JPH0475926B2 - - Google Patents

Info

Publication number
JPH0475926B2
JPH0475926B2 JP59259986A JP25998684A JPH0475926B2 JP H0475926 B2 JPH0475926 B2 JP H0475926B2 JP 59259986 A JP59259986 A JP 59259986A JP 25998684 A JP25998684 A JP 25998684A JP H0475926 B2 JPH0475926 B2 JP H0475926B2
Authority
JP
Japan
Prior art keywords
epoxy resin
type epoxy
bisphenol
weight
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59259986A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61138621A (ja
Inventor
Kunio Iketani
Toshuki Ootori
Yoshitake Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP59259986A priority Critical patent/JPS61138621A/ja
Publication of JPS61138621A publication Critical patent/JPS61138621A/ja
Publication of JPH0475926B2 publication Critical patent/JPH0475926B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP59259986A 1984-12-11 1984-12-11 エポキシ樹脂積層板の製造方法 Granted JPS61138621A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59259986A JPS61138621A (ja) 1984-12-11 1984-12-11 エポキシ樹脂積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59259986A JPS61138621A (ja) 1984-12-11 1984-12-11 エポキシ樹脂積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS61138621A JPS61138621A (ja) 1986-06-26
JPH0475926B2 true JPH0475926B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-02

Family

ID=17341691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59259986A Granted JPS61138621A (ja) 1984-12-11 1984-12-11 エポキシ樹脂積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS61138621A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745561B2 (ja) * 1986-08-18 1995-05-17 大日本インキ化学工業株式会社 エポキシ樹脂組成物
JPH0739463B2 (ja) * 1989-05-25 1995-05-01 三菱電機株式会社 積層板用樹脂組成物
JP4496591B2 (ja) * 2000-03-09 2010-07-07 住友ベークライト株式会社 エポキシ樹脂組成物、これを用いたプリプレグ及び積層板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585925B2 (ja) * 1978-07-23 1983-02-02 東邦ベスロン株式会社 炭素繊維プリプレグ用エポキシ樹脂組成物
JPS58167625A (ja) * 1982-03-26 1983-10-03 Toho Rayon Co Ltd プリプレグ
JPS58194916A (ja) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS5945325A (ja) * 1982-09-08 1984-03-14 Hitachi Chem Co Ltd 難燃性積層板の製造法

Also Published As

Publication number Publication date
JPS61138621A (ja) 1986-06-26

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