JPH0478015B2 - - Google Patents
Info
- Publication number
- JPH0478015B2 JPH0478015B2 JP59096535A JP9653584A JPH0478015B2 JP H0478015 B2 JPH0478015 B2 JP H0478015B2 JP 59096535 A JP59096535 A JP 59096535A JP 9653584 A JP9653584 A JP 9653584A JP H0478015 B2 JPH0478015 B2 JP H0478015B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pin
- substrate
- semiconductor device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W70/635—
-
- H10W76/157—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59096535A JPS60241244A (ja) | 1984-05-16 | 1984-05-16 | ピングリッドアレイ型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59096535A JPS60241244A (ja) | 1984-05-16 | 1984-05-16 | ピングリッドアレイ型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60241244A JPS60241244A (ja) | 1985-11-30 |
| JPH0478015B2 true JPH0478015B2 (cg-RX-API-DMAC10.html) | 1992-12-10 |
Family
ID=14167813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59096535A Granted JPS60241244A (ja) | 1984-05-16 | 1984-05-16 | ピングリッドアレイ型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60241244A (cg-RX-API-DMAC10.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6292352A (ja) * | 1985-10-17 | 1987-04-27 | Tanaka Denshi Kogyo Kk | チツプオンボ−ドのリ−ドピン |
| JPH0777253B2 (ja) * | 1986-03-20 | 1995-08-16 | イビデン株式会社 | 半導体搭載用基板 |
| JPH0766953B2 (ja) * | 1986-09-11 | 1995-07-19 | イビデン株式会社 | 半導体搭載用基板 |
| JPH0815199B2 (ja) * | 1986-12-22 | 1996-02-14 | イビデン株式会社 | 半導体搭載用基板の製造方法およびそれに用いられる治具板 |
| JPH01117084A (ja) * | 1987-10-29 | 1989-05-09 | Nec Corp | プラスチックピングリッドアレイパッケージ |
| US5036431A (en) * | 1988-03-03 | 1991-07-30 | Ibiden Co., Ltd. | Package for surface mounted components |
| US5592025A (en) * | 1992-08-06 | 1997-01-07 | Motorola, Inc. | Pad array semiconductor device |
| KR20030004644A (ko) * | 2001-07-06 | 2003-01-15 | 홍성결 | 피지에이 패키지용 압착 리드핀 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48101878A (cg-RX-API-DMAC10.html) * | 1972-04-03 | 1973-12-21 | ||
| JPS509759U (cg-RX-API-DMAC10.html) * | 1973-05-24 | 1975-01-31 | ||
| US3890328A (en) * | 1974-03-08 | 1975-06-17 | Richardson Merrell Inc | N,N-dioxides of bis-basic cyclic ketones |
| JPS5256366A (en) * | 1975-11-04 | 1977-05-09 | Sony Corp | Method of conducting bothhside printed substrate |
| JPS5810848A (ja) * | 1981-07-14 | 1983-01-21 | Toshiba Corp | 混成集積回路用リ−ドピン |
| JPS58159355A (ja) * | 1982-03-17 | 1983-09-21 | Nec Corp | 半導体装置の製造方法 |
| JPS5982757A (ja) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | 半導体用ステムおよびその製造方法 |
-
1984
- 1984-05-16 JP JP59096535A patent/JPS60241244A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60241244A (ja) | 1985-11-30 |
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