JPH0475316B2 - - Google Patents
Info
- Publication number
- JPH0475316B2 JPH0475316B2 JP60115391A JP11539185A JPH0475316B2 JP H0475316 B2 JPH0475316 B2 JP H0475316B2 JP 60115391 A JP60115391 A JP 60115391A JP 11539185 A JP11539185 A JP 11539185A JP H0475316 B2 JPH0475316 B2 JP H0475316B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nickel
- solution
- reaction
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60115391A JPS61276979A (ja) | 1985-05-30 | 1985-05-30 | ニッケルめっき材料の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60115391A JPS61276979A (ja) | 1985-05-30 | 1985-05-30 | ニッケルめっき材料の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61276979A JPS61276979A (ja) | 1986-12-06 |
| JPH0475316B2 true JPH0475316B2 (enrdf_load_stackoverflow) | 1992-11-30 |
Family
ID=14661385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60115391A Granted JPS61276979A (ja) | 1985-05-30 | 1985-05-30 | ニッケルめっき材料の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61276979A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6421082A (en) * | 1987-07-15 | 1989-01-24 | Nippon Chemical Ind | Production of powdery plated material |
| US5234558A (en) * | 1990-03-22 | 1993-08-10 | Canon Kabushiki Kaisha | Electrically conductive circuit member, method of manufacturing the same and electrically conductive paste |
| US5170009A (en) * | 1990-03-22 | 1992-12-08 | Canon Kabushiki Kaisha | Electrically conductive covers and electrically conductive covers of electronic equipment |
| US5186802A (en) * | 1990-03-22 | 1993-02-16 | Canon Kabushiki Kaisha | Electro-deposition coated member and process for producing it |
| US5676812A (en) * | 1990-03-24 | 1997-10-14 | Canon Kabushiki Kaisha | Electronic equipment with an adhesive member to intercept electromagnetic waves |
| CN103736994B (zh) * | 2014-01-15 | 2015-11-18 | 南京德磊科技有限公司 | 一种化学镀镍溶液的处理方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1403197A (en) * | 1971-09-30 | 1975-08-28 | Bell & Howell Co | Metal encapsulation |
| JPS56119703A (en) * | 1980-02-13 | 1981-09-19 | Matsushita Electric Ind Co Ltd | Production of nickel-coated finely grained particles |
| JPS6059070A (ja) * | 1983-09-12 | 1985-04-05 | Nippon Chem Ind Co Ltd:The | 粉粒体メツキ品の製造法 |
-
1985
- 1985-05-30 JP JP60115391A patent/JPS61276979A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61276979A (ja) | 1986-12-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |