988-02-15 Nec Corp 半導体装置内の回路選択用ヒユ−ズ

Also Published As

Publication number Publication date
JPS5968946A (ja) 1984-04-19

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